1.V. B. Fiks, “On the Mechanism of the Mobility of Ions in Metal”, Soviet Physics-Solid State, Vol. 1, pp. 14-28, (1959).
2.H. B. Huntington and A. R. Grone, “Current-Induced Marker Motion in Gold Wires”, Journal of Physics and Chemistry of Solids, Vol. 20, No. 1, pp. 76-87, (1961) .
3.H. B. Huntington, in “Diffusion in Solids: Recent Developments”,
edited by A. S. Nowick and J. J. Burton, Academic Press, New York, 303-352, (1975).
4.A. R. Grone, “Current-Induced Marker Motion in Copper”, Journal of Physics and Chemistry of Solids, Vol. 20, No. 1, pp. 88-93, (1961) .
5.R. V. Penney, “Current-Induced Mass Transport in Aluminum”, Journal of Physics and Chemistry of Solids, Vol. 25, pp. 335-345, (1964).
6.王森五, “電遷移現象對高強度Al-Zn-Mg-Cu合金微觀組織及拉伸變形之效應”, 國立成功大學材料科學及工程學系碩士班論文, 第42頁, 民國94年。7.T. S. Srivatsan, I. A. Ibrahim, F. A. Mohamed and E. J. Lavernia, “Processing techniques for particulate-reinforced metal aluminium matrix composites”, Journal of Materials Science, Vol. 26, pp. 5965-5978, (1991).
8.S. C. Wang, M. J. Starink and N. Gao, “Precipitation hardening in Al-Cu-Mg alloys revisited”, Scripta Materialia, Vol. 54, pp.287-291, (2006) .
9.John E. Hatch, “Aluminum: Properties and Physical Metallurgy”, American Society for Metals, USA, pp. 136-137, (1984).
10.輕金屬協會,“�圮醽懟暪侒蟓U組織シ性質”, 輕金屬學會, JAPAN, pp. 192-217, (1991).
11.http://asm.matweb.com/search/SpecificMaterial.asp?bassnum=MA2017T4
12.I. A. Blech, “Electromigration in thin aluminum films on the titanium nitride”, Journal of Applied Physics, Vol. 47, No.4 , pp.1203-1208, (1976).
13.I. A. Blech and Conyers Herring, “Stress generation by electromigration”, Applied Physics Letters, Vol. 29, No.3, pp. 131-133, (1976).
14.K. N. Tu, “Electromigration in stressed thin films”, Physical Revies B, Vol.45, No.3, pp.1409-1413, (1992).
15.J. P. Dekker, C. A. Volkert, E. Arzt and P. Gumbsch, “Alloying Effects on Electromigration Mass Transport”, Physical Review Letters, Vol. 87, No.3 , pp. 035901[4 pages] , (2001) .
16.J. D’Haen, P. Cosemans, J. V. Manca, G. Lekens, T. Martens, W. De Ceuninck, M. D’Ollieslaeger, L. De Schepper and K. Maex, “Dynamics of Electromigration Induced Void / Hillock Growth and Precipitation / Dissolution of Addition Elements Studied by In-Situ Scanning Electron Microscopy Resistance Measurements”, Microelectronics Reliability, Vol. 39, pp. 1617-1630, (1999).
17.K. N. Tu, “Recent advances on electromigration in very large scale integration of interconnects”, Journal of Applied Physics, Vol. 94, No.9 , pp. 5451-5473, (2003) .
18.J. R. Black, “Electromigration Failure Modes in Aluminum Metalliaztion for Semiconductor Devices”, Proceedings of the IEEE, Vol. 57, No.9, pp.1587-1599, (1969).
19.Q. T. Huynh , C.Y. Liu , C. Chen , K.N. Tu, “Electromigration in eutectic SnPb solder lines”, Journal of Applied Physics, Vol.89, No.8, pp. 4332-4335, (2001).
20.H. Gan, W. J. Choi, G. Xu and K.N. Tu, “Electromigration in Solder Joints and Solder Lines”, JOM. , Vol. 54, No. 6 , pp. 34-37, (2002).
21.I. A. Blech and H. Sello, “The failure of thin aluminum current-carrying strips of oxidized silicon (Description of new mode of metal failures due to passage of direct current at high current density – electrical opens in aluminum strips on silicon oxide)”, Physics of Failure in Electronics, Vol. 5, pp. 496-505, (1967).
