臺灣博碩士論文加值系統

在電燈被發明那一刻起，照明就成為人類生活中不可或缺的一部份，人類的發展也從此邁向新的紀元，隨著科技不斷的發展燈泡的壽命越來越長，同時也越來越亮，不過卻改變不了一個事實，那就是在燈泡發光的同時，大部分的能量是被轉換成熱能消耗掉了。傳統燈具，採用專用鎢絲燈為光源，壽命與耗能已漸不符合能源效益，為了使能量運用的效率提高，我們思考一個可以增強傳統黑體輻射特定波長的微結構，名為『金屬盒子』。
我們在矽晶片上設計並製作由金屬包覆介電質的金屬盒子結構，利用電磁學中空腔共振的原理，我們可以計算出元件增益的訊號。允許在共振腔內的電磁波稱為共振模態，而相應的波長稱為共振波長。
我們嘗試了壓印技術來製作元件，包括以熱壓印及以雷射輔助微米壓印，整個過程包括了曝光、顯影、蝕刻、蒸鍍等標準半導體製程。但最後並無法正確的製作出金屬盒子結構。故我們採用微影製程的方式完成金屬盒子的結構
為了使模擬更容易，我們也設計結構簡單的金屬盒子，尺寸包括1μm、2μm、3μm見方，高度分別為150nm、200nm。我們以這樣的尺寸做模擬所得的結果，初步印證了金屬盒子的可行性
我們模擬藉由改變元件的尺寸，可以調變加熱頻譜的增益訊號，在紅外光波段的實驗與模擬結果也能吻合，以這樣的構想，期望在可見光波段也能有增益的效果，這樣將可因應各種照明或光學應用上的需要。

Since light bulb was invented, lighting has become an essential part of the human civilization advancing towards a new century. Accompany with the unceasing development and advancement of science and technology, light-bulb’s life-span is extended and its brightness is increases. However, the great part of energy from the light bulb is heat. Traditional lights, which use tungsten lamp as the source of light, are not energy efficient in terms of life span and energy consumption. To make efficient use of energy for light, we investigate a microstructure to enhance specific signal of thermal radiation spectrum, named “metallic box”.
We design and fabricate metallic box structures with dielectric cube wrapped by metal on the silicon wafer. Applying the theorem of cavity resonance through Maxwell’s equations and boundary conditions, we can calculate the specific spectrum of the component. The allowable EM waves are called resonance modes and the corresponding wavelengths are called resonance wavelengths.
We had tried the imprint technology to fabricate the metallic box, including hot embossing and Laser pulse assisted imprint lithography, the whole process made by standard VLSI process such as exposure, development, dry etch, and evaporation. We could not fabricate the metallic box accurately by the imprint technology. So we use the conventional lithography technology to accomplish the metallic box.
Our metallic boxes have simple resonant cavity structure for a complete simulation for verification of our design. The dimension of the dielectric cubes is designed to be 1μm、2μm、3μm in square, and their height is 150nm or 200nm. After simulating the metallic box with such dimensions, we prove the feasibility of metallic box preliminarily
We can vary the dimension of metallic box to change the spectrum of thermal radiation. In infrared band, we can approximately match the experiment and the simulation. It is expected that we can enhance the signal in visible light band for future illumination and optical applications using this concept.

目 錄
口試委員會審定書----------------------------------------------------------------I
誌謝---------------------------------------------------------------------------------II
中文摘要--------------------------------------------------------------------------III
英文摘要-------------------------------------------------------------------------IV
第一章 簡介-----------------------------------------------------------------------1
1.1 簡介-----------------------------------------------------------------------1
1.2 論文導覽-----------------------------------------------------------------3
1.3 參考文獻-----------------------------------------------------------------5
第二章 微米尺寸之金屬光子盒子原理--------------------------------------6
2.1 簡介-----------------------------------------------------------------------6
2.2 空腔共振器原理--------------------------------------------------------7
2.3 參考文獻----------------------------------------------------------------10
第三章 以微米壓印技術(高分子材料加熱轉印)試做-------------------12
3.1 矽母模的製備----------------------------------------------------------12
3.2 微影製程----------------------------------------------------------------13
3.3 金屬薄膜沉積----------------------------------------------------------18
3.4 lift-off母模製程-------------------------------------------------------20
3.5 反應離子蝕刻(對Si)--------------------------------------------------22
3.6 以高分子材料之微影壓印試做及其結果-------------------------27
3.7 以高分子材料進行加熱轉印製作金屬盒子之可能與討論----31
3.8 參考文獻----------------------------------------------------------------32
第四章 以微米壓印技術(雷射輔助微影壓印)試做----------------------33
4.1 石英母模之製備-------------------------------------------------------33
4.2 深紫外光微影----------------------------------------------------------35
4.3 反應離子蝕刻(對SiO2)-----------------------------------------------38
4.4 雷射輔助微影壓印之試做及其結果-------------------------------43
4.5 以雷射輔助微影壓印製作金屬盒子之可能與討論-------------49
4.6 參考文獻----------------------------------------------------------------50
第五章 以微影方式製作微米金屬盒子------------------------------------52
5.1 簡介----------------------------------------------------------------------52
5.2 微米金屬盒子的製作(以微影方式定義圖案)--------------------53
5.3 改善金屬盒子製程方式(以金蝕刻液)-----------------------------56
5.4 製作微米金屬盒子的結果-------------------------------------------58
第六章 元件加熱頻譜量測---------------------------------------------------61
6.1 加熱頻譜量測架構----------------------------------------------------61
6.2 加熱頻譜的量測結果-------------------------------------------------63
6.3 加熱頻譜與模擬比較與討論----------------------------------------67
第七章 總結---------------------------------------------------------------------71
7.1 結論----------------------------------------------------------------------71
7.2 未來展望----------------------------------------------------------------73
附錄----------------------------------------------------------------------------------i
附錄一 圖目錄-------------------------------------------------------------i
附錄二 表目錄------------------------------------------------------------iv

參考文獻於歌章最後一節