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研究生:劉志宏
研究生(外文):Liu, Chih-Hung
論文名稱:BGA構裝吸濕效應之量測及其對可靠度影響之探討
指導教授:楊德威楊德威引用關係羅本喆
學位類別:碩士
校院名稱:國防大學中正理工學院
系所名稱:兵器系統工程研究所
學門:軍警國防安全學門
學類:軍事學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:62
中文關鍵詞:吸濕應力壓電阻應力感測元件熱濕循環過程
外文關鍵詞:Hygroscopic StressPiezoresistance Stress SensorTemperature-Humidity Cycle
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塑膠構裝係目前構裝技術之主流。雖然其具高產能、尺寸小且價格低廉等優點,但由於塑膠材料易吸收空氣中的水分而膨脹,以及構裝結構中各成份之膨脹係數不匹配,互相推擠下往往造成構裝可靠度極大挑戰。基於此,本研究旨在進行構裝內部吸濕應力之量測,以及探討其對可靠度之影響。
本研究採用壓電阻應力感測元件作為應力檢測工具,以便即時且非破壞性地監測構裝內部應力變化情形。至於在研究步驟上,首先以壓電阻應力計萃取晶片焊接至電路板製程時所產生之應力,接著依照JEDEC所規範之標準量測構裝內晶片在焊上電路板後所受之應力。經過烘烤過程,發現晶片上承受壓縮應力之影響約為-29 MPa至-47 MPa之間,再歷經潤濕過程發現晶片上承受拉伸應力之影響約為48 MPa至68 MPa之間,但兩項實驗過程所產生應力之影響均不足以使得晶片造成損壞。最後,將構裝試片放置於熱濕循環過程中監測其應力變化情形,以及了解構裝之可靠度。實驗結果發現隨著循環次數的增加,晶片內部所承受之拉伸應力值愈來愈大,且隨著此疲勞測試時間增長,壓電阻元件損壞之機率增加,顯示在多次熱濕循環後晶片可靠度將會劣化。
Plastic packaging is the mainstream on packaging technology at present. Although it takes the advantage of high capacity, small size, and low price, plastic packaging still suffers from mismatch of hygroscopic swelling on different materials in the packaging structure. To this end, the hygroscopic stress on the chip inside plastic packaging is measured, and it’s effect on reliability issues are investigated in this study.
In this work, piezoresistance stress sensors were employed as the experimental tool to monitor the stress variations in the packaging real-time and non-destructively, and stress due to the board-mounting process was first extracted. In accordance with the JEDEC standard, baking process was next performed and about -29 MPa to -47 MPa of stress was measured. The moisture preconditioning process was then operated and 48 MPa to 68 MPa of tensile stresses were obtained. It was also found that both baking and moisture preconditioning do not lead chip damage. Finally, the temperature-humidity cycle test was executed to monitor stress variation for reliability issues of the packaging. After measurements, it was concluded that as the cycle number increased, not only higher tensile stress on chip inside the packaging structure was measured, but the damage probability was also rising.
誌謝 ii
摘要 iv
ABSTRACT v
目錄 vi
表目錄 viii
圖目錄 ix
符號說明 xi
1. 緒論 1
1.1 前言 1
1.2 何謂電子構裝 4
1.3 電子構裝技術層級之區分與分類型式 5
1.4 電子構裝製程技術之流程 8
1.5 研究動機 10
1.6 相關論文研究之回顧 11
1.7 論文架構 12
2. 相關理論分析研究 13
2.1 吸濕效應之探究 13
2.2 可靠度基礎理論分析 14
2.3 壓電阻應力感測元件 16
2.3.1 壓電阻應力感測元件佈局圖形 17
2.3.2 壓電阻元件理論基礎 18
3. 實驗規劃 24
3.1 試驗晶片規格介紹 24
3.2 實驗儀器說明介紹 29
3.2.1 掃描式聲波顯微鏡 29
3.2.2 恆溫式烤箱 29
3.2.3 電子天平 29
3.2.4 恆溫恆濕試驗機 30
3.2.5 自動數據擷取器 30
3.2.6 實驗器材架設 30
3.3 實驗流程 31
3.3.1 SAM掃描與構裝晶片最初電阻值量測 32
3.3.2 晶片焊接至電路板後電阻值之量測 33
3.3.3 烘烤乾燥過程 33
3.3.4 預先潤濕過程說明 34
3.3.5 熱濕循環狀態下晶片可靠度測試步驟介紹 34
4. 結果與討論 36
4.1 初始SAM檢測 36
4.2 晶片焊接至電路板前後應力大小之比較 39
4.3 晶片烘烤乾燥過程應力變化 41
4.4 預先潤濕過程試驗結果 42
4.5 熱濕循環狀態下可靠度測試結果 44
5. 結論及未來展望 58
參考文獻 60
自傳 63
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