(3.238.7.202) 您好!臺灣時間:2021/02/25 10:24
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果

詳目顯示:::

我願授權國圖
: 
twitterline
研究生:孟祥發
研究生(外文):Hsiang-Fa Meng
論文名稱:LCD-COG產品研發後之整合性品質改善
論文名稱(外文):An Integrated Quality Improvement Application of LCD-COG Process for excellence Design
指導教授:鄭豐聰鄭豐聰引用關係
指導教授(外文):Feng-tsueng Cheng
學位類別:碩士
校院名稱:逢甲大學
系所名稱:工業工程與系統管理學研究所
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2007
畢業學年度:95
語文別:中文
論文頁數:42
中文關鍵詞:田口品質工程QFDFMEACOG
外文關鍵詞:Taguchi MethodsFMEAQFDCOGexcellence design.
相關次數:
  • 被引用被引用:0
  • 點閱點閱:145
  • 評分評分:系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
透過新產品從研發後轉量產前之角度,先以產品試產後的結果運用製程潛在失效模式(Failure Mode and Effects Analysis, FMEA)評估改善目標之項目,再藉由品質機能展開(Quality Function Deployment, QFD),將顧客需求轉換成產品製程需求,找出產品製程改善優先順序後,結合田口品質工程(Taguchi Method, TM)進行製程參數改善,並以液晶顯示器(Liquid Crystal Display, LCD)產品之玻璃覆晶(Chip On Glass, COG)型產品為改善個案,對本研究方法論作一闡述介紹。
本論文以田口品質工程進行製程可控因子之研究,最終經由確認實驗結果顯示,透過本研究建議的製程參數水準組合,將「液晶」因子設定為新品,「絕緣膜刮刀壓力」設定為2.0 kgf/cm3,「配向膜Roller間隙」設定為0.15㎜,「配向膜燒成溫度」設定為240℃,「定向壓入量」設定為0.4㎜,「Sealing壓力」設定為0.15 kgf/cm2,「玻璃阻抗」設定為25Ω,「玻璃球數」為80個/0.785mm2,可以讓產品的操作電壓(Voltage of Operation, VOP)品質變異,在實驗後之因子水準設定下,較原來之因子水準設定有所改善,使改善後之產品信號雜訊比(Signal-to-Noise, S/N比)改善前增加4.81dB,並縮小製程變異,使產品VOP平均調整至目標值7.36V,進而驗證本研究方法之可行性。
This paper is to integrate Process Failure Mode and Effects Analysis(PFMEA)and Quality Function Deployment(QFD)to find the priority of improvement. Taguchi Method is employed to determine the optimum process parameters improvement for Chip On Glass(COG)technology case study.
This purpose of this paper is to study these control factors of process by Taguchi method. The optimum combination of process parameters is determined by verification experiment finally and shows that crystal was set at new, pressure of isolate film scraper was set at 2.0 kgf/cm3, the gap between rollers was set at 0.15 mm, temperature for roller was set at 240℃, Intrusive depth for rubbing was set at 0.4mm, pressure for sealing was set at 0.15 kgf/cm2, glass resistance was set at 25Ω, and quantity of glass ball was set at 80 ea/0.785mm2. Huge deviation for voltage of operation(VOP)can be improved by the optimum combination of process parameters. The result show that signal-to-noise ratio is increased to 4.81dB and VOP can be controlled and stabilized obviously within target voltage, 7.36V. Furthermore, the study of this paper is verified efficiently by the integrated method.
