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研究生:鍾子彬
研究生(外文):Zin-Bin Jhong
論文名稱:無線表面聲波感測系統設計
論文名稱(外文):Wireless SAW sensor system design
指導教授:田慶誠田慶誠引用關係
指導教授(外文):Ching-Cheng Tien
學位類別:碩士
校院名稱:中華大學
系所名稱:電機工程學系碩士班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2007
畢業學年度:95
語文別:中文
論文頁數:63
中文關鍵詞:表面聲波射頻無線感測器
外文關鍵詞:SAWRFwirelesssensor
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進入二十一世紀後,許多的電子產品演進有朝向與無線通訊整合應用的趨勢,繁舉感測器網路、電子標籤、電腦、視訊產品、車內電子系統等。人類未來在創造各種智慧型生活環境的同時,需要建置各種電子感測器,協助隨時蒐集重要的環境變數。輕便易裝設的無線感測器系統將是打造智慧型居家生活的最佳選擇,市場的價值與商機不可忽視。
本計劃與台達電子為機電研究群共同研發無線表面聲波感測器,被動式的表面聲波感測器設計不需電源供給、體積小、成本低、傳收距離遠,極具市場開發價值。
Entering the 21st century, electronic equipment embedded with wireless transceiver became the new trend, for examples, wireless sensor, RFID, mobile computer, video system, car electronic system. For future life, we need more sensors to build up the intelligent living environments and sense the physical parameters anytime or anywhere. The easy-setup wireless sensor will be the best choice for constructing such an environment and possess the inevitable market potential.
In this project, we will cooperate with MEMs R&D Dept. of Delta research center to implement the wireless SAW sensor system. Passive SAW sensor has the valuable benefits of powerless, small size, low cost and long range operation.
中文摘要…………………………………………………………………………………………Ⅰ
英文摘要…………………………………………………………………………………………Ⅱ
致謝………………………………………………………………………………………………Ⅲ
目錄………………………………………………………………………………………………Ⅳ
圖目錄……………………………………………………………………………………………Ⅶ
表目錄……………………………………………………………………………………………Ⅸ
第一章 序論……………………………………………………………………………………1
1-1 本研究計畫之背景目的、重要性以及國內外有關本計畫之研究情況…………………1
1-2 研究方法及進行步驟………………………………………………………………………7
第二章 規格制定與介紹………………………………………………………………………12
2-1 系統架構設計……………………………………………………………………………12
2-2 系統規格訂定……………………………………………………………………………14
第三章 系統各級電路設計流程………………………………………………………………22
3-1 感測器設計(表面聲波感測器)………………………………………………………22
3-2 無線表面聲波感測系統設計概述……………………………………………………23
3-2.1 發射電路………………………………………………………………………………23
3-2.2 接收電路………………………………………………………………………………25
第四章 系統各級電路量測與系統整合量測分析……………………………………………27
4-1 電源供應電路量測………………………………………………………………………27
4-2 表面聲波感測器量測……………………………………………………………………28
4-2.1 Insertion loss measurement…………………………………………………28
4-2.2 溫度對頻率差之量測…………………………………………………………………30
4-3 零件表……………………………………………………………………………………31
4-3.1 發射電路……………………………………………………………………………31
4-3.2 接收電路……………………………………………………………………………31
4-3.3 電源供應電路………………………………………………………………………33
4-3.4 數位電路……………………………………………………………………………34
4-4 PCB Layout圖檔及說明…………………………………………………………………36
4-5 系統整合量測……………………………………………………………………………36
4-5.1 Isolation、輻射、Noise干擾量測………………………………………………36
4-5.2 發射信號量測…………………………………………………………………………40
4-5.3 接收信號量測…………………………………………………………………………41
4-5.4 接收距離量測…………………………………………………………………………42
4-5.5 數位電路量測…………………………………………………………………………44
第五章 實體電路外觀及分析、比較之前結果………………………………………………46
5-1 第一版問題分析與改進架構說明……………………………………………………46
5-2 第二版問題分析與改進架構說明……………………………………………………47
5-3 最終版結果……………………………………………………………………………49
第六章 結論……………………………………………………………………………………51
參考文獻…………………………………………………………………………………………52
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