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研究生:高崧堯
研究生(外文):Sung-Yao Kao
論文名稱:3C電子產品研發能力度模式之建立與使用
論文名稱(外文):Establishing a Capability Model for 3C Electrical Product Research and Development Management
指導教授:陳仲儼陳仲儼引用關係
指導教授(外文):Chung-Yang Chen
學位類別:碩士
校院名稱:長庚大學
系所名稱:資訊管理研究所
學門:電算機學門
學類:電算機一般學類
論文種類:學術論文
論文出版年:2006
畢業學年度:95
語文別:中文
論文頁數:127
中文關鍵詞:產品研發能力度軟硬體成熟度供應商能力度適用性能力成熟度整合模式流程專注
外文關鍵詞:3CProduct ResearchCapabilityCMMIProcess Focus
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「能力成熟度整合模式」(Capability Maturity Model Integration;簡稱CMMI)是自1986年之CMM(Capability Maturity Model)歷經二十年沿革之後所發展出。CMMI意涵與適用性,可用於系統工程、軟體工程、軟硬體系統整合、產品與流程整合開發、供應商管理等應用領域之上。因此本研究希望以應用CMM(Capability Maturity Model)的精神及其連續式表述規範(CMMI-SE/SW/IPPD/SS,V1.1)為基礎,建立一套結合3C電子產品研發概念的能力度模式,透過包括特定目標與執行方法,一般目標與執行方法,希望藉由執行此能力度模式,使電子產品在研發的過程中的品質能加以控制,並以一實際案例來輔助說明及確認所提之模式構想。
Capability Maturity Model Integration (CMMI) was developed from Capability Maturity Model (CMM) in 1986. The intent of CMMI is to provide a CMM that covers products and service development and maintenance but also provides an extensible framework so that new bodies of knowledge can be added. Currently, four bodies of knowledge are available when planning software process improvement using CMMI: 1.System engineering 2.Software engineering 3.Integrated product and process development 4.Supplier souring. In this paper, we hope to build a CMM model which combines the concept of research and development of the 3C electrical product base on the spirit of CMM/CMMI, through Specific Goals, Specific Practices, General Goals and General Practices. It is hope to make the quality of the process of research and development can be controlled and stable. Finally, an instance as a real enterprise case is conducted and provided for explaining the proposed work and proof.
第一章、緒 論
1.1 背景................................................................................................................1
1.1.1 組織創新與產品研發的關係.....................................................................1
1.1.2 3C電子產品研發之概念............................................................................2
1.1.3 CMM之背景...............................................................................................3
1.1.4 CMMI之背景..............................................................................................3
1.2 研究動機........................................................................................................4
1.3 研究目的........................................................................................................5
1.4 預期效益........................................................................................................5
1.5 預行之驗證....................................................................................................5
1.6 範圍與假設....................................................................................................8
第二章、文獻探討
2.1 流程專注.....................................................................................................9
2.1.1 流程管理.....................................................................................................9
2.1.2 品質管理系統.............................................................................................9
2.2 3C電子產品研發........................................................................................10
2.2.1 3C電子產品生命週期................................................................................11
2.2.2 3C電子產品研發的四個特性....................................................................13
2.2.3 產品品質....................................................................................................16
2.2.4 3C電子產品研發模式................................................................................17
2.2.5 研發管理.....................................................................................................18
2.2.6 研發人員之設計概念與產品意識.............................................................20
2.3 CMM與CMMI............................................................................................21
2.3.1 CMM與CMMI之發展與沿革....................................................................21
2.3.2 CMMI之架構與內容..................................................................................23
2.3.3 CMMI之相關術語......................................................................................26
2.3.4 CMMI之結構..............................................................................................28
第三章、研究方法
3.1 3C電子產品研發能力度模式之核心活動.................................................34
3.2 3C電子產品研發能力度模式之層級定義.................................................35
3.3 3C電子產品研發能力度模式之架構描述.................................................36
3.4 3C電子產品研發能力度模式之專有名詞介紹.........................................37
3.5 特定目標(SG)及特定執行方法(SP)之展開..............................................38
3.5.1 3C電子產品研發能力度各SG與SP之相對關係.......................................40
3.5.2 特定目標(SG)及特定執行方法(SP)之內容..............................................41
3.5.2.1 (SG1)企劃機種模組化規格....................................................................41
