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研究生:李忠良
研究生(外文):Chung-Liang Lee
論文名稱:水填充量對燒結式微熱管性能之影響分析
論文名稱(外文):A Study of the Effect of Water Filler on a Sintered Miniature Heat Pipe Performance
指導教授:莊書豪莊書豪引用關係楊智勝楊智勝引用關係
指導教授(外文):Shu-Hao ChuangChih-Sheng Yang
學位類別:碩士
校院名稱:遠東科技大學
系所名稱:機械研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:96
中文關鍵詞:毛細結構填充量燒結式熱管
外文關鍵詞:WickSintered heat pipeFiller water
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本文之主要研究目的為找出用於筆記型電腦散熱系統之微熱管的最佳填充量,此燒結式微熱管內部之毛細結構是採用燒結銅粉來形成結構層。本文針對熱管的各種工作流體填充量進行研究。本實驗填充量總共分為六組,分別為填充量1.3g、1.4g、1.5g、1.6g、1.7g、1.8g。性能測試方法是依據工研院能環所簡國祥博士所提出的「熱管性能檢測方式之介紹」進行測試。
性能測試方面包括熱響應、最大熱傳量以及熱阻值的評估。由熱響應測試結果中顯示,本研究所製作之燒結式微熱管填充水量1.3g、1.4g、1.5g、1.6g、1.7g、1.8g,均可以迅速地傳導熱量並達到穩態,而且穩態之溫度相當接近於加熱端之水的溫度。
由最大熱傳量測試實驗結果中顯示,當填充水量為1.3g與1.4g時,因為填充量太少,所以當輸入熱量持續增加時,加熱端產生局部乾凅而降低熱傳能力。當填充量為1.5g時,其最大熱傳量明顯的比當填充量為1.3g與1.4g時要好。當填充水量為1.6g時,所解之功率可高達65W,此填充量為實驗之最佳填充含水量。當填充量為1.7g與1.8g時,由於填充量太多,過多的水量反而會在冷凝端形成阻塞,導致冷凝端熱阻的增加,並影響其傳熱效率。
至於熱阻性能測試方面:當熱管工作流體填充水量為1.3g、1.4g時,由於填充量太少導致熱管無法正常操作,相對地熱阻值也比較大。當填充水量為1.5g時,熱傳效率最高。當填充水量為1.6g時,熱阻值相當的穩定且熱阻值較小。當填充量1.7g與1.8g時,由於填充量太多導致於過多的水量影響熱傳效果,故其熱阻值也比較大。
由本文所作之性能測試結果發現,當燒結式微熱管填充水量為1.6g時,其熱響應測試、最大熱傳量測試以及熱阻值測試等結果顯示均為最佳性能,故本實驗之最佳填充量為1.6g。本文所得結果可以提供相關業界的參考。
The purpose of this text was to find an optimum capacity of fill water amount condition for micro heat pipe of notebook. The inner capillary construction of sintered heat pipe was composed by sintered copper powder. The parameter of this study is a various fill water. The fill amount in this experiment was divided by six set, such as 1.3g,1.4g,1.5g,1.6 g,1.7g,1.8g. The method of test performance was according to Dr. chien’s “the introduction of heat pipe property detection square type”. The test aspect of performance were included by heat response, maximum heat transfer, and thermal resistance evaluation.
Form the results of heat response in a various fill water, it was shown that all supplied heat pipe in a various fluid fill as 1.3g,1.4g,1.5g,1.6 g,1.7g,1.8g can rapidly transfer heat quantity and reach steady state. The steady state temperature is nearly approach to the fill water temperature of heat source.
From the results of maximum heat transfer in a various fill water, it was shown that the poor heat transfer when the fill water are 1.3g and 1.4g due to the little fill amount, and better heat transfer than 1.3g and 1.4g when the fill water is 1.5g. The power solution can reach to 65W when the fill water is 1.6g. The heat transfer decreased when the fill water are 1.7g and 1.8g, because the more fill water for condenser end form the blockage effect.
Form the results of thermal resistance test, it was shown that the thermal resistance is increased when the fill water are 1.3g and 1.4g due to the little fill water. Comparing with 1.3g and 1.4g, the thermal resistance is decreased when the fill water are 1.5g and 1.6g. Comparing with 1.5g and 1.6g, the thermal resistance of fill water 1.7g and 1.8g are increased due to more fill water.
In summary, from the results of performance test of sintered miniature heat pipe, we can find the optimum fill water of sintered miniature heat pipe in this paper is 1.6g. This results can be provided the reference for relative research and industry.
誌 謝 i
摘 要 ii
Abstract iv
目 錄 v
表 目 錄 viii
圖 目 錄 x
符 號 說 明 xiv
第一章 緒論
1.1 前言 1
1.2 文獻回顧 2
1.3 研究目的與動機 7
1.4 研究方法 8
第二章 熱管技術理論
2.1 熱管的發展 9
2.2 熱管的構造 9
2.3 熱管的作動原理 11
2.4 熱管的優缺點 12
2.5 熱管操作的熱傳界限 13
第三章 熱管的設計與製造
3.1 熱管的設計 17
3.1.1 外層容器的選擇 17
3.1.2 沿管內壁毛細結構的選擇 18
3.1.3 工作流體的選擇 18
3.2 熱管的製造 21
第四章 實驗設備與實驗步驟
4.1 實驗設備 25
4.1.1 製造設備 25
4.1.2 測試設備 28
4.2 熱管性能測試步驟 31
4.2.1 熱管性能測試簡介 31
4.2.2 熱管之熱響應測試步驟 32
4.2.3 熱管之最大熱傳量測試步驟 32
第五章 結果與討論
5.1 熱管之熱響應測試結果 34
5.2 熱管之最大熱傳量測試結果 35
5.3 熱管之熱阻值計算結果 37
第六章 結論與建議
6.1 結論 40
6.2 建議 41
參 考 文 獻 42
作 者 簡 介 96
參考文獻
[1]劉軍愷,新電子散熱技術的發展,熱管理產業通訊第四期,2006.
