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研究生:陳景聰
研究生(外文):Ching-Tsung Chen
論文名稱:積體電路測試之實務分析與研究
論文名稱(外文):The Practical Analysis and Research of Integrated Circuit Testing
指導教授:陳仁德陳仁德引用關係
指導教授(外文):Ren-Der Chen
學位類別:碩士
校院名稱:長庚大學
系所名稱:電機工程研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2007
畢業學年度:95
語文別:中文
論文頁數:73
中文關鍵詞:積體電路測試測試工程直流測試元件特性
外文關鍵詞:IC testingtest engineeringDC testdevice characterization
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隨著元件圖形尺寸的縮小及單位面積晶片密度的增加,積體電路測試對整體半導體工業來說扮演著越來越重要的角色。測試已經從最後製造的角色演變為最初設計的角色。測試工程對積體電路製造過程而言,已成為不可或缺的一環。
什麼是測試? 測試就是晶片能夠符合品質的一個標準與規格。測試的目的就是要檢驗待測物是否能夠符合規格。因為積體電路的複雜度與日俱增,相對的測試成本對整個元件製造過程所佔的比重也越來越高。“如何精確又便宜的測試元件?”已成為一個重要的課題。
本篇論文有系統地探討了測試流程與測試方法,其中包含了直流測試,功能測試,與測試目的之設計。最後實驗結果舉出二個實務案例, 案例一詳細列出實際測試程式開發流程,從最初負載電路板的設計製作到最後測試計劃與實現。案例二則表現出在不同溫度下元件特性實務分析。
With the increasing circuit complexity and IC density, testing has played a more and more important role for the semiconductor industry. Testing has shifted from the final fabricated IC stage to the design stage. In any event, test engineering is an indispensable part of the IC manufacturing process.
What is testing? Testing means a standard or criteria by which the quality of the chip conforms to. The objective of testing is to check whether the device meets the design specification or not. As the complexity of IC increasing, the cost of testing usually takes up a relatively high percentage of the total IC manufacturing cost. “How to test the device cheaply and accurately?” becomes one important topic.
This paper performs a detailed view of the testing process and discusses different types of testing methods including DC test, function test, and design for test systematically. Finally experimental results present two cases study. Case 1 performs the detailed practical flow of one test program development from the first load board design to the final test program implement. Case 2 presents the device characterization under different temperatures.
Contents
指導教授推薦書 i
口試委員會審定書 ii
國家圖書館授權書 iii
長庚大學博碩士論文著作授權書 iv
誌謝 v
Abstract vi
(Chinese)
Abstract vii
(English)
Contents viii
List of Figures x
List of Tables xii
Chapter 1 Introduction 1
1.1 Motivation……………………………………………………………………………1
1.2 Thesis organization………………………………………………………………2
CHAPTER 2 Testing Process Flow 3
2.1 Backend production flow…………………………………………………3
2.2 Automated testing…………………………………………………………5
2.2.1 Automatic test equipment……………………………………… 5
2.2.2 Wafer prober………………………………………………………… 7
2.2.3 Handler………………………………………………………………… 8
2.3 Test Fixtures…………………………………………………… …………9
2.3.1 Probe card…………………………………………………………… 9
2.3.2 Load board………………………………………………………… 11
2.4 Test Program……………………………………………………………… 13
CHAPTER 3 DC and Parametric Test 15
3.1 Continuity test………………………………………………………… 15
3.2 Power continuity test………………………………………………… 17
3.3 Input leakage test (IIL/IIH test)……………………………… 18
3.4 Tristate leakage test (IOZL/IOZH test)……………………… 21
3.5 Output voltage test (VOL/IOL,VOH/IOH test)………………… 23
3.6 Power current test (IDD test)…………………………………… 24
3.7 IDDQ test………………………………………………………………… 26
CHAPTER 4 Functional Test and Design for Test 28
4.1 Functional test………………………………………………………… 28
4.2 Faults……………………………………………………………………… 32
4.3 Design for test………………………………………………………… 33
4.3.1 Scan test…………………………………………………………… 34
4.3.2 JTAG test…………………………………………………………… 37
4.3.3 BIST test…………………………………………………………… 39
CHAPTER 5 Experimental Results 41
5.1 Test program development flow…………………………………… 41
5.2 Troubleshooting flow………………………………………………… 43
5.3 Debug tool of the ATE………………………………………………… 44
5.3.1 Shmoo plots………………………………………………………… 44
5.3.2 Digital waveform display tool…………………………………46
5.3.3 Pin margin tool………………………………………………………47
5.4 Case study………………………………………………………………… 49
5.4.1 case 1 The practical flow of a test program
development………………………………………………………… 49
5.4.2 case 2 Device characterization………………………………65
CHAPTER 6 Conclusions…………………………………………………………… 70
REFERENCES……………………………………………………………………………… 71
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