|
1. 福岡義孝 著, 王姝雯 譯, 陳信文 審;電子構裝技術; p4~p5(2004). 2. 陳信文, 陳立軒, 林永森, 陳志銘; 電子構裝技術與材料; p85. 3. J. W. Jang, P. G. Kim, K. N. Tu and M. Lee; Materials Research Society; 14(10); 3895(1999). 4. J. H. Kim, S. W. Jeong, H. M. Lee; Journal of Electronic Materials; 31(6); 557(2002). 5. T. L. Shao, K. C. Lin, C. Chen; Journal of Electronic Materials; 32(11); 1278(2003). 6. 陳信文; 電子材料; 第1期; pp. 74-77(1999). 7. 田島進 編; 許瑞玲,林欣蔚 譯; RoHS綠色指令; 龍璟文化 出版; 2005. 8. E. Bastow; Advanced Materials & Processes; 161(12); 26-29(2003). 9. Workshop on Modeling and Data Needs for Lead-Free Solders(Meeting Report presented at the National Electronics Manufacturing Initiative, New Orleans, LA, 15 February 2001) 10. J. H. Kim, S. W. Jeong, H. M. Lee; Materials Transaction; 43(8); 1873-78 (2002). 11. http://www.efd-inc.com/ 12. R. M. German, R. G. Iacocca, L. G. Campbell, R. Bollina; PCT Int. Appl. ; 48(2002). 13. A. Tanahashi, Z. Sakamoto, K. Oka; Jpn. Kokai Tokkyo Koho; 16(2005). 14. C. Lee, C. Y. Lin, Y. W. Yen; Intermetallics ; xx; 1-11(2007). 15. J. M. Blalock, Jr., J. V. Harding, and W. T. Pell-Walpole; ASM Hankbook Vol.3 Alloy Phase Diagrams, ed. By H. Baker, ASM International, Materials Park, Ohio(1992). 16. C. R. Kao; JOM; 54(12); 44(2002). 17. 陳信文, 吳蒔涵, 許秀鳳, 李守維”無鉛銲料的基礎性質(二)界面反應與物理性質”; 電子材料; 第18期; pp. 144. 18. S. W. Chen, Y. Y. Chuang, Y. A. Chang, and M. G. Chu; Metall. Trans. A ; 22A; 2837 (1991). 19. http://www.dianyuan.com/ 20. Y. A. Chang, S. Chen, F. Zhang, X. Yan, F. Xie, R. S. Fetzer, W. A. Oates; Progress in Materials Science;49;313(2004). 21. 余永寧; 金屬學原理; 冶金工業出版社; 第三章; p97~102. 22. M. Hansen, K. Anderko; Constitution of Binary Alloys; McGraw-Hill Book Co.;1175(1985). 23. B. Predel, W. Schwermann; Journal of the Institute of Metals; 99; 169(1971). 24. K. Iwase, N. Aoki, A. Osawa; Sci. Rep. Tohoku Univ.; 20; 353(1931). 25. A. Stegherr; Dissertation; Techn. Hochschule, Aachen, 1969. 26. W. P. Allen, J. H. Perepezko; Scripta Metallurgica; 24; 2215(1990). 27. V. Vassiliev, M. Lelaurain, J. Hertz; Journal of Alloys Compounds; 247; 223(1997). 28. N. Saunders and A. P. Miodownik; Bulletin of Alloy Phase Diagrams; 11(3); 278-287(1990). 29. Hensen and Elliott, ASM Hankbook Vol.3 Alloy Phase Diagrams, ed. By H. Baker, ASM International, Materials Park, Ohio(1992). 30. E. Gunzel and K. Schubert; Z. Metallkde.; 49; 124-133(1958). 31. P. Shewmon; “Diffusion in Solid”, 2nd edition, TMS; Warrendale, Pennsylvania (1982). 32. G. V. Kidson; Journal of nuclear materials; 3(1); 21-29(1961). 33. Y. Takaku, X. J. Liu, I. Ohnuma, R. Kainuma, K. Ishida; Materials Transaction; 45(3); 646-651(2004). 34. H. K. Kim and K. N. Tu; Physical Review B; 53(23); 16027(1996). 35. X. J. Liu, I. Ohnuma, C. P. Wang, M. Jiang, R. Kainuma, K. Ishida, M. Ode. T. Koyama and T. Suzuki; Journal of Electronic Materials; 32(11); 1265(2003). 36. Y. Watanabe, Y. Fujinaga and H. Iwasaki; Acta Cryst.; B39; 306-311(1983). 37. T. B. Massalski , H. Okamoto, P.R. Subramanian and L. Kacprzak; Binary alloy phase diagrams; Materials Park, ASM International,c1990. 38. P. Villars and L. D. Calvert; Pearson's handbook of crystallographic data for intermetallic phases; Materials Park, OH :ASM International,c1991. 39. K. N. Tu and R. D. Thompson; Acta Metall.; 30; 947-952(1981). 40. S. W. Chen, C. M. Chen and W. C. Liu; Journal of Electronic Materials; 27(11); 1193-1198(1998). 41. 陳伯胤,陳信文; Sn-Sb/Ag界面反應與Sn-Sb-Ag相平衡及液體相線投影; 國立清華大學碩士論文; 附錄(2007).
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