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研究生:趙育陞
研究生(外文):Yu-Sheng Chao
論文名稱:導熱性與熱阻測量技術之研究
論文名稱(外文):The researcrh of The Measurement Techniques for Thermal Conductivity and Thermal Resistance
指導教授:黃振康
口試委員:李貫銘蘇程裕
口試日期:2007-07-10
學位類別:碩士
校院名稱:國立臺北科技大學
系所名稱:製造科技研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2007
畢業學年度:95
語文別:中文
論文頁數:82
中文關鍵詞:導熱性熱阻
外文關鍵詞:Thermal ConductivityThermal Resistance
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為解決電子元件之發熱密度、發熱量快速增加與延長使用壽命,須仰賴優異之熱管理,而要達成此目標則需經過精準之熱性質測量。隨著產品輕薄短小化之設計、新材料之開發與運用,使得電子元件材料之熱力性質測量越來越困難,當樣品之尺寸越輕薄短小,其在測量時越容易產生誤差,這些誤差通常會使得熱管理上產生些許變數。因此除了擁有一套高可靠度與重複性佳之熱性質測量系統外,還須針對不同樣品設計出適合的測試方法與測試條件,而本研究主要是對導熱性與熱阻作研究,其中也運用一種平板式之導熱性測試,配合COSMOSFloWorks模擬分析,專為測試薄板材料之導熱性。
導熱性實驗上測試了銅、發泡碳與銲料之導熱性,實驗結果顯示可以精確測得厚板材料之導熱性。平板式導熱性分別測試了銅板與銲料,利用COSMOSFloWorks模擬分析後,發現實驗與模擬之數據誤差在0.6OC以內。熱阻實驗分別測試了銅鰭片、鋁鰭片、發泡碳鰭片以及利用銲料接合銅基底與發泡碳鰭片,實驗結果顯示發泡碳鰭片於自然對流之情況下,其熱阻較鋁、銅鰭片低。
In order to solve the high power density and power generation of modern electronics, and extend the service lifetime, an excellent thermal management is necessary. The goal can be achieved only through the precision measurement of thermal properties. While products become lighter, thinner, shorter and smaller, it is more and more difficult to measure the thermal properties of components. For samples of this kind, temperature measurement error is always on the same order of temperature difference we want to measure. Consequently, a set of high reliance and precision thermal measuring system is designed to test various samples. This researches focus on the techniques of measurement for thermal conductivity and thermal resistance. Besides, with compliant with numerical simulation, the thermal conductivity of thin sample is also measurable.
The conductivities of copper, foam carbon and solder are measured, and the results show good precision while measuring thick samples. Thin copper and solder samples are also tested. By using the numerical simulation of COSMOSFloWorks, it is found the experiments and numerical simulation data is very close, within 0.6OC. Experiments for the thermal resistance of copper, aluminum, and foam carbon heat sink with solder joint copper basis, and foam carbon heat sink are also performed. The nature convection experiments data show that the thermal resistance of carbon foam is better than aluminum and cooper heat sinks.
目 錄

摘要 i
英文摘要 ii
誌謝 iii
目錄 iv
表目錄 vi
圖目錄 vii
第一章 緒論 1
1.1 背景 1
1.2 研究動機 5
第二章 文獻回顧 6
2.1 接觸熱阻 6
2.2 接觸熱阻設備之發展 10
2.3 導熱性測量之規範 16
第三章 實驗設備與方法 18
3.1 導熱性測量之實驗設備與方法 18
3.1.1 熱源模組 19
3.1.2 壓力模組 31
3.1.3 環境控制系統 32
3.1.4 冷卻系統 32
3.1.5 溫度擷取系統 33
3.1.6 實驗方法 34
3.2 平板式之導熱性測試之實驗設備與方法 34
3.2.1 熱源系統 35
3.2.2 冷卻系統 36
3.2.3 實驗方法 36
3.3 熱阻測試之實驗設備與方法 37
3.3.1 冷卻系統 38
3.3.2 治具製作 38
3.3.3 實驗方法 39
第四章 結果與討論 40
4.1 材料之導熱性測試 40
4.1.1 純銅導熱性測試 42
4.1.2 發泡碳導熱性測試 44
4.1.3 Sn-Ag-Cu銲料 46
4.2 平板式之導熱性測試 46
4.2.1 銅樣本之測試 48
4.2.1 Sn-Bi銲料樣本之測試 52
4.3 熱阻測試 54
4.3.1 自然對流下之熱阻測試 54
4.3.2 強制然對流下之熱阻測試 66
第五章 結論與建議 76
5.1 結論 76
5.2 建議 76
參考文獻 78
符號彙編 81
參考文獻

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