22.C. -L. Liu , X. -Y. Liu and L. J. Borucki, “Defect generation and diffusion mechanisms in Al and Al-Cu”, Applied Physics Letters, Vol. 74 , No. 1 , pp. 34-36, (1999).
23.X.-Y. Liu, C.-L. Liu and L. J. Borucki, “A new investigation of copper’s role in enhancing Al-Cu interconnect electromigration resistance from an atomistic view”, Acta Materialia, Vol. 47, Iss.11, pp. 3227-3231, (1999).
24.C. Witt, C. A. Volkert and E. Arzt, “Electromigration-Induced Cu Motion and Precipitation in Bamboo Al-Cu Interconnects”, Acta Materialia, Vol. 51, pp. 49-60, (2003).
25.E. G. Colgan and K. P. Rodbell, “The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines”, Journal of Application Physics, Vol. 75, No. 7, pp. 3423-3434, (1994).
26.H. Li, A. Witvrouw, S. Jin, H. Bender, K. Maex and L. Froyen, “Comparison of the electromigration behavior of Al(MgCu) with Al(Cu) and Al(SiCu)”, Advanced Interconnects and Contact Materials and Processes for Future Integrated Circuits, 1998, MRS Spring Meeting, San Francisco, CA, USA, 13-16 Apr. 1998, Material Research Society, pp. 133-138, (1999).
27.C. K. Hu, R. Rosenberg and K. N. Tu, Proceeding of Stress-Induced Phenomena in Metallization, 2nd International Workshop, 1993, American Institute of Physics, New York, Conference Proceeding, Vol. 305, pp. 195-210, (1994).
28.A. Buerke , H. Wendrock and K. Wetzig, “Study of Electromigration Damage in Al Interconnect Lines inside a SEM”, Crystal Research and Technology, Vol. 35, Iss. 6-7, pp. 721-730, (2000).
29.寺�k一雄, “鋁合金構造設計輯覽”, 復漢出版社, 第1-7頁, 民國68年。
30.R. E. Reed-Hill, “Physical metallurgy principles”, PWS Publishing Company, 3ed , pp.515-537, (1994).
31.D. G. Eskin, “The Effect of Alloying Additives on Structure and Properties of Cast Al-Cu-Si-Mg Alloys”, Z. Metall, Vol. 86, No.1, pp. 60-63, (1995).
32.M. J. Starink, V. Abeels and P. van Mourik, “Lattice Parameter and Hardness Variations Resulting from Precipitation and Misfit Accommodation in A Particle-Reinforced Al-Si-Cu-Mg alloy”, Materials Science and Engineering , Vol. A163, No.1 , pp.115-125, (1993).
33.I. Dutta, C. P. Harper and G. Dutta, “Role of Al2O3 Particulate Reinforcements on Precipitation in 2014 Al-Matrix Composites”, Metallurgy and Materials Transaction, Vol. 25A, No.6 , pp.1591, (1994) .
34.John E. Hatch, “Aluminum: Properties and Physical Metallurgy”, American Society for Metals, USA, pp. 175-183, (1984).
35.陳銘欽, “置換型面心立方固溶合金應變時效之理論探討與鋁-鎂合金應變時效實驗”, 國立成功大學礦冶及材料科學研究所博士論文, 第6-42頁, 民國82年。36.Y. Onodera and K.I. Hirano, “The Effect of Direct Electric Current on Precipitation in a Bulk Al-4 wt. % Cu Alloy”, Journal of Materials Science, Vol. 11, pp. 809-816, (1976).
37.H. Jiang, Q. Zhang, Z. Jiang and X. Wu, “Experimental investigations on kinetics of Portevin-Le Chatelier effect in Al-4wt.% Cu alloys”, Journal of Alloys and Compounds, Vol.48, No.1-2, pp. 151-156, (2007).
38.G. Lasko, P. Hahner and S. Schmauder, “Finite Element Simulation of the Portevin-LeChatelier Effect”, Modelling and Simulation in Materials Science and Engineering, Vol. 13, No. 5, pp. 645-656, (2005).
39.陳銘欽, “置換型面心立方固溶合金應變時效之理論探討與鋁-鎂合金應變時效實驗”, 國立成功大學礦冶及材料科學研究所博士論文, 第53頁, 民國82年。
40.T. Kanadani and Y. Yamamoto, “Effect of an Addition of Ag on the Occurrence of Serration in an Al-6% Zn Alloy”, Journal of Japan Institute of Light Metals (Japan), Vol. 48, No. 1, pp. 48-49, (1998).