臺灣博碩士論文加值系統

本文針對利用傳輸線理論以及設計傳統天線結構的困難處提出一新型的微帶天線設計機制，設計出一種新式微帶天線，同時利用LTCC製程技術，將整體微帶天線晶片化，以達到輕薄短小的特性。此種新型微帶天線的結構是由『微帶線(電路)模組』與『負載(輻射器)』配合『橋接微帶線』三大部份結合而成，實驗結果顯示，新型微帶天線的阻抗匹配可受到匹配裝置(微帶線模組部份)的控制與調整，微帶線模組同時保留了原設計時使用的柴比雪夫濾波電路的電路特性，協助微帶天線達到降頻弁遄A完成縮小化目的。
為了能夠使整體天線縮小化並且改善傳統晶片天線因接地面過大而無法整體體積縮小的問題，本論文利用陶瓷低溫共燒LTCC製程將『微帶線模組』電路晶片化成為『晶片電路』，並且建立新型橋接方式連接至『負載(輻射器)』成為晶片天線。研究結果顯示縮小後的晶片電路，不但在保留原本電路特性的基礎下，可以達到縮小天線10倍的弁遄A並且有終極衰減的特性。另外，透過橋接方式將晶片電路連接『負載(輻射器)』的研究結果顯示，晶片天線仍可保留原本『微帶線模組』電路特性，晶片天線的『負載(輻射器)』同樣受到晶片電路控制。

This thesis suggests a novel microstrip antennas design mechanism improving the puzzle of using transmission line theory and traditional antenna structure to design a new style patch antenna as well as studies in overall utilization the LTCC technology for microstrip antennas chip device to achieve small and slight in size. The new microstrip antenna structure includes three components, microstrip electric circuit module, loading device (radiator) and a via path circuit. The study result has shown the impedance matching of the patch antenna can be adjusted by matching regulator device (microstrip circuit Chebyshev filter module) but retains the original characteristics of the module under the purpose of downsizing.
Due to the difficulty of downsizing of the patch antenna, the traditional chip antenna suffers the oversized ground in increasing XPL (cross polarization level). However, LTCC (Low Temperature Cofire Ceramic) can be used to fabricate a circuit module through via path to construct a chip device controls the microstrip antenna in a smaller size of ceramic. Our study has shown reducing size of the circuit will not affect its original circuit characteristics. The finding also revealed the degree of downsizing chip electric circuit can be at least 10 times less, not only retains of electric circuit characteristic but also improves the antenna impedance matching as well as regulates the exciting modes of the radiator.

摘要
Abstract
致謝
文字目錄
圖形目錄
表格目錄
第一章 序論
1.1概述
1.1.1 無線通訊平面天線的研究與發展
1.1.2 微帶天線的研究與發展
1.1.3 微波電路與傳輸線模型
1.1.3.1微帶線及其特性
1.1.3.2阻抗(Z)與導納(Y)矩陣
1.1.4 散射(scattering)矩陣
1.1.5 參考平面的移動
1.1.6 傳輸線模型
1.1.7 傳輸（ABCD）矩陣
1.2 文獻導覽
1.3 論文提要
第二章 新型微帶補丁天線的應用與設計
2.1 概述
2.2 傳輸線導論
2.3 補丁天線的微帶輔助設計
2.4 加入不同型式之輻射金屬片至新型補丁天線
2.5 結論
第三章 具有微帶線模組之輔助電路整合天線設計導論
3.1 概述
3.2 新型微帶天線設計
3.3負載天線與微帶線模組分析
3.3.1負載天線之分析
3.3-2微帶線模組之分析
3.4結論
第四章 天線輔助電路晶片化設計導論
4.1 概述
4.2 LTCC低溫共燒陶瓷技術簡介
4.2-1 LTCC低溫共燒製程簡介
4.3 電路晶片化
4.4 晶片天線
4.5 結論
第五章 總結
參考文獻

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