臺灣博碩士論文加值系統

體聲波元件同時具備低損耗、可承受高功率、且容易與積體電路整合之特點，在高頻通訊系統上為一個相當重要的元件。本論文分析薄膜型體聲波元件之需求規格，並於目前商用軟體ADS 中建立不同材料聲波傳導之模型，進而設計微機電體聲波共振器。同時也建立了一個背向晶片乾蝕刻的微加工製程，完成體聲波共振器的製造。本文也利用了高頻測試的方式，驗證了共振器設計結果，測得共振器的品質因子大於 1000。在應用方面，本研究設計並製造了不同頻段的高頻濾波器，同時驗證了微小型的封裝。最後，本研究也嘗試了體聲波元件的整合，包括整合被動元件以製造體聲波雙工器，與整合 Bi-CMOS MEMS 可變電容來達到體聲波元件微調共振頻率之功能。本論文除了改善現有微機電體聲波元件製程與封裝方法外，更利用這些結果驗證了本文所提的設計平台。此一系統化的設計平台與設計流程未來可以作為完成薄膜型體聲波元件的重要基礎。

Bulk Film bulk acoustic devices have the advantages of low loss, high power duriability, and high compatibility with integrated circuits. This study will improve the performance of the bulk acoustic devices using MEMS technology, moreover, this study also analyzes the requirement of film bulk acoustic devices and build acoustic models in commercial microwave software ADS. Resonators are designed by this model to meet required specifications. This study has developed a dry etching process to fabricate the resonator. The measured quality factor of this resonator is over 1000. Filters and its miniaturized packaging method are studied and verified. Moreover, this research also investigates on integration of bulk acoustic resonators with passive elements, such as inductors, capacitors, and Bi-CMOS MEMS varactors. In summary, this thesis not only improves the fabrication and packaging process of FBAR devices, but also provides a verified design plateform. This developed model and systematic design methodlogy are the foundation for future bulk acoustic devices.

摘要 2
目錄 6
圖目錄 8
表目錄 12
一、引言 13
1.1研究動機 13
1.2文獻回顧 15
1.2.1體聲波元件之原理與製程 16
1.2.2體聲波元件之設計模擬方式 18
1.2.3體聲波元件之封裝方式 20
1.2.4體聲波元件之應用 21
1.3研究目標 22
1.4 本文架構 23
二、微型體聲波元件之設計 27
2.1微型體聲波共振器之設計 27
2.1.1體聲波共振器之原理 28
2.1.2體聲波共振器之模型 32
2.1.3設計與模擬 37
2.2微型體聲波濾波器的設計 40
2.2.1微型體聲波濾波器的原理 41
2.2.2微型體聲波濾波器的設計 42
2.3 小結 46
三、微型體聲波共振器之製造 68
3.1利用背後濕蝕刻製程製作的薄膜型體聲波元件 68
3.1.1製程構想與製程流程 68
3.1.2製程結果、量測與分析 69
3.2利用低聲阻抗反射層製作的薄膜型體聲波元件 70
3.2.1製程構想與製程流程 71
3.2.2製程結果、量測與分析 73
3.3利用深蝕刻製作的薄膜型體聲波元件 73
3.3.1製程構想與製程流程 74
3.3.2製程結果、量測與分析 75
3.4 小結 77
四、微型體聲波濾波器之製造與封裝 94
4.1微型體聲波濾波器的製造 94
4.2微型體聲波元件之封裝 95
4.2.1體聲波元件封裝之方式 95
4.2.2 晶圓接合封裝之製程 98
4.2.3製程結果與分析 100
4.2.4高頻測試結果 102
4.3 小結 104
五、微型體聲波元件的整合 123
5.1 微型體聲波雙工器 123
5.1.1體聲波雙工器簡介 123
5.1.2體聲波雙工器之設計 124
5.1.3 體聲波雙工器製程流程與結果 128
5.1.4高頻測試與分析 129
5.2微型體聲波元件之微調 130
5.2.1 微型體聲波元件微調頻率之方法 130
5.2.2 整合體聲波元件與CMOS-MEMS可變電容 131
5.2.3 整合體聲波元件與CMOS-MEMS可變電容之分析 137
5.3 小結 138
六、結論 161
6.1 研究成果 161
6.2 未來工作 162
參考文獻 164

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