參考文獻
[1]K.E. Petersen and C.R. Guarnieri, “Young’s modulus measurements of thin films using micromechanics,” Journal of Applied Physic, 50(11), pp. 6761-6766(1979).
[2]K. Najafi and K. Suzuki, “A Novel Technique and Structure for the Measurement of Intrinsic Stress and Young's Modulus of Thin Films,” Proceeding of the IEEE MEMS, Salk Lake City, UT, Feb., pp. 96-97(1989).
[3]Q. Zou, Z. Li and L. Liu, “New methods for measuring mechanical properties of thin films in micromachining: beam pull-in voltage (Vpi) method and long beam deflection (LBD) method,” Sensors and Actuators A, 48, pp. 137-143(1995).
[4]J. J. Vlassak and W. D. Nix, “A new bulge test technique for the determination of Young’s modulus and Poisson’s ratio of thin films,” Journal of Materials Research, 7(12), pp. 3242-3249(1992).
[5]P. M. Osterberg and S. D. Senturia, “M-test: a test chip for MEMS material property measurement using electrostatically actuated test structures,” Journal of Microelectromechanical Systems, 6(2), June, pp. 107-118(1997).
[6] R. K. Gupta, “Electrostatic pull-in test structure design for in-situ mechanical property measurements of microelectromechanical system (MEMS),” Ph.D. thesis, MIT(1997).
[7] T. Tsuchiya, O. Tabata, J Sakata and Y. Taga, “Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films,” Journal of Microelectromechanical Systems, 7(1), pp. 106-113(1998).
[8]W. N. Sharpe, Jr., B. Yuan, and R. L. Edwards, “Measurements of Young’s modulus, Poisson’s ratio, and tensile strength of Poly-silicon,” Proceeding of the IEEE MEMS, pp. 424-429(1997).
[9] C. Serre, P. Gorostiza, A. Perez-Rodriguez, F. Sanz and J.R. Morante, “Measurement of micromechanical properties of polysilicon micro- structures with an atomic force microscope,” Sensors and Actuators A, 67, pp. 215-219(1998).
[10] C. Serre, A. Perez, J. Morante, P. Gorostiza and J. Esteve, “Determination of micromechanical properties of thin films by beam bending measurements with an atomic force microscope,” Sensors and Actuators A, (74), pp. 134-138(1999).
[11] Y. Hirai, Y. Marushima, K. Nishikawa and Y. Tanaka “Young’s modulus evaluation of Si thin film fabricated by compatible process with Si MEMS’s,” International Microprocesses and Nanotechnology Conference, 11-13, July, pp. 82-83(2000).
[12] H. Guckel, D.W. Burns, H.A.C. Tilmans, C.C.G. Visser, D. DeRoo, T.R. Christenson, P.J. Klomberg, J.J. Sniegowski, and D.H. Jones, “Processing conditions for polysilicon films with tensile strain for large aspect ratio microstructures,” Technical Digest of IEEE Solid-State Sensor and Actuator Workshop, June 6-9, pp. 51-56(1988).
[13] H. Guckel, D.W. Burns, H.A.C. Tilmans, D. DeRoo, and C. Rutigliano, “Mechanical properties of fine grained polysilicon the repeatability issue,” Technical Digest of IEEE Solid-State Sensor and Actuator Workshop, June 6-9, pp. 96-99(1988).
[14] H. Guckel, D.W. Burns, C.C.G. Visser, H.A.C. Tilmans and D. DeRoo, “Fine grained polysilicon films with built-in tensile strain,” IEEE Transactions on Electron Devices, ED-35, 6, June, pp. 800-801(1988).
[15] H. Guckel, D.W. Burns, C. Rutigliano, E. Lovell and B. Choi, “Diagnostic microstructures for the measurement of intrinsic strain in thin films,” Journal of Micromechanics and Microengineering, 2, pp. 86-95(1992).
[16] W. Fang and J.A. Wickert, “Comment on measuring thin-film stresses using bi-layer micromachined beams,” Journal of Micromechanics and Microengineering, 5, pp. 276-281(1995).
[17] W. Fang and J.A. Wickert, “Determining mean and gradient residual stress in thin films using micromachined cantilevers,” Journal of Micromechanics and Microengineering, 6, pp. 301-309(1996).
[18] X. Zhang, T. Y. Zhang, and Y. Zohar, “Measurements of residual stress in thin films using micro-rotating-structures,” Thin Solid Films, pp. 97-105(1998).
[19]J. Wylde and T. J. Hubbard, “Elastic properties and vibration of micro-machined structures subject to residual stress,” Proceedings of the 1999 IEEE Canadian conference on electrical and computer engineering, Shaw conference center, Edmonton, Alberta, Canada, May 9-12, pp. 1674-1679(1999).
[20] S. Pamidighantam, R. Puers, K. Baert and H. A C Tilmans, “Pull-in voltage analysis of electrostatically actuated beam structures with fixed–fixed and fixed–free end conditions,” Journal of Micromechanics and Microengineering, 12, pp. 458-464(2002).
[21] C O’Mahony, M Hill, R Duane and A Mathewson, “Analysis of electromechanical boundary effects on the pull-in of micromachined fixed–fixed beams,” Journal of Micromechanics and Microengineering, 13, pp. S75-S80(2003).
[22] W.H.Chang, “Analytic IC-metal-line capacitance formulas,” IEEE Trans. Microw. Theory Tech. 24 608–11(1976).
[23] N.V.D. Meijs and J.T. Fokkema, “VLSI circuit reconstruction from masktopology,” Integr. VLSI J. 2, pp. 85-119(1984).
[24] S. Chowdhury, M Ahmadi and W. C Miller,”A closed-form model for he pull-in voltage of electrostatically actuated cantilever beams,” Journal of micromechanics and microengineering, Feb., pp. 756-763(2005).
[25] M.Chinmulgund, R.B.Inturi, J.A.Barnard, “Effect of Ar gas pressure on growth, structure, and mechanical properties of sputtered Ti, Al, TiAl, and Ti3Al films,” Thin Solid Films, 270, pp. 260-263(1995).
[26] Y.Y Myoungkyu Park, and K. Chun, “A sticking model of suspended poly-silicon microstructure including residual stress gradient and postrelease temperature ,” Journal of Microelectromechanical Systems, 7(3), Sep., pp. 339-344(1998).
[27] Y. C. Hu, C. M. Chang and S. C. Huang, “Some design considerations on the electrostatically actuated microstructures,” Sensors and Actuators A, Vol. 112, pp. 155-161 (2004).
[28] 張接明, “靜電驅動微結構體之動態與穩定性分析,” 國立台灣科技大 學機械工程系碩士學位論文(2002).[29] 王永祥, “承受靜電力之微型板的穩定性分析,” 國立台灣科技大學機 械工程系碩士學位論文(2003).[30] 蔡侑文, “微型曲樑之臨界電壓的解析解,” 國立台灣科技大學機 械工程系碩士學位論文(2005)[31] 方維倫, “微機械製造結構於薄膜殘餘應力量測之應用,” 科儀新知, 第十八卷, 第三期, Dec., pp. 68-82(1996).