誌謝 i
中文摘要 ii
Abstract iii
目 錄 iv
表目錄 v
圖目錄 vi
第一章 緒論 1
1.1 研究動機與背景 1
1.2 研究目的 2
1.3 研究流程與架構 2
第二章 文獻探討 5
2.1 失效模式與效應分析相關文獻探討 5
2.2品質機能展開相關文獻探討 9
2.3 田口品質工程相關文獻探討 10
第三章 產品量產前核心製程改善實驗模式 15
3.1 結合製程FMEA與品質機能展開之產品核心製程分析 15
3.2 田口實驗規劃 24
3.3 實驗步驟 26
第四章 田口實驗資料分析 29
4.1 望目型品質特性值之平均值實驗資料分析 29
4.2 製程參數選擇與確認實驗 33
第五章 結論與建議 38
5.1 結論 38
5.2 建議與未來研究方向 38
參考文獻 40
中文部份
1.黎正中,(1993), 穩健設計之品質工程,台北圖書有限公司。
2.林清田,(2003), “不�袗�SUS304磁力研磨拋光加工特性之研究”,國立中興大學機械工程學系研究所碩士論文。
3.李守誠,(2003), “壁紙機加熱罩翹曲變形的分析與探討”,中原大學機械工程研究所碩士論文。
4.張魁麟,(2002), “田口方法在筆記型電腦CPU過熱改善之研究”,國立台北科技大學生產系統工程與管理研究所碩士論文。
5.周錫英、張起明,(1994), “實施失效模式、效應與關鍵性分析(FMECA)之功能、需求與步驟”,品質管制月刊,第三十卷第十二期,p75-83。
6.蘇朝墩,(2005),品質工程,中華民國品質學會。
7.楊健明,(2003), “田口方法應用於連續纖維補強押出發泡三明治結構之製程最佳化分析”,國立成功大學工程科學系研究所碩士論文。
8.吳世芳,(1993),”設計FMEA之實施流程”,品質管制月刊,第二十九卷第九期,p 42-53。
英文部份
9.Benjamin, D.M., “Reducing medication errors and increasing patient safety: Case studies in clinical pharmacology”, Journal of Clinical Pharmacology, p 768-783, Jul, 2003.
10.Brown, Patrick G. (AT&T Bell Lab), AT&T Technical Journal, v 70, n 2, p 18-32, Mar-Apr, 1991.
11.Crown, P.L., “Design Effective Failure Mode and Effect Analysis”, Annual Reliability and Maintainability Symposium,Proceedings,1969.
12.Deshpande, V.S. & Modak, J.P., “Application of RCM to a medium scale industry”, Reliability Engineering & System Safety, p 31-43, Jul, 2002.
13.Govers, C.P.M. (Eindhoven Univ of Technology), International Journal of Production Economics, v 46-47, p 575-585, Dec, 1996.
14.Grant, w., Handbook of Reliablilty Engineering and Management, McGraw-Hill Inc, 1988.
15.Havener, Clifton L. (Growth Resources Group Inc), Quality Progress, v 26, n 11, p 41-44, Nov, 1993.
16.Harnly, J.A., “Riskbase Prioritization of Maintenance Repair Work”, Process safety Prorgess,Vo1.17No.1, p 32-38,1998.
17.Kelly, P. J., Arnell, R. D., Hudson, M. D., Wilson, A. E. J., Jones, G., ” Enhanced mechanical seal performance through CVD diamond films“, Vacuum, vol.61, p 61-74, 2001.
18.Lee, K., Kim, J., ” Controller gain tuning of a simultaneous multi-axis PID control system using the Taguchi method”, Control Engineering Practice, vol.8, p 949-958, 2000.
19.Li, Ming-Hsien Caleb, International Journal of Advanced Manufacturing Technology, v 25, n 5-6, p 571-578, March, 2005.
20.Lin, J.L., Wang, K.S., Yan, B.H., Tarng, Y. S., “Optimization of the electrical discharge machining process based on the Taguchi method with fuzzy logics”, Journal of Materials Processing Technology, vol.102, p 48-55, 2000.
21.MIL-STD-1629A,Military Standard Procedure for Performing a Failure Mode, Effects and Criticality Analysis, Department of Defense, Washington, DC,1980.
22.Phadke, M. S., Kackar, R. N., Speeney, D. V., and Grieco, M. J., “Off-Line Quality Control in Integrated Circuit Fabrication Using Experimental Design.”, The Bell System Technical Journal, vol. 62, no. 5, p 1273-1309, 1983.
23.Phadke, M. S., Taguchi, G., Ohmsha Ltd, p 1002-1007, 1987.
24.Pullman, Madeleine E., Moore, William L., Wardell, Don , Journal of Product Innovation Management, v 19, n 5, p 354-364, Sep, 2002.
25.Singh, S., Shan, H. S., Kumar, P., “ Parametric Optimization of Magnetic-Field-Assisted Abrasive Flow Machining by The Taguchi Method”, Quality and Reliability Engineering International, Vol. 18, p 273–283, 2002.
26.Sullivan, Lawrence P. , Quality Progress, v 19, n 6, p 39-50, Jun, 1986.
27.Willy w. Vanderbrance, “How to FMEA to Reduce the Size of Your Quality Tollbox”, Quality Progress / November, p 97-100, 1988.
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top
系統版面圖檔 系統版面圖檔