本論文研討主要研究4.25Gb/s光收發模組之製作與特性之量測。4.25Gb/s光收發模組分別由光發射與光接收模組所組成；光發射模組由驅動晶片(MAX3795)及積體電路與面射型半導體雷射(vertical-cavity surface-emitting laser，簡稱VCSEL)所組成，驅動晶體雷射之驅動電流與調變電流，使雷射產生一定之光強度與消光比。光接收模組由檢光二極體、轉阻放大器(trans-impedance amplifier, TIA)及限制放大器(limiting amplifier, LA)所組成。爲達成4.25Gb/s之特性，本論文深入探討射頻元件之特性，包含基礎元件之研究例如電容、電感及電阻於射頻時之響應模式，並對線路之佈局加以分析，以避免電磁串音(electromagnetic crosstalk)或雜訊干擾，以及完成良好之阻抗匹配以避免反射損失。
最後克服零件佈局之困擾，將設計完成之線路佈局於小型化模組內(Small Form Factor)，以真正深入探討小型化後所需之佈局要求。並在4.25 Gb/s 傳輸速率下量測其眼圖，結果能符合TI masking 的規範。

In this thesis, we mainly discuss the fabrication and performance of the 4.25Gb/s optical module applied in optical communication network. The 4.25Gb/s optical module consists of transmitter and receiver. The transmitters are composed by laser driver IC and 850nm VCSEL; the laser drive IC mainly provides bias current and modulation current to make laser diode operate in suitable for extinction ratio and output optical power. The receivers are composed by photo detector and TIA and limiting amplifier. In order to archive performance of 4.25Gb/s, we further discuss components of radio frequency, including resistor, capacitor and inductor, we also analyze PCB layout to avoid electromagnetic crosstalk and noise; beside we try to find the better impedance match to avoid reflected signal.
Eventually, we solved difficulty of PCB layout to put all the components into the module of small from factor, also measured 4.25Gb/s eye diagram to meet the standard of TI.

目 錄

中文摘要 ……………………………………………………………………………...i
Abstract………………………………………………………...……………………..ii
誌謝 …………………………………………………………………………………..iii
目錄 …………………………………………………………………….………..…...iv
圖目錄 ……………………………………………………………………….……....vii
第一章 序論…………..………………...……………………………………….….1
1.1 研究背景……………………………………………….……..………..……….1
1.2 研究目的………………………….…………...….…………..…...……………2
1.3 論文架構與範疇………………………………….……..………….……..……3
第二章 射頻線路設計研討…..……………………………….…………...……4
2.1 概論…………………………………….………...……..………………………4
2.2 被動元件…………………………………………..……………………………5
2.2.1 電阻……………………………….…………..………….…….………..5
2.2.2 電容…………………………………………….………………….…….6
2.2.3 電感………………………………………………..………………….10
2.3 電路板簡介與其阻抗效應……………………………………………………16
2.4 串音…………………………………………………………..……………..…20
2.5 阻抗匹配(Impedance Match)………………………………………….………21
2.6 差動資料傳輸(Differential Data)……………………………………………..22
第三章 光收發模組製作…………………………………...……………….....24
3.1 光收發模組架構…………………………………….……………...…………24
3.2 電源供應單元……..………………………………………….…………..….25
3.3 光發射模組…………………….…………….……………..….……………...27
3.4 光接收模組…………………..………….…………….……...36
3.5 電路板佈線……………………………...….…………….…...39
3.6 小型化光收發模組製作……………...……..….…………...44
第四章 光收發模組量測……………………………...…….....49
4.1 光收發射模組參數分析………………..……..………………49
4.1.1 消光比(Extinction ratio)…………….……...…………..49
4.1.2 時序抖動(Timing jitter)………………………….……….50
4.1.3 眼形圖(Eye-Diagram)…………………………..………….52
4.2 高頻被動元件參數量測………….………………..……………54
4.2.1 概論………………………..…………...….….…………..54
4.2.2 S參數量測…………...………...…….…………………….54
4.2.3 量測結果與分析.………………..…………………………….57
4.3 光發射模組量測…………………………………..………..…58
4.4 光收發模組量測……………..……………………..……………61
4.5 光收發模組誤碼率量測……………………………………………66
第五章 結果與討論………..………….…….…………………68
5.1 結論…………………………………………………………………68
5.2 未來工作.........................................69
參考文獻…………………………………………………....…...70

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