臺灣博碩士論文加值系統

在多層印刷電路板當中，連通柱結構總是被用來連結位於不同層的傳輸線。隨著資料傳輸速率到達數個十億位元的範圍以上，連通柱結構對於信號完整度的影響就必須要被考慮。通常連通柱結構是呈現電容的效應，因此在輸入訊號端可以觀察到電容性的反射波形。
為了減少反射雜訊，本論文使用高阻抗元件來改善連通柱結構所造成的不連續效應，並提出一套有系統的設計流程來加以使用。此外，更提出了新穎的補償方法，即藉由改變清潔環的形狀，使其從圓形變成膠囊狀來達到更寬頻的補償。此補償方法也可有效的應用在差模連通柱結構上。同時也結合二種補償方法對於包含開路殘段的連通柱結構作一補償分析，使整體補償設計更為完整。最後利用時域模擬與量測結果來驗證此方法的正確性。

In the multilayer printed circuit boards (PCBs), the through-hole via transitions are always utilized to link the signal traces between different layers. As the data rates increase up to several GHz, it is essential to consider the significant impact of vias on signal integrity of high-speed digital systems. Usually, it is found to be capacitive and would cause a voltage drop in the time-domain reflectometry (TDR) waveform.
To reduce this reflection noise, this thesis describes a systematic design procedure to improve the electrical performance of multilayer through-hole via transitions by using the high-impedance interconnects. In addition to the thinner transmission line, a novel matching structure is proposed by changing the anti-pad shape from circular to capsular to achieve the better broadband matching condition. The compensation method also applies to a differential via transition successfully. To make the design of compensation more complete, a way of combining two compensation methods applies to the via stub structures. This method is demonstrated by the time-domain simulation and measurements, accordingly.

第一章 研究動機與簡介 .................................. 1
1-1 研究動機 .................................................................................................... 1
1-2文獻回顧 ..................................................................................................... 2
1-3章節概要 ..................................................................................................... 3
1-4貢獻 ............................................................................................................. 4
第二章 連通住結構特性與等效電路模型 .................... 7
2-1連通柱不連續效應分析 .................................................................................. 7
2-1-1 一般連通柱的特性分析 .......................................................................... 9
2-1-2 單根與差模開路殘段連通柱的電路分析與共振特性 .......................... 9
2-2連通柱等效電路 ............................................................................................... 13
2-2-1 單根連通柱等效電路模型 ........................................................................... 13
2-2-2 差模連通柱等效電路模型 ....................................................................... 17
第三章 電容性連通柱結構之補償方法與設計流程 ............33
3-1 補償方法的介紹 .............................................................................................. 33
3-1-1 設計概念與實現 ...................................................................................... 33
3-1-2 設計流程 .................................................................................................. 37
3-2 單根連通柱的補償設計 .................................................................................. 39
3-2-1 第一種補償方法-細線補償 ................................................................... 39
3-2-2 第二種補償方法-膠囊狀(capsule-shaped)的清潔環補償方法 ............. 41
3-2-3 細線補償和膠囊狀清潔環補償的比較 ................................................. 42


3-3 差模連通柱的補償設計 ................................................................................... 43
3-3-1 第一種補償方法-細線補償 .................................................................... .44
3-3-2 第二、三種補償方法-膠囊狀的清潔環補償方法 ................................. 45
3-3-3 細線補償和膠囊狀清潔環補償的比較 .................................................. .46
3-4 實驗模擬與驗證 .............................................................................................. 47
3-4-1 單根連通柱補償方法的實驗驗證 ........................................................... 47
3-4-2 差模連通柱補償方法的實驗驗證 ........................................................... 48
第四章 開路殘段連通柱的補償方法與設計流程 ..............71
4-1 單根開路殘段連通柱的補償設計 .............................................................. 71
4-2 差模開路殘段連通柱的補償設計 .............................................................. 74
第五章 結論 ............................................83
參考文獻 ...............................................85

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