臺灣博碩士論文加值系統

在半導體的製作過程中，封裝製程屬於IC（Integrated Circuit, 積體電路）產業之後段，其良率好壞影響到IC出貨的穩定性甚鉅。由於IC產品類型十分多樣化，客戶會限制產品的規格與品質的要求，因此即便不斷地對有瑕疵的作業流程進行改善，有時還是無法避免客訴的問題發生。當客訴發生，無論是否妥善解決客戶的問題，對公司終究會造成負面的影響。因此對永續經營之企業而言，只有持續提供顧客滿意之產品，才能創造出競爭的優勢。
本研究是以國內知名半導體封裝廠為研究對象，利用知識管理（Knowledge Management）來分析客訴案件之重要屬性因素，並且歸納出相關的規則，根據不同客戶的問題，迅速找出發生的原因並尋求妥善的解決方法，以完成客訴之8D報告 （8 Disciplines Report）。而由於許多重要資源與知識都是來自顧客，為了要快速的累積知識，並做好知識管理的工作，首先必須要建構知識管理系統，如此才能快速的從資料中發掘隱含的知識與行動對策，並且藉由不斷擴大自身的知識來源，進而提供相關作業人員在事前採取預防措施，以降低客訴事件發生的機會。

IC assembly process is at back-end of the semiconductor industry. The stability of the IC supply depends on the performance of yield. Because of the variety of product types, some customers may have strict requirements of product criteria & quality. Although a lot of efforts have put on continuous improvements of imperfect process flow; customer complaint may still happens. When a customer complaint happens, no matter how fast or how well we can take care of the problem which customers are facing, there is still some negative impact on the company. For any company that would like to stay in the business continually, to offer a product which can satisfy customer demand is the only way.
In this research, we use knowledge management and 8D report methods to analyze the cause property of customer complaints and to classify the related rule in order to find the root cause accordingly so as to resolve the problem rapidly.

致謝 ii
摘 要 iii
ABSTRACT iv
目錄 v
圖目錄 vii
第一章 緒論 1
1.1 研究動機 1
1.2 研究目的 1
1.3 研究流程 2
第二章 文獻探討 3
2.1 知識管理 3
2.2 客訴處理 11
2.3 8D應用說明 15
第三章 知識管理於客訴報告之應用 23
3.1 個案研究 23
3.2 知識管理的資訊架構 23
3.3 IC封裝廠製程流程 27
3.4 異常原因屬性之分類 29
3.5客訴原因分析流程 30
3.6 客訴資料之萃取 31
第四章 客訴分析與實證研究 35
4.1 客訴分析 35
4.2 效益分析 49
第五章 結論與未來研究方向 50
5.1 結論 50
5.2 未來研究方向 51

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