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研究生:黃建元
研究生(外文):Chien-Yuan Huang
論文名稱:異方性導電膜在覆晶軟膜接合技術之機械性質與可靠度測試之研究
論文名稱(外文):Mechanical properties and reliability test of anisotropic conductive film in flip-chip-on-flex packaging
指導教授:葉銘泉葉銘泉引用關係
指導教授(外文):Ming-Chuen Yip
學位類別:碩士
校院名稱:國立清華大學
系所名稱:動力機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2006
畢業學年度:94
語文別:中文
論文頁數:73
中文關鍵詞:異方性導電膜彎矩測試剪力測試可靠度測試
外文關鍵詞:anisotropic conductive film (ACF)reliabilitybending testshear test
相關次數:
  • 被引用被引用:6
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  • 下載下載:89
  • 收藏至我的研究室書目清單書目收藏:1
隨著可攜式消費性電子產品的增加,封裝體的體積日益減小,具細導線間距、無鉛、低溫製程等優點的異方性導電膠膜愈來愈受到重視。
本文是利用真實IC晶片以異方性導電膠膜,利用相同製程參數貼附在PI軟膜上,將整個結構體置於不同溫濕環境及熱循環作用下,於常溫進行接觸電阻值量測與剪力測試;另外在利用不同測試環境溫度下,與不同之頻率進行整個結構體的四點彎矩疲勞測試。
實驗結果發現,經過環境時效作用後的接觸電阻值並不會有改變,但在時效作用初期剪力強度會增加,經過250小時或100次熱循環後,其強度趨於穩定;在彎矩疲勞壽命方面,隨溫度升高,疲勞壽命值迅速減少,其中以測試頻率較低的,其變化幅度較大,而測試環境之溫度對於接觸電阻值之特性會有影響。
With the increasing of portable consumer electrical products, the volume of packaging is decreasing. Packaging by anisotropic conductive film (ACF) have paid much attention to its fine pitch, lead free and low temperature manufacture process.
We use real IC mounted on PI film by ACF. Then put the specimens aging in different temperatures, high humidity and thermal cycles. After that, we measure the variation of contact resistances and shear strengths of them. On the other hand, the specimens are under both different temperature and frequency by four-point bending fatigue test.
We've found that the contact resistances are without changing after environmental aging. But the shear strengths will grow up at the beginning, then decrease to a stable value after 250 hours or 100cycles. In bending test, when test environment temperature increase, fatigue life of low frequency decay faster than high frequency, and the contact resistance will be affected by temperature.
目錄................................................. .I
表目錄................................................III
圖目錄................................................IV
第一章 導論...........................................1
1-1 電子封裝概述......................................1
1-2 覆晶封裝..........................................1
1-3 異方性導電膜......................................2
1-4 軟板承載晶粒(Chip on Film/Flex, COF)............3
第二章 研究動機.......................................5
第三章 文獻回顧.......................................7
3-1 可靠度測試........................................7
3-1.1 週期性的溫度變化測試............................7
3-1.2 高溫環境測試....................................8
3-1.3 潮溼環境測試....................................9
3-2 剪力測試..........................................10
3-3 彎矩測試..........................................11
3-4 接觸電阻..........................................11
第四章 研究方法.......................................14
4-1 儀器設備..........................................14
4-1.1 Instron-8848微拉伸試驗機........................14
4-1.2恆溫恆溼測試機...................................15
4-1.3溫度控制烘箱.....................................15
4-1.4溫度/溼度控制箱..................................15
4-1.5 溫度循環試驗機..................................16
4-1.6可程式歐姆計.....................................16
4-1.7光學金相顯微鏡...................................16
4-1.8研磨/拋光機......................................16
4-1.9超音波洗淨器.....................................16
4-2 試片製作與規格....................................17
4-3 實驗方法..........................................18
4-3.1 剪力測試........................................18
4-3.2 彎矩測試........................................19
第五章 結果與討論.....................................21
5.1 純凸塊接合........................................21
5-2 接觸電阻..........................................22
5-3 剪力測試..........................................23
5-4 彎矩測試..........................................25
5-4.1 靜態彎矩測試....................................25
5-4.2 彎矩疲勞測試....................................26
第六章 結論與未來展望.................................29
6-1 結論..............................................29
6-1.1 接觸電阻........................................29
6-1.2 剪力測試........................................29
6-1.3 彎矩測試........................................30
6-2 未來展望..........................................30
參考文獻..............................................31
附表..................................................36
附圖..................................................43
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