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[1]Lumley, R. M., “Controlled Separation of Brittle Materials Using a Laser”, American Ceramic Society Bulletin, Vol.48, pp.850-854, 1969. [2]Lumley, R. M., “Initiation of a Controlled Fracture”, U.S. Patent No.3,610,871, Oct. 5, 1971. [3]Tsai, Chwan-Huei and Liou C. S., “Fracture Mechanism of Laser Cutting with Controlled Fracture”, ASME Journalof Manufacturing Science and Engineering,Vol.136, pp. 166-173,2003. [4]Tsai, Chwan-Huei and Chen, C. J., “Formation of the Breaking Surface of Alumina in Laser Cutting with a Controlled Fracture Technique”, proceedings of the Institute of Mechanical Engineers, Part B, Journal of Engineering Manufacture, Vol. 217, pp.489-497, 2003. [5]Tsai, Chwan-Huei and Chen, Chien-Jen, “Application of Iterative Path Revision Technique for Laser Cutting with Controlled Fracture”, Optics and Lasers in Engineering, Vol. 125, pp.519-528, 2004. [6]Verheyen, W., Raes, A., Coopmans, J. P., and Lambert, J. L., “Glass Cutting”, U.S. Patent No. 3,932,726, Jan. 13, 1976. [7]Ikeda, M., Shibata, T., Makino, E., Takahashi, Y., Ono, A., and Matsumoto, F., “Study on Laser Breaking of Glass Plate (1st Report)—Generation and Growth of Vertical Cracks by Scribing—”, (日本)精密工學會誌, Vol. 62, No. 3, pp. 413-417, 1996. [8]Tsai, Chwan-Huei and Huang, Bo-Wen, ”Diamond Scribing and Laser Breaking for LCD Glass substrates”, Journal of Materials Processing Technology, Vol. 198, pp.350-358, 2008. [9]Hoekstra, B., Glebow, B., and Efimov, M., “Method and Apparatus for Separating Non-metallic Substrates Utilizing a Laser Initiated Scribe”, U.S. Patent No. 6,211,488, Apr. 3, 2001. [10]Hoekstra, L., Flannigan, R., and Wegerif, D., “Method and Apparatus for Separating Non-metallic Materials”, U.S. Patent No. 6,660,963, Dec. 9, 2003. [11]Choo, D. H., Kim, B. I., Jung, S. J., Lee, W. S., and Kim, B. s., “Laser Cutting Apparatus and Method”, U.S. Patent No. 6,407,360, Jun. 18, 2002. [12]Kondratenko, V. S., “Method of Splitting Non-Metallic Materials”, U.S. Patent No. 5,609,284, Mar. 11, 1997.
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