臺灣博碩士論文加值系統

射出成型技術是最廣泛用於工業塑膠加工的方法。傳統射出成型品質不易控制，其困難在於改變射出成品品質的因素太多，如溫度、壓力、 保壓切換、塑料特性等等，任何一項因素的小小改變，都可能會導致射出產品的失敗，使得射出成型工程師常常為了調校射出機最佳的參數而大費周章。為了解決上述問題，必須發展具有線上監控系統並能調整適當參數的射出成型機。
本論文研究的目的在於發展『微機電感測器嵌入模仁應用於射出成型之溫度監控』，以便實際感測模具之模仁(core and cavity)溫度，再將感測得知的訊號回授到射出成型機的控制器，以達到最佳化控制射出成型參數，提高產品良率及品質。微機電感測器較傳統感測器，具有體積小、響應速度快的優點，有利於我們嵌入溫度感測器於模具內部。因此我們利用現有的半導體製程技術，製作新型之微機電溫度感測器，經溫度校正過後可使得量測更精準。於內文中有詳述嵌入微機電感測器過程及方法，以便為了可實際即時量測射出成型過程。在量測的過程中，我們同時也嵌入Ｋislter感測器(6195A)，同時比較量測結果，以確保量測溫度的精準度。此論文中所嵌入的方式為非接觸模流式的嵌入法，並推導熱傳公式修正誤差，精密的量測到射料的溫度，在模具裡的分布情形。檢測所得的資訊可以回授到射出成型機上，作為適當調整所需的參數依據，以達到自動化控制射出成型之溫度，可大量減少成品的不良率並增進成品的品質和精確度。

針對量測模仁於射出成型時的溫度變化問題，本論文藉由模流軟體(Moldflow)及實驗量測數據來比較模擬溫度與實際溫度的差異性，並驗證是否能實現溫度感測器於射出成型之線上監控，以幫助塑膠模具業者提升競爭力。

Traditional approaches that adjust injection molding parameters are either by manual from the engineer’s experience or by experiments try and errors. Engineers should spend a long time on the adjustment for a set of parameters (pressure, temperature, etc.) suitable for the material and mold. For this reason, an on-line monitoring system is necessary to be developed for adjusting the optimal parameters in the manufacturing process.
The objectives of this thesis are to develop MEMS based microsensors for monitoring temperature inside core and cavity of intelligent mold. MEMS based microsensors are robust, versatile and easy to use for laboratory and industrial experiments. Therefore, the microsensors can provide accurate temperature measurement for on-line monitoring the temperature of the mold’s core and cavity. We have successfully designed and fabricated the MEMS-based temperature sensor, which can make accurate temperature measurement after calibration. During the direct rapid tooling process, the micro temperature sensor has been embedded into the core and cavity of the injection mold. The embedded temperature sensor can measure the local temperature variation during the injection, holding and cooling process. For calibrating the micro temperature sensor ,a commercial temperature sensor (6195A, Kistler) was attached to the injection mold. Temperature field modeling has been performed using the Moldflow software, and the simulation results during injection molding process are discussed. The MEMS-based microsensors can improve the problems of existing temperature sensors embed in the mold.
The differentiations of simulate data and factual data are proofed the on-line monitor accomplishment using MEMS-based temperature microsensors embed in the mold. It will improve industrial competition in injection molding field.

中文摘要 I
Abstract III
誌 謝 IV
Table of Contents VI
List of Figures VIII
List of Tables XI
Chapter 1 Introduction 1
1.1 Motivation 1
1.2 Objectives 2
1.3 Injection Molding Process Control 3
1.3.1 Injection Molding Machine 4
1.3.2 Phases of Injection Molding Machine 6
1.4 Micro-Electro-Mechanical System 7
1.5 Thesis Organization 9
Chapter 2 Literatures Review 11
2.1 On-line Monitoring of the Injection Molding Process Automation 11
2.1.1 Traditional Sensor System 11
2.1.2 On-line Ultrasonic Monitoring 13
2.1.3 A Process Monitoring and Control System 16
2.1.4 Kistler Embedded Pressure and Temperature System 17
2.1.3 Temperature Measurements of Injected Thermoplastic Parts 21
2.2 MEMS-Based Micro Sensor 22
2.2.1 Micro Pressure Sensor System 22
2.2.2 Micro Temperature Sensor System 26
Chapter 3 Design and Fabrication of the Micro Temperature Sensors 34
3.1 Characteristics of Micro Temperature Sensors 34
3.2 Experimental Equipments 36
3.2.1 Process Equipments 36
3.2.2 Calibration Equipments 41
3.3 Fabrication Process 43
3.3.1 Mask Design 44
3.3.2 Wafer Clean Process 47
3.3.3 Deposition Process 48
3.3.4 Ion Implantation and Annealing Process 48
3.3.5 Photolithography and Etching Process 49
3.3.6 Photolithography, Metal Sputtering and Lift-off 52
3.3.7 Dicing and Wire Bonding 56
Chapter 4 Core and Cavity with Embedded Sensors 58
4.1 The Process of Embedded Sensors 58
4.2 The Architecture of Experimental Setting 63
4.2.1 Operation of Injection Molding Machine 65
4.3 Simulations of the Embedded Sensors in the Mold 66
4.4 Temperature Field Modeling 67
Chapter 5 Experimental Results 72
5.1 Embed MEMS-Based Microsensors in Core and Cavity 72
5.2 Simulations of Moldflow during Injection Molding Process 77
5.3 Temperature Monitoring of Injection Molding Process 79
5.4 Computed vs. Experiment Results 82
Chapter 6 Conclusions and Contributions 83
References 85

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