(SP1.1-1)分析規格可行性策略...............................................................42
3.5.2.2 (SG2)評估研發組件架構........................................................................43
(SP2.1-1)開發工業設計造型...................................................................43
(SP2.2-1)確認專案計劃書........................................................................44
3.5.2.3 (SG3)研發工程組件推展........................................................................45
(SP3.1-1)展開與研討產品設計................................................................45
(SP3.2-3)製作機型樣品............................................................................46
(SP3.3-2)研發技術文件建構....................................................................47
3.5.2.4 (SG4)試作單機規格電性評估................................................................48
(SP4.1-1)完成試作報告及試產BOM(Bill of material)發行....................49
(SP4.2-3)轉移技術....................................................................................50
(SP4.3-2)設計機構包裝............................................................................51
(SP4.4-3)準備試產材料,測試程式、治具...............................................51
3.5.2.5 (SG5)試產機型設變品質評估................................................................52
(SP5.1-1)試產檢討會與設變修正............................................................53
(SP5.2-2)設備建立生產/品管資料及生產治具.......................................54
(SP5.3-2)追蹤成本....................................................................................55
(SP5.4-3)舉辦產品發表會........................................................................57
3.5.2.6 (SG6)量產機種產能品質標準................................................................59
(SP6.1-1)檢討產品設計品質....................................................................59
(SP6.2-3)檢討產品生產品質....................................................................61
(SP6.3-3)檢討客訴....................................................................................62
3.6 一般目標(GG)及一般執行方法(GP)之展開與說明.................................64
3.7 3C電子產品研發流程領域與CMMI流程領域之互動(從工程類別流程領
域來看)..........................................................................................................68
3.8 3C電子產品研發流程領域與CMMI流程領域之互動(從專案管理類別流程領域來看)..................................................................................................71
3.9 3C電子產品研發流程領域與CMMI流程領域之互動(從支援類別流程領
域來看)..........................................................................................................72
第四章、企業個案研討(以電腦伺服器為例)
4.1 企業簡介.....................................................................................................75
4.2 3C電子企業實務電子產品開發流程與本研究特定目標對照................76
4.2.1 PIID展現.....................................................................................................78
4.3 企業於伺服器產品企劃階段.....................................................................80
4.3.1 企業原本執行方式.....................................................................................81
4.3.2 採取3C電子產品研發能力度之執行方式................................................82
4.4 企業於伺服器產品規劃設計階段.............................................................83
4.4.1 企業原本執行方式.....................................................................................84
4.4.2 採取3C電子產品研發能力度之執行方式................................................85
4.5 企業於伺服器產品執行設計階段.............................................................88
4.5.1 企業原本執行方式.....................................................................................88
4.5.2 採取3C電子產品研發能力度之執行方式................................................89
4.6 企業於伺服器產品進行試作階段.............................................................93
4.6.1 企業原本執行方式.....................................................................................93
4.6.2 採取3C電子產品研發能力度之執行方式................................................94
4.7 企業於伺服器產品進行試產階段.............................................................98
4.7.1 企業原本執行方式.....................................................................................98
4.7.2 採取3C電子產品研發能力度之執行方式................................................99
4.8 企業於伺服器產品進行量產階段...........................................................105
4.8.1 企業原本執行方式...................................................................................105
4.8.2 採取3C電子產品研發能力度之執行方式..............................................106

第五章、分析與驗證
5.1 信度分析說明...........................................................................................112
5.2 執行驗證...................................................................................................113
5.3 驗證討論...................................................................................................116
第六章、結論與未來研究建議
6.1 結論...........................................................................................................118
6.2 未來研究建議...........................................................................................119
參考文獻........................................................................…...........................…....…120
附錄:執行驗證之專家問卷內容...........................................................................125
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