在無塵室內昂貴設備與設施的限制之下，且特徵尺寸縮小、研發時間與研發經費巨增，傳統的半導體製程越來越不利於產品生產，未來發展的瓶頸已能預見。
因此，我們開始尋找另一條新的製程技術來滿足未來的產品需求。其中最價格低廉、製程簡單並兼具量產優勢的方法之一就是奈米壓印。
本論文主要在研究奈米壓印相關之製程技術，特別是以UV-Curing 滾壓的方式，探討其各種參數調變後成型效果之優劣，其中主要探討之參數為：UV膠種類、轉速及輔助輪間隙。本論文亦討論微米尺度的金屬模仁與奈米尺寸PDMS模仁在滾壓中，分別表現出何種成型效果，其成型結果之檢測乃利用表面輪廓儀、SEM、AFM等不同檢測儀器進行精確之觀察，並根據檢測之照片與數據做更進一步的分析與探討。

Because of the limitation arising from the expensive equipments and installments in the clean room, the reduction in feature size of the semiconductor, and the immense increase in R&D time and budget, the traditional manufacturing of the semiconductor have become unfavorable to the production and the bottleneck of the development in the future can be expected.
Therefore, we started to look for a new manufacturing technology to satisfy the product requirements of the future. The “Nanoimprint” is one of the most costless and simplest manufacturing technologies; in addition, it has the advantage of mass production.
This thesis focus on studying the Nanoimprinting related manufacturing technologies, especially the technology called “UV-Curing Roll to Roll Nanoimprint”, and looking into the good and bad of the forming effect after adjusting the parameters. The parameters mainly explored herein are UV glues, motor speed and the gap of adjutant roll.
This thesis also discusses how the metal mold of the nanometer scale and the PDMS mold of the nanometer scale display its forming on the roll to roll nanoimprinting respectively. The forming effect are inspected, measured, and observed precisely by the alpha step, SEM, AFM and etc. different equipments and further analyzed and explored based on the photos and data resulting from such inspection and measurement.

誌謝…………. I
摘要………… III
Abstract…….. IV
目錄…………. V
表錄………… VIII
圖錄………… X
第1章. 緒論 1
1.1. 前言 1
1.2. 奈米壓印的種類 3
1.3. 文獻回顧 13
1.4. 論文架構 14
第2章. 製程及設備介紹 16
2.1. 機台介紹 16
2.2. 材料簡介 25
2.2.1 PET介紹 25
2.2.2 UV膠介紹 28
2.3. 製程參數 29
第3章. 金屬模仁滾壓 30
3.1. 金屬模仁介紹 30
3.2. 滾壓製程 34
3.3. 網點模仁實驗與結果 35
3.4. V溝模仁實驗與結果 40
第4章. PDMS模仁滾壓 46
4.1. PDMS模仁介紹 46
4.2. 滾壓製程 50
4.3. 田口式實驗法簡介 51
4.4. 實驗與結果 52
第5章. 實驗錯誤回修之歷程 58
5.1. 機台修改 58
5.2. 參數確立 61
第6章. 結果分析與討論 63
6.1. 網點模仁滾印結果分析與討論 63
6.1.1 高度分析與討論 63
6.1.2 寬度分析與討論 65
6.2. V溝模仁滾印結果分析與討論 66
6.2.1 高度分析與討論 66
6.2.2 寬度分析與討論 67
6.3. PDMS模仁滾印結果分析與討論 68
6.3.1 高度分析與討論 68
6.3.2 寬度分析與討論 72
第7章. 結論與建議 76
7.1. 結論 76
7.2. 建議與未來展望 77
參考文獻 79
附錄 82
作者簡介 85

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