[1]K. Matsumoto, S. Takahashi, M. Ishii, M. Hoshi, A. Kurokawa, S.Ichimura, A. Ando, Jpn. J. Appl. Phys, Part 1 34 , P.387 (1995).
[2]K. Matsumoto, M. Ishii, K. Segawa, Y. Oka, B. J. Vartanian, and J. S.Harris, Appl. Phys. Lett. 68, P.34 (1994).
[3]K. Matsumoto, Proc. IEEE 85, P.612 (1997).
[4]Bädeker K., Ann.Phys. (Leipzig), 22, P.749~766 (1907).
[5]Su-Shia Lin, Jow-Lay Huang.Ceramic international, Vol.30 P.497-501(2004).
[6]Vinay Gupta and Abhai Mansingh ,J. Appl. Phys.Vol.80, P.15 ( 1996).
[7]H. S. Bae, J. H. Kim, and Seongil Im Electrochemical and Solid Letters, Vol.7, P.279-281(2004).
[8]Liang-Yih Chen.Wen-Hwa Chen, Jia-Jun wang, and Franklin Chau-Nan Hong Applied Physics Letters, Vol.85, P.23 (2003).
[9]Z. L. Pei, C. Sun, M. H. Tan, J. Q. Xiao, D. H. Guan, R. F. Huang and L. S. Wen, J. Appl. Phys, Vol.90, P.3432(2001).
[10]T. Minami, MRS Bull, P. 38(2000).
[11]U. Ozgur, Ya. I. Alivov, C. Liu, A. Teke, M. A. Reshchikov, S. Dogan, V.
[12]葉安義,「奈米科技與食品」,科學發展, 384期 P.44-49,2004年。
[13]許國銓,“科技玻璃-高性能透明導電玻璃”,材料與社會, 84,P.110-119,1993。[14]Yasuhiro Igasaki and Hiromi Saito, Thin Solid Films, 199, P.223 (1991).
[15]Takashi Komaru at al., Jpn. J. Appl. Phys. Part I, 38, P.5796 (1999).
[16]M.T. Young and S.D. Kenu, Thin Solid Films, 410, P.8 (2002).
[17]Y. Hayashi, K. Kondo, K. Murai, T. Moriga, I. Nakabayashi, H. Fukumoto, K. Tominaga Vacuum 74 , P.607–611 (2004).
[18]J.H. Ko, I.H. Kim, D. Kim , K.S. Lee , T.S. Lee , B. Cheong , W.M. KimApplied ,Surface Science, 253, P.7398–7403 (2004).
[19]E C¸ etin¨org¨u1,2,4 and S Goldsmith,J. Phys. D: Appl. Phys. 40, P.5220–5226 (2007).
[20]I. Hamberg and C. G. Granqvist, The American Physical Society, 30, P.3240~3249 (1984).
[21]Z. L. Pei, C. Sun, M. H. Tan, J. Q. Xiao, D. H. Guan, R. F. Huang and L. S. Wen, Appl. Phys, Vol 90 , P.3432 (2001).
[22]T. Minami, H. Nanto, and S. Takata, Jpn. J. Appl. Phys. 24, L605 (1985).
[23]曲威光,「細說奈米枓技與微製造產業」,新陸書局股份有限公司,P.415。
[24]H. Masuda, F. Hasegwa, S. Ono, J. Electrochem. Soc. 144, L127 (1997).
[25]G. E. Thompson, Thin Solid Film 297, P.192 (1997).
[26]F. Li, L. Zhang, R. M. Metzger, Chem. Mater. 10, P. 2470 (1998).
[27]P.M. Paulus, F. Luis, M. Kroll, G. Schmid, L.J. de Jongh, Journal of Magnetism and Magnetic Materials, 224, P.180-196 (2001).
[28]Y.C. Sui, B.Z. Cui, L. Martez, R. Perez, D.J. Sellmyer, Thin Solid Films, 406, P.64-69, (2002).
[29]H. Masuda and K. Fukuda, Science, vol.368, P.1466-1468 ,1995.
[30]A. P. Li, F. A. Birner, K. Nielsch, and U. Gosele, Journal of Applied Physics, vol.84, no.11, P.6023-6026 (1998).
[31]Y. Li, G. W. Meng, and L. D. Zhang, Applied Physics Letters, vol.76, no.15, P.2011-2013 (2000).
[32]R. J. Tonucci, B. L. Justus, A. J. Campillo, and C. E. Ford, Science, vol.258, P.783-787 (1992).
[33]T. W. Whitney, J. S. Jiang, P. C. Searson, and C. L. Chjen, , Science, vol.261, P.1316-1319 (1993).
[34]F. Keller, M. S. Hunter, and D. L. Robinson, Journal of the Electrochemical Society, vol.100, P.411-419, (1953).
[35]H. Masuda, F. Hasegawa, and S. Ono, Journal of the Electrochemical Society, vol.144, L127-130, (1997).
[36]O. Jessensky, F. Muller, and U. Gosele, Applied Physics Letters, vol.72, P.1173-1175, (1998).
[37]H. Konno, K. Utaka, and R. Furuichi, Corrosion Science, vol. 38, P.2247-2256, (1996).
[38]A. Mozalev, A. Surganov, and S. Magaino, Electrochimica Acta, vol.44, P.3891-3898, (1999).
[39]H. Masuda, H. Yamada, M. Satoh, H. Asoh, M. Nakao, and T. Tamamura, Applied Physics Letters, vol.71, P.2770-2772 , (1997).
[40]O. Jessensky, F. Muller, and U. Gosele, Journal of the Electrochemical Society, vol.145, P.3735-3740, (1998).
[41]A. Mozalev, S. Magaino, and H. Imai, Electrochimica Acta, vol.46, P.2825-2834, (2001).
[42]P. Veluchamy and H. Minoura, Journal of Electroanalytical Chemistry, vol.440, P.41-49, (1997).
[43]S. Lazarouk, S. Katsouba, A. Leshok, A. Demianovich, V. Stanovski, S. Voitech, V. Vysotski, and V. Ponomar, Microelectronic Engineering, vol.50, P.321-327, (2000).
[44]H. H. Shih and S. L. Tzou, Surface and Coating Technology, vol.124, 278-285, (2000).
[45]V. Surganov and A. Mozalev, Microelectronic Engineering, vol.37-38, P.329-334, (1997).
[46]G. Patermarakis and K. Moussoutzanis, Electrochimica Acta, vol.40, P.699-708, (1995).
[47]林育璋,「以氧化鋁奈米多孔模板輔助成長硫化鉛熱電奈米線」,私立逢甲大學電子工程學系研究所碩士論文,民國九十二年。[48]陳志榮,「以Ni觸媒利用MPCVD成長碳奈米管及其特性研究」,私立逢甲大學電子工程學系研究所碩士論文,民國九十三年。