臺灣博碩士論文加值系統

以diamino-triazole、amino-mercapto-thiazol、以及2,5-dimmercapto-1,3,4-thiadiazole三者作為微尺寸銅電鍍的抑制劑，並在具備120nm溝渠的矽晶圓基板上電鍍銅並且觀察添加劑對填孔能力的影響，同時探討銅層的平整度和導電度。其中以diamino-triazole表現最好，可以達成IBM理論中所謂“superfilling”的效果。
利用無電鍍的方法在高深寬比的陽極氧化鋁的孔洞陣列中生長厚度為20nm左右的銅層以期長成連續的銅管，從表面形貌、成分分析以及導電度的量測來了解奈米尺度下銅層的形貌。

目錄

第一章、緒論 1
第二章、理論與文獻回顧 2
2-1 晶圓銅製程技術簡介 2
2-2 電化學電鍍法 3
2-3 無電鍍法 5
第三章：實驗器材及實驗步驟 8
3-1 分析儀器 8
3-2 實驗步驟 8
3-2-1 I-V measurement 8
3-2-2 銅電鍍 9
3-2-2 無電鍍銅 10
第四章、實驗結果與討論 11
4-1 電鍍銅 11
4-1-1 電鍍添加劑極化曲線測試 12
4-1-2 添加劑對晶圓電鍍後剖面的影響 13
4-1-3 添加劑對晶圓電鍍後電阻值的變化 25
4-1-4 Diamino-triazole對晶圓電鍍後表面形貌的影響 27
4-2 高寬深比奈米結構中的無電鍍銅 28
4-2-1 在矽晶圓上的無電鍍銅 29
4-2-2 在自製陽極氧化鋁上的無電鍍銅 30
4-2-3 中性無電鍍銅配方於自製陽極氧化鋁上的還原效果 32
4-2-4 含PEG抑制劑在自製陽極氧化鋁上的無電鍍銅 35
4-2-5 時間對自製陽極氧化鋁上的無電鍍銅之影響 38
4-2-6 無電鍍銅前處理製程不同對表面形貌的影響 41
4-2-7 在商用陽極氧化鋁上的無電鍍銅 43
4-2-8 無電鍍銅的新製程暨新配方 46
4-2-9 無電鍍銅新配方及製程的最佳化A 51
4-2-10 無電鍍銅新配方及製程的最佳化B 52
4-2-11 無電鍍銅新配方及製程的最佳化C 54
4-2-12 無電鍍銅管之導電度量測 55
第五章、結論與建議 57
第六章、參考文獻 58

