|
[1]王美珍,產業報告:2005年連接器產業展望,金鼎投資雜誌月刊, 民國93年。 [2]R.W. Knight, J.S. Goodling and B.E. Gross, “Optimal thermal design of air cooled forced convection finned heat sinks – experimental verification,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.15, pp.754-760, 1992 [3]R.W. Knight, D.J. Hall, J.S. Goodling, and R.C. Jaeger, “Heat sink optimization with application to microchannels,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, pp.832-842, 1992. [4]K. Azar, R.S. McLeod and R. E. Caron, “Narrow channel heat sink for cooling of high powered electronic components,” The 8th IEEE SEMI-THERMTMSymposium, pp.12-19, 1992. [5]S. Lee, “Optimum design and selection of heat sinks,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, pp.812 -817, 1995. [6]O. Braunshtein, H. Kalman and A. Ullmann, “Performance and optimization of composed fin arrays,” Heat Transfer Engineering, Vol. 15, pp.4-12, 2004. [7]J.R. Culham and Y.S. Muzychka, “Optimization of plate fin heat sinks using entropy generation minimization,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, pp.159 -165, 2001. [8]M. Iyengar and A. Bar-Cohen, “Least-energy optimization of forced convection plate-fin heat sinks,” IEEE Transactions on Components and Packaging Technologies, Vol.26, pp.62-70, 2003. [9]C.L. Chapman, S. Lee and B.L. Schmidt, “Thermal performance of an elliptical pin fin heat sink,” The 15th IEEE SEMI-THERMTMSymposium, pp.24-31, 1994. [10]P. Teertstra, M.M. Yovanovich and J.R. Culham, “Analytical forced convection modeling of plate fin heat sinks,” Tenth IEEE SEMI-THERMTMSymposium, pp.34-41, 1999. [11]M. Saini and R.L. Webb, “Heat rejection limits of air cooled plane fin heat sinks for computer cooling,” IEEE Transactions on Components and Packaging Technologies, Vol.26, pp.71-79, 2003. [12]H. Iwasaki and M. Ishizuka, “Forced convection air cooling characteristics of plate fins for notebook personal computers,” IEEE Inter Society Conference on Thermal Phenomena, pp.21-26, 2000. [13]C.K. Loh, D. Nelson and D.J. Chou, “Optimization of heat sink design and fan selection in portable electronics environment,” 2002. http://www.enertron-inc.com/PDF/FAN%20HEAT%20SINK%20Optimization.PDF [14]J.A. Visser, D.J. de Kock and F.D. Conradie, “Minimisation of heat sink mass using mathematical optimisation,” Sixteenth IEEE SEMI-THERMTMSymposium, pp.252-259, 2000. [15]C.H. Huang, I.C. Yuan and H. Ay, “A three-dimensional inverse problem in imaging the local heat transfer coefficients for plate finned-tube heat exchangers,” International Journal of Heat and Mass Transfer, Vol.46,pp.3629–3638, 2003. [16]W.B. Krueger and A. Bar-Coben, “Optimal numerical design of forced convection heat sinks,” IEEE Transactions on Components and Packaging Technologies, Vol.27, pp.417-425, 2004. [17]C.H. Cheng and M.H. Chang,“A simplified conjugate-gradient method for shape identification based on thermal data”, Numerical Heat Transfer, Part B, Vol. 43, pp. 1-19, 2003. [18]CFD Research Corp.,CFDRC USER Manual, 2006. [19]J.P. van Doormaal, and G.D. Raithby, “Enhancements of the SIMPLE method for predicting incompressible fluid flows,” Numerical Heat Transfer, Vol.7, pp. 147-163, 1984. [20]M.R. Hestenes and E. Stiefel, “Methods of conjugate gradients for solving linear systems,” NBS Res. J., Vol.49, pp.409-436, 1952. [21]R. Fletcher and C.M. Reeves, “Function minimization by conjugate gradients,” Computer J., Vol.7, pp.149-154, 1964. [22]I. Fried and J. Metzler, “SOR vs conjugate gradients in a finite element discretization,” Int. J. Numerical Methods Eng., Vol.12, pp.1329-1342, 1978. [23]G.V. Reklaitis, A. Ravindran and K.M. Ragsdell, Engineering optimization-methods and applications, John Wiley & Sons, 1983.
|