各式各樣的電子商品帶來方便的生活，卻也造成了複雜的電磁雜訊環境，因此電子產品的電磁相容就顯得格外重要。隨著印刷電路板層板層數增加，傳統在電路板焊上額外元件解決電磁相容問題的方法，轉移到多層板層板間加元件已不敷使用，迫使趨勢朝向IC組成系統前即可預估並處理EMI問題，並於嵌入式系統設計流程中，試圖在設計階段就預估電磁干擾。本論文提出一方法，建立微控器的EMI傳導模型，並以PIC12F629實現，首先實做一塊符合規範可量測微控器傳導性電磁干擾的電路板，再對微控器燒錄數個特別設計之無窮迴圈，量測電源腳位干擾電壓，以取得每個指令的波形，接著將此資訊匯入ic-emc tool與winspice軟體，估算微控器模型。由此進一步用SID軟體設計可模擬微控器執行指令行為的指令集模擬器，預測不同程式在執行時產生的傳導性電磁干擾情形。由本文實驗結果得知，預測結果與量測結果相當吻合。

Varieties of electronic commodities bring us a convenient life, but these commodities make the environment with complicated electromagnetic noise. Therefore, the electromagnetic compatibility test of electronic commodities is singularly important. When Printed Circuit Board’s layer increases, traditional method which welds shielding components on the circuit board to solve electromagnetic compatibility problem is not enough. This situation forces industry to estimate and handle EMI problem before system integration and try to estimate EMI in embedded system design flow. This thesis proposes a method to model microcontroller’s EMI behavior and illustrated by PIC12F629. First, a circuit board is implemented. The board design is according to EMI testing specification and can be used to measure the conducted Electromagnetic Interference. The microcontroller is loaded an elaborately designed infinite loop. Each instruction’s waveform is get by measuring VDD interference. Then ic-emc tool and winspice read these information and evaluate microcontroller’s model. Further more, we design microcontroller’s instruction set simulator from SID. This simulator can predict different program’s conducted Electromagnetic Interference. The prediction is quiet similar to the measurement result.

誌謝 2
摘要 i
Abstract ii
目錄 iii
圖目錄 v
表目錄 vii
第一章 緒論 1
1-1 研究動機 1
1-2 研究方法概述 2
1-3 論文架構 3
第二章 背景知識 4
2-1 電磁相容 4
2-2 嵌入式系統設計流程 7
2-3 RTOS 9
2-4 模擬軟體選擇 10
2-4-1 ic設計層次 10
2-4-1-1 Transistor Level(Switch Level) 11
2-4-1-2 Gate Level 11
2-4-1-3 RTL Level 11
2-4-1-4 System Level 12
2-4-2 模擬軟體 12
2-4-2-1 Spice[5][8] 12
2-4-2-2 Seamless CVE[12][14] 12
2-4-2-3 SystemC[1][15][17][27] 13
2-4-2-4 SID[13][21] 16
第三章 研究方式 17
3-1 模擬軟體比較 17
3-2 SID介紹 20
3-2-1 安裝 20
3-2-2 元件 23
3-2-3 配置檔 26
3-2-4 二進位檔 28
3-3 PIC12F629介紹 28
第四章 實作原理 34
4-1 實作架構 34
4-2 建立指令EMI模型 35
4-2-1 PCB版實作 35
4-2-2 電源腳位量測 37
4-2-3 指令的電流源模型 45
4-2-4 指令電流源驗證 51
4-3目的程式編譯 52
4-3-1 multitasking OS for PIC microcontroller 52
4-3-2 MPLAB、PICC、Hex2bin 55
4-4 指令集模擬器 59
4-4-1架構 59
4-4-2 CPU元件程式 59
4-4-3 輸出 60
4-4-4 指令集模擬器功能驗證 61
第五章 實作成果 66
5-1 雙方通話 66
5-2 九方通話 68
5-3 PIC12F629指令集模擬器雛形 69
5-4 timer預除器 70
5-5 CPU元件附加功能-計算指令執行數 71
5-6 程式記憶體匯流排位元轉態元件 72
5-7 指令電流源比較 75
5-8 最小平方誤差表 76
5-9 程式1 77
5-10 程式2 78
第六章 結論與未來展望 79
第六章 結論與未來展望 80
參考文獻 83

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