第六章、參考文獻


[1] “IBM Makes Breakthrough To Copper” Electronic Buyer News, 09/22/1997
[2] IBM Microelectronic News, September 1,1998
[3] H. G. Creutz, R. M. Stevenson, E. A.Romanowski, “Electrodeposition of Copper From Acidic Bath” U.S. Pat. 3,267,010 1966; 3.288.690 1966.
[4] N. Zukauskaite, A. Malinauskas; 1989, Sov. Electrochem., 24, p1564-1566
[5] J. P. Healy, D. Pletcher; 1992, J. Electroanal. Chem., 338, p167-177
[6] E. E. Fardon, F. C. Walsh, S. A. Campbell; 1995, J. Appl. Electrochem., 25, p574-583
[7] P. Tephaisitphongse, Y. G. Cao, A. C. West; 2001, J. Electrochem. Soc., 148, C492-C497
[8] M. Yokoi, S. Konishi, T. Hayashi; 1984, Denki Kagaku, 52, 218-223
[9] J. P. Healy, D. Pletcher; 1992, J. Electroanal. Chem., 338, 155-165
[10] L. Bonou, M. Eyraud, R. Denoyel, Y. Massinai; 2002, Electrochim. Acta., 47, 4139-4148
[11] T.P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford, D. Josell; 2000, J. Electrochem. Soc., 147, p4524-4535
[12] T.P. Moffat, D. Wheeler, W. H. Huber, D. Josell; 2001, Electrochem. Solid-State Lett., 4, C26-C29
[13] D. Josell, D. Wheeler, W. H. Huber, T.P. Moffat; 2001, Phys. Rev. Lett., 87, 16012-1-16012-4
[14] D. Josell, D. Wheeler, W. H. Huber,J. E. Bonevich, T. P. Moffat; 2001, J. Electrochem. Soc., 148,C767-C773
[15] P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, H. Deligianni; 1998, IBM J. Res. Develop. 42, 383
[16] M. Georgiadou, D. Veyret, R. L. Sani, R. C. Alkire; 2001, J. Electrochem. Soc., C54-C58
[17] 方景禮，“電鍍添加劑總論”，傳勝出板社，民國八十五年，第373 頁。
[18] J. J. Kelly, C. Tian, A. C. West; 1999, J. Electrochem. Soc., 146, 2540-2545
[19] J. J. Kelly, A. C. West; 1999, Electrochem. Solid-State Lett., 2, 561-563
[20] A. C. West; 2000, J. Electrochem. Soc., 147, 227-232
[21] Y. Cao, P. Taephaisitphongse, R. K. Chalupa, A. C. West; 2001, J. Electrochem. Soc., 148, C466-C472
[22] J. Reid; 2001, Jpn. J. Appl. Phys., 40, 2650-2657
[23] A. C. West, S. Mayer, J. Reid; 2001, Electrochem. Solid-State Lett., 4, C50-C53
[24] J. Reid, C. Gack, S. J. Hearne; 2003, Electrochem. Solid-State Lett., 6, C26-C29
[25] M. Hayase, M. Taketani, K. Aizawa, T. I. Hatuzawa, K. Hayabusa; 2002, Electrochem. Solid-State Lett., 5, C98-C101
[26] J. J. Kelly, A. C. West; 1998, J. Electrochem. Soc., 145(10) 3477-3481
[27] S. C. Chang et al; 2000, American Vacuum Society Conference. P.56
[28] S. Y. Chiu et al; 2000, J. Vac. Sci. Technol. B, 18, 2835
[29] 方景禮，“電鍍添加劑總論”，傳勝出板社，民國八十五年，第81 頁。
[30] C. Orden, D. Tench; 1981, J. Electrochem. Soc., 128, 539
[31] Shih-Chieh Chang, Jia-Min Shieh, Bau-Tong Dai, Min-Shian Feng, Ying-Hao Li; 2002, J. Electrochem. Soc, 149(9), G535-G538
[32] Kun-Cheng Lin, Jia-Min Shieh, Shih-Chieh Chang, Bau-Tong Dai, Chia-Fu Chen and Ming-Shiann Feng; 2002, J. Vac. Sci. Technol. B, 20(3), May/Jun
[33] Shao-Yu Chiu, Jia-Min Shieh, Shih-Chieh Chang, Bau-Tong Dai, Chia-Fu Chen and Ming-Shiann Feng; 2000, J. Vac. Sci. Technol. B, 18(6), Nov/Dec
[34] Shou-Yi Chang, Chi-Wei Lin, Hong-Hui Hsu, Jui-Hua Fang, Su-Jien Lin; 2004, Journal of The Electrochemical Society, 151(1) C81-C88
[35] Shou-Yi Chang, Chia-Jung Hsu, Ray-Hua Fang, and Su-Jien Lin; 2003, Journal of The Electrochemical Society, 150(9) C603-C607
[36] Nan Li, Xiaotian Li, Xiaoju Yina, Wei Wang, Shilun Qiu; 2004, Solid State Communications , 132, 841–844
[37] Wei Wang , Nan Li, Xiaotian Li, Wangchang Geng , Shilun Qiu; 2006, Materials Research Bulletin ,41, 1417–1423
[38] Mordechay Schlesinger, Milan Paunovic; “Modern Electroplating”, fourth edition
[39] Valery M. Dubin, Yosi Shacham-Diamand; 1997, J. Electrochem. Soc., Vol. 144, No. 3, March
[40]方景禮，“電鍍添加劑總論”，傳勝出板社，民國八十五年。
[41] P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, H. Deligianni; 1998, IBM J. Res. Develop. 42, No. 4, p.383