由於具有質量輕、慣性微小、低熱容量、表面平滑、消耗功率低、可與微電子系統相容、可以批量製造和低成本等特性與優點，微光機電系統（Micro-optical-electromechanical systems, MOEMS），一直是微機電系統的重要領域之一。微光機電系統中，微機械結構的可變形鏡面在光學應用上是很重要的，它是以靜電力或者其他驅動力作驅動，使鏡面結構可做適度之變形。
本論文主要是利用靜電力的反應速度快、效率佳、高頻響應佳等特性，做為微結構鏡面於微聚焦時的驅動來源。並以晶片結合技術設計製造出微聚焦調變鏡。
本論文以體型微細加工(bulk micromachining)方法為基礎設計出一種新型接合式可調變聚焦鏡，在矽基板上製作出梯形曲面輪廓，再利用接合技術將兩片矽基板結合製作出微可變聚焦鏡面之結構。其優點為不會產生翹折（warpage），所需光罩數可大幅減少，增加製程的成功率。最後提出以SU8光阻充當接合介質，以避免陽極接合的高溫和高電壓對於元件的破壞。

Micro-optical-electromechanical system, aiming at optical applications in MEMS, uses deformable mirrors to conduct adaptive optics devices and to change the focal length of the mirror. This thesis designed and fabricated micro deformable focusing mirror by bonding method. The novel micro deformable focusing mirror was actuated with electrostatics to adjust the focal length.
In analysis, plate and shell theories are used to obtain the relations among deformation and electrostatic force.
In fabrication, use the bulk-micromachining to produce upper and lower electrode structures. Finally, upper electrode structure bonded lower electrode structure by wafer bonding technology. To avoid the damage of high temperature and high voltage from anodic bonding method, this thesis rendered an idea which is using photo resist as medium.

目 錄

致謝 i
摘要 ii
英文摘要 iii
目錄 iv
圖目錄 vii
表目錄 ix
符號表 x
第一章 緒論
1-1 前言
1-2 研究動機與目的
1-3 文獻回顧
1-4 內容簡介
第二章 可調變聚焦鏡設計與理論
2-1 接合式微聚焦調變鏡介紹
2-2 鏡面結構開口大小及深度與焦距長度計算方法
2-3 可調變聚焦鏡之板殼理論
2-4 可調變聚焦鏡之靜電分析

第三章 製程規劃
3-1 基本VLSI技術
3-1-1 微影製程
3-1-2 薄膜製程
3-1-3 改質製程
3-1-4 蝕刻製程
3-2 非標準CMOS製程
3-2-1 蝕刻終止技術
3-2-2 晶片結合技術
3-3 接合式可調變聚焦鏡之製程規劃
第四章 製程設計分析
4-1 光罩配置
4-2 製作流程
第五章 製程結果與討論
5-1 製程結果
5-1-1 微影製程
5-1-2 乾式蝕刻製程
5-1-3 濕式蝕刻製程
5-2 製程問題與解決辦法
5-2-1 微影製程問題
5-2-2 乾式蝕刻製程
5-2-3 濕式蝕刻製程
5-3 後續製程問題
第六章 結論與展望
6-1 本文主要成果
6-2 未來展望
參考文獻 41

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