臺灣博碩士論文加值系統

本論文主要結合分析模擬與實驗，探討導光板上網點結構的直徑大小與分佈密度對背光模組整體的輝度及均勻性之影響。由於液晶本身不發光，必須經由背光模組供應光源。背光模組之光源，藉由導光板之網點破壞全反射將光線導向面板方向，提高面板的輝度，並確保面板亮度的均勻性。因此導光板之網點的設計就顯得相當重要。
本研究首先利用光學分析軟體TracePro分析小尺寸側光式背光模組之光學反應。為驗證TracePro分析之可靠性，本研究亦利用UV-LIGA技術製作網點鎳模，配合非接觸式之氣壓加壓方式壓製導光板。最後將導光板配合其它元件組成背光模組，進行光學量測。氣壓壓印能提供均勻之壓力，可增加成品之良率。經由非接觸式壓製之網點微結構具有表面光滑及光學性質良好之特性。所以利用氣壓配合非接觸式壓印，相當適合導光板之製作。
分析模擬與實驗結果相當一致。研究結果顯示網點直徑太大或太小之背光模組，其輝度表現較差，直徑300μm之網點可得到較高的輝度。而網點直徑愈小則輝度均勻性較佳。本文發現不論網點直徑大小，若(網點面積/導光板面積)比值介於0.23∼0.47時，背光模組有最佳之輝度及相對均勻性。

關鍵字：導光板、網點、TracePro、UV-LIGA、非接觸式壓印

Abstract
The brightness of LCD is predominantly influenced by the light guide panel (LGP), which is characterized mainly by the size and density of the microstructure array. In this thesis, the effect of these two important geometric aspects on the luminance of the back light plate (BLP) is investigated. The study is conducted by using both the computer simulation and experimental work.
The optical analysis software TracePro, which is based on the Monte Carlo method, is used to analyze the optical behavior of the BLP. Microstructures with various diameters (d) ranging from 100mm to 600mm are considered. The area ratio is employed to characterize the array density, where p is the pitch of the array. The area ratio considered ranges from 0.1 to 0.9. The effect of the geometric aspects on the average, variation and normalized variation of the luminance are reported. The results reveal that the microstructure with yields the largest magnitude of luminance; meanwhile the microstructure with gives the smallest variation in luminance. The numerical results also show that the microstructures with area ratio between 0.3 and 0.5 produce higher luminance and lower normalized variation in luminance, regardless the size of the microstructure.
Experimental work is also conducted to evaluate the reliability of the simulation. Nickel modes with various diameters of penetrating holes are fabricated using the UV-LIGA process. The mode and PMMA substrate are placed into a pneumatic-press chamber for hot-embossing LGPs. The current process has several advantages over traditional techniques. The nickel mode with penetrating hole is easy to fabricate. The contact-less embossing can produce microstructures with smooth surfaces. Also, the pneumatic press give uniform loading on the mode and substrate and then improve the quality of the microstructures. The microstructures are examined using OM and SEM. The luminance of BLP is measured using the luminance meter. It is found that simulation results are in good agreement with the experimental works.


Key words：light guide panel, contact-less embossing, luminance, TracePro

目錄
誌謝……………………………………………………………………..Ⅰ
摘要……………………………………………………………………..Ⅱ
Abstract…………………………………………………………………Ⅲ
目錄……………………………………………………………………..Ⅵ
表目錄…………………………………………………………………..Ⅸ
圖目錄…………………………………………………………………..Ⅹ
第一章 緒論……………………………………………………………..1
1-1 前言…………………………………………………………….....1
1-2 背光模組簡介………………………………………………….....4
1-3 導光板簡介…………………………………………………….....7
1-3-1 網點製作方式………………………………………….....8
1-3-2 利用模具製作導光板之技術…………………………....11
1-4 研究動機與目的………………………………………………....14
1-5 文獻回顧………………………………………………………....16
1-6 論文大綱………………………………………………………....19
第二章 光學理論與TracePro光學分析軟體....................20
2-1 光學理論………………………………………………………....20
2-1-1反射(Reflection)與折射(Refraction)…………....20
2-1-2全反射(Total Relection)…………………………...23
2-1-3散射(Scattering)…………………………………....24
2-2光度學基本單位……………………………………………....24
2-3 TracePro光學軟體簡介……………………………………….27
第三章 PMMA導光板製作與量測..............................29
3-1 導光板製作流程概述………………………………………….29
3-2 光罩設計與製作……………………………………………….32
3-3 蒸鍍導電層…………………………………………………….35
3-4 網點母模微影製程…………………………………………….38
3-4-1清洗晶圓………………………………………………….......41
3-4-2光阻塗佈(Resist Coating)……………………………….....42
3-4-3軟烤(Soft Bake)…………………………………………......44
3-4-4曝光(Expose)…………………………………………….......45
3-4-5曝後烤(Post Expose Bake)…………………………….......47
3-4-6顯 影( Lithography)……………………………………......48
3-4-7硬烤(Hard Bake)…………………………………………......49
3-5金屬鎳模製作….………………………………..…………….49
3-6導光板壓印成形………………..………………………………51
3-6-1壓印導光板之設備………………………………….……54
3-6-2壓印導光板流程步驟…………………………………….56
3-7導光板微結構量測………………………………………….….60
3-8背光模組組裝及輝度量測……………………………………..64
3-9製程儀器設備與材料特性……………………………………..69
第四章 結果與討論……………………………………….………….70
4-1 TracePro光學模擬流程……..……………………………...70
4-2背光模組之光學模擬結果……………....................77
4-3分析值與量測結果比較………..………………………………89
第五章 結論及未來研究方向………………….…………………...93
參考文獻………………………………………………………….…….95

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