臺灣博碩士論文加值系統

有機薄膜電晶體有大面積、低成本製造與可撓的特性。然而，現今有機薄膜電晶體的載子遷移率依然過低，例如以高分子材料為主動層的元件，其載子遷移率大約皆小於1 cm2/Vs，因此限制了有機薄膜電晶體的應用範圍。
本實驗室於去年提出以”控制聚合成長” (CEP) 的方法來製作有機薄膜電晶體的主動層，本文以去年在SPAN材料上實驗成果為基礎，將”控制聚合成長”的方法引用至目前最為廣泛研究的P3HT材料上進行研究，探討此方法的可行性，並針對所電聚合出的P3HT高分子進行光譜、表面形貌與電性上的量測; 不幸的，以”控制聚合成長”的方法來製作有機薄膜電晶體時，會有殘餘電解質的影響，使得以CEP方式製作成的電晶體會有化學摻雜的問題，而失去原本場效應的特性。
在做去離子摻雜的過程中，我們發現了一種低溫去水氣的方法，能取代傳統使用熱處理的方式去除P3HT有機薄膜電晶體中水氣造成的摻雜問題。

Organic thin film transistors (OTFTs) have a great potential for future electronics due to its possible benefits of large-area, low-cost manufacture, and flexible devices. However, the carrier mobilities of all reported OTFTs are still too low for most practical applications. For example, the highest carrier mobilities of polymeric OTFTs is even less than 1 cm2/Vs, the average mobility of amorphous-silicon TFTs.
In last year, a new approach named the “Controlled Electrical Polymerization (CEP)” was proposed by our group using the conjugated polymer, SPAN (Sulfonated Polyaniline). In this thesis, we tried to extend the CEP method to the most common used conjugated polymer P3HT (poly(3-hexylthiophene)) and conduct a full scale study of the CEP method. The surface morphology, optical and electric properties of CEP fabricated OTFTs were characterized and investigated. Unfortunately, because of the residual electrolyte from the polymerization, the CEP fabricated P3HT devices behave more like chemical doped TFTs than the desired field effect TFTs.
Besides, we proposed a new method to remove the moisture from organic materials at room temperature. Because of the room temperature operation, the proposed method will prove to be useful when the conventional removal of moisture by external heating is prohibited.

目錄
第一章 緒論 1
1-1. 研究動機與目的 1
1-2. 研究方法 2
1-3. 貢獻 3
第二章 文獻回顧 4
2-1. 電晶體操作模式與載子遷移率的計算方法 4
2-1-1. 有機薄膜電晶體操作模式 4
2-1-2. 載子遷移率的計算方法 5
2-1-3. 電化學摻雜遷移率 9
2-2. 文獻回顧 10
第三章 可控制之電聚合 14
3-1. 電場控制聚合成長(CEP)概念 14
3-2. 電化學聚合P3HT的原理 15
第四章 實驗結果與討論 16
4-1. 實驗概觀 16
4-2. 實驗設備與材料 17
4-3. 實驗0 先前準備工作 18
4-4. 實驗1 電場控制聚合成長 20
4-4-1. 實驗目的 20
4-4-2. 實驗設計 20
4-4-3. 預期成果 21
4-4-4. 結果與討論 21
4-5. 實驗2 UV-VIS與FTIR量測 22
4-5-1. UV-VIS量測 22
4-5-1-1. 實驗目的 22
4-5-1-2. 實驗設計 22
4-5-1-3. 預期成果 22
4-5-1-4. 結果與討論 22
4-5-2. FTIR量測 24
4-5-2-1. 實驗目的 24
4-5-2-2. 實驗設計 24
4-5-2-3. 預期成果 24
4-5-2-4. 結果與討論 25
4-6. 實驗3 SEM與AFM表面形貌量測 26
4-6-1. 實驗目的 26
4-6-2. 實驗設計 26
4-6-3. 預期成果 26
4-6-4. 結果與討論 27
4-7. 實驗4 半導體特性量測 35
4-7-1. 實驗目的 35
4-7-2. 實驗設計 35
4-7-3. 預期成果 36
4-7-4. 結果與討論 36
4-8. 實驗5 去離子摻雜 38
4-8-1. 實驗目的 38
4-8-2. 實驗設計 38
4-8-3. 預期成果 38
4-8-4. 結果與討論 38
4-9. 實驗6 電化學摻雜遷移率 40
4-9-1. 實驗目的 40
4-9-2. 實驗設計 40
4-9-3. 預期成果 40
4-9-4. 結果與討論 40
第五章 低溫去水氣製程於有機薄膜電晶體之應用 44
5-1. 前言 44
5-2. 原理 44
5-3. 實驗方式 45
5-4. 實驗結果與討論 45
5-5. 結論與改善 46
5-6. 結論 47
5-7. 未來工作 47
文獻 48
附錄A 56
附錄B 60

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