[2]王啟川,電子散熱熱管理(上),冷凍與空調,45~58頁,2003.
[3]Gaugler, R.S.,US Patent Application. Dec. 12, 1942, Published US Patent NO.2350348 ,June 1944.
[4]Grover, G.M., Cotter, T. P. and Erickson, G.F.,“Structure of Very High Thermal Conductance” J.App. Phys.Vol.35, pp.1990, 1964.
[5]Tien, C.L. and Sun, K.H., “Minimun Meniscus Radius of Heat Pipe Wicking Materials” Int. J. Heat Mass Transfer, Vol.16, pp.169-186, 1970.
[6]Udell, K.S., “Heat Transfer in Porous Media Heated From Above With Evaporation, Condensation, and Capillary Effects” ASME J. Heat Transfer, Vol.105, pp.485-492. , 1983.
[7]Cotter, T.P., “Principles and Prospects for Micro Heat Pipes” Proc. Int. Heat Pipe Conf., Tsukuba, Japan, pp.328-335 1984.
[8]Mantle, W.J. and Chang, W.S., “Effective Thermal Conductivity of Sintered Metal Fibers” IEEE, Vol.4, pp.1871-1877, 1989.
[9]Zhou, J. and Yao, Z., J., “Experimental Investigation of the Application Characters of Micro Heat Pipe” Proc. Int. Heat Pipe Conf., Beijing, China, 1992.
[10]Chen, H., Groll, M. and Rosler, S., “Micro Heat Pipe: Experimental Investigation and Theoretical Modeling” Proc. Int. Heat Pipe Conf. Beijing, China, 1992.
[11]Cao, Y., Gao, M. and Pinilla, E., “Fabrication and Test of a Filling Station for Micro/Miniature Devices” Proceedings of the Intersociety Energy Conversion Engineering Conference, Vol.2, pp.1509-1513, 1998.
[12]Xie, H., “The Use of Heat Pipes in Personal Computers” 1998 Inter Society Conference on Thermal Phenomena, 1998.
[13]Toth, J., Dehoff, R., and Grubb, K., “Heat pipes: the Silent Way to Manage Desktop Thermal Problems” Thermacore America Inc, 1998.
[14]Nguyen, T., Mochizuki, M.K., Saito, Y., Asuciuc, I. and boggs, R., “Advance Cooling System Using Miniature Heat Pipe In Movie PC” The sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp.507-511, 1998.
[15]Gupta, A. and Upadhya, G., “Optimization of Heat Pipe Wick Structures for of Low Wattage Electronics Cooling applications” Advances in Electronic Packaging ASME, Vol.2, pp.2129-2137, 1999.
[16]Shuler, S., “Thermal Management, Understanding how to Incorporate Effective Thermal Strategies into Overall PortableElectronic Design for Better Performance” Materials and Design 21, pp.39-44, 2000.
[17]賴錦川,燒結式微熱管毛細結構參數之影響研究,國立台灣大學機械工程研究所碩士學位論文,2000.
[18]簡國祥,熱管性能檢測方法之介紹,熱管理產業通訊第三期,2006.
[19]林唯耕,熱管性能曲線之建立與棋參數判斷依據之模式,熱管理產業通訊第三期,2006.
[20]簡國祥,熱管介紹,電子散熱技術研討會,2007
[21]依日光,熱管技術理論實務,復興出版社,2000.
[22]李國源,導流板與鰭片間距對分離式熱交換器熱傳導性能之影響,遠東科技大學機械工程研究所碩士學位論文,2006.
[23]尤金龍,散熱模組鰭片最佳化分析,國立中興大學機械工程研究所碩士學位論文,2005.
[24]UL台灣分公司編製,熱管的工作原理及其在電腦工業的應用,台灣通訊第14期,2005.
[25]Faghri, A., “Heat Pipe Science and Technology” Taylor and Francis, Bristol, 1995.
[26]Eastman, G.Y., “The Hea Pipe” Scientific American, Vol.218,
NO.12, pp.38-46, 1968.
[27]庒駿、張紅,熱管技術及其工程應用,化學工程出版社,2004.
[28]孫即愚,熱管技術介紹,化工技術第二卷第二期,1995.
[29]Dunn, P.D. and Reay, D.A., “Heat Pipes” , 1994.
[30]Kemme, J.E., “High Performance heat Pipes” Proc. 1967, Thermionic Conversion Specialist Conference, Palo Alto, California, Oct., 1967.
[31]Levy E. K., “Theoretical Investigation of Heat Pipe Operating at Low Vapor Pressure” J. Eng. Ind., Vol. 90, pp.547-552, 1968.
[32]Kemme, J.E., “UltimateHeat-PipePerformance” IEEE Transaction on Electron Devices, Vol. ED-16, pp.717-723, 1969.
[33]Udell, K. S., “Heat Transfer in Porous Media considering Phase Change and Capillarity” Int. J. Heat Transfer, Vol. 28, No.2, pp.485-498, 1985.
[34]Tse, F.S. and Morse, I.E. Measurement and Instrumentation in Engineering, Marcel Dekker, Inc, 1989.
[35] 純水智庫諮詢討論區http://www.waterline.com.tw/bmx/viewthread.php?tid=13&page=1#pid28
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