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研究生:廖大維
研究生(外文):Da-Wei Liaw
論文名稱:高熔點金屬紅外線硬銲之研究
論文名稱(外文):The Study of Infrared Brazing Refractory Metals
指導教授:郭東昊
指導教授(外文):DONG-HAO GUO
學位類別:博士
校院名稱:國立東華大學
系所名稱:材料科學與工程學系
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2007
畢業學年度:95
語文別:中文
論文頁數:126
中文關鍵詞:硬銲填料鈦合金紅外線真空硬銲顯微組織相變態
外文關鍵詞:Infrared BrazingTitanium AlloysRefractory MetalsBrazing FillersMicrostructurePhase Transformation
相關次數:
  • 被引用被引用:1
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  • 下載下載:39
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本研究分別以銀基填料、金基填料及鈦基填料真空硬銲接合異種高熔點金屬進行實驗。對於銀基填料硬銲接合Ti-6Al-4V及鈮金屬之研究中,自接合界面顯微組織之演化可發現,硬銲填料皆會於界面生成Ti-Ag、Ti-Cu與Ti-Al等介金屬化合物。隨著硬銲的溫度與(或)時間的增加,這些介金屬化合物會成長導致試片之剪力強度減少。對於金基填料紅外線硬銲接合鉬金屬之研究中,在銲道上可觀察到富金相、富鎳相與MoNi介金屬化合物的形成。且隨著硬銲的溫度與(或)時間的增加,會造成塊狀的MoNi介金屬化合物形成,並將會劣化接合界面的接合強度。在上述的研究中發現,藉由紅外線快速硬銲製程,將能有效的抑制使用銀基與金基填料時,位於銲道界面之介金屬化合物的過度成長。另一方面,對於可以使用於較高溫度下的鈦基填料硬銲接合Ti-6Al-4V及鈮金屬之研究中,可觀察到銲道主要是由Ti2Cu、Ti2Ni與變態β-Ti所組成。隨著硬銲的溫度與(或)時間的增加,Ti2Cu、Ti2Ni等介金屬化合物將會消失於銲道內、且部分β-Ti因固溶有大量的Nb而存在於室溫之下。此介金屬化合物消失的現象明顯不同於使用銀基與金基填料之硬銲接點。由於具脆性的介金屬相將可完全消失於銲道中,故未來使用鈦基填料硬銲將有很大的應用潛力。
The purpose of this investigation is focused in vacuum brazing dissimilar refractory metals using Ag, Au and
Ti-based braze alloys, respectively. Based on the microstructural observation of brazed Ti-6Al-4V and Nb joint using Ag-based braze alloys, interfacial Ti-Ag,
Ti-Cu and Ti-Al intermetallics are widely found in the joint. The growth of these intermetallics is increased with increasing the brazing temperature and/or time, and results in deteriorating shear strength of the joint.
For the infrared brazed Mo using 70Au-22Ni-8Pd filler metal, Au-rich, Ni-rich and MoNi intermetallic compound are formed in the joint. With increasing the brazing temperature and/or time, the formation of blocky MoNi intermetallic compound results in deterioration of
bonding strength. According to the above experimental observation, the use of rapid infrared brazing can effectively inhibit excessive growth of interfacial intermetallics for the application of Ag and Au-based braze alloys. On the other hand, Ti-6Al-4V and Nb are brazed using Ti-based braze alloys for high-temperature applications. The joint mainly consists of Ti2Cu, Ti2Ni and transformed beta-Ti. With increasing the brazing temperature and/or time, Ti2Cu and Ti2Ni intermetallics are disappeared from the brazed joint, and part of beta-Ti is stabilized at room temperature due to alloyed with high Nb content. The disappearance of intermetallics from joint using the Ti-based braze alloys is very different from that using Ag and Au-based braze alloys. Accordingly, the application of Ti-based braze alloys shows great potential due to the disappearance of brittle intermetallics from the brazed joint.
第一章 前言..........................................1
第二章 文獻探討......................................6
第三章 實驗方法......................................10
第四章 使用銀基填料硬銲接合Ti-6Al-4V及鈮金屬.........22
第五章 使用70Au-22Ni-8Pd填料紅外線硬銲接合鉬金屬.....53
第六章 使用鈦基填料硬銲接合Ti-6Al-4V及鈮金屬.........67
第七章 結論..........................................114
參考文獻.............................................121
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