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研究生:邱詠達
研究生(外文):Yong-Da Chiu
論文名稱:利用分子自組裝方法進行鍍銅之光澤劑濃度分析
論文名稱(外文):Brightener analysis by means of Self-Assembled-Monolayer concept used for Copper Electroplating
指導教授:竇維平
學位類別:碩士
校院名稱:國立中興大學
系所名稱:化學工程學系所
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:70
中文關鍵詞:利用分子自組裝方法進行鍍銅之光澤劑濃度分析
外文關鍵詞:Brightener analysis by means of Self-Assembled-Monolayer concept used for Copper Electroplating
相關次數:
  • 被引用被引用:3
  • 點閱點閱:312
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
近年來電子產品朝向輕、薄、多功能的趨勢發展,使得積體電路元件的接點距離隨之縮小,信號傳送的速度則相對提高,相對需要高密度線路佈置,因此使得電路板朝向多層化印刷電路板,跟隨而來是線路與導孔的金屬化之問題。要如何將這此微米線路與導孔金屬化不會產生鍍層空洞及鬆散的金屬結構等等信賴度上的問題,是目前研究上的重要課題。
所以鍍槽液中添加劑,例如光澤劑、抑制劑、和平整劑的含量必須在適當的添加範圍內才能達到所需的電鍍填充效果,但是在電鍍的過程中添加劑是不斷的在消耗與裂解,要如何及時監控添加劑殘餘量,將是本實驗研究的方向,而本實驗主要是針對光澤劑為硫醇分子會在金屬基材上面自發性形成一致密的分子膜(SAMs),然後利用此一特性發現放入特定添加劑的分析杯中進行循環伏安法(Cyclic Voltammetry,CV),是可以拿來分析電鍍液裡頭所剩餘SPS的含量,而所能分析範圍的大小與所得到的線性迴歸值也跟特定的添加劑和所選的積分電流電位範圍有關。
本計劃所新開發出來光澤劑分析方法與CVS或HPLC比較起來,最大的優勢就是操作手法簡便並能迅速分析電鍍槽裡SPS的殘餘含量,且大量節省分析設備的成本開銷。
Recently, electronic products tend toward light, thin, short and multi-functional. The distance among integrated circuit devices shrinks progressively and the speed of signal transmission is correspondingly fast, so high density pattern must be designed to meet these requirements. Based on the consideration, printed circuit board with multilayer becomes the main trend of fabrication, of which the metallization between conducting wires and microvias is a big challenge. How to overcome the problem of void and loose structure formation during metallization over copper electroplating is an important toptic currently.
The additives used in a copper electroplating bath sush as accelerator, suppressor, and leveler must rang in optimum in order to achieve the requirement of metallization. However, these additives consume and decompose continuously in the process of electroplating. Hence, how to monitor the residual additives immediately is the major topic of our study. Our experiment focuses on the analysis of accelerator which can form a Self-Assembly Monolayer on a metal substrate. We employ this chemical characteristic and use cyclic voltammetry to analyze the remnant concentration of accelerator in the electroplating bath. The analytic range and linear regression of accelerator are dependent on specific additives employed in the analytic solution and on the choice of integral potential range.
The advantage of the developed analysis method is easy operation and quick analysis for residual accelerator in a copper electroplating bath as compared with CVS or HPLC. The analysis system also greatly saves the cost of equipment as well as above-mentioned advantages.
目錄
摘要 I
目錄 IV
表目錄 VI
圖目錄 VII
第一章 緒論 1
第二章 理論與文獻回顧 2
第一節 印刷電路板以及晶圓銅製程技術簡介: 2
第二節 電鍍方法: 4
第三節 電鍍添加劑之簡介: 10
一、有機添加劑: 10
(一)加速劑(Accelerator)或光澤劑(Brightener): 10
(二)抑制劑(Suppressor): 11
二、無機添加劑: 14
(一) (Cl-): 14
(二)氫離子(H+): 14
第四節 自組裝薄膜(SELF-ASSEMBLY MOMOLAYER: SAMS): 17
第五節 電化學基礎理論【17】 20
一、極化的成因與分類: 20
二、濃度極化(concentration- polarization): 20
三、活性極化(activation polarization): 21
四、電阻極化(resistance polarization): 22
第三章 實驗裝置、藥品、步驟 23
第一節 恆電位/電流儀(POTENTIOSTAT/GALVANOSTAT) 23
第二節 金相顯微鏡(OPTICAL MICROSCOPE,OM) 24
第三節 實驗藥品、裝置 26
第四節 實驗步驟 27
一、 循環伏安法(Cyclic Voltammetry,CV)實驗 27
二、SEM實驗 28
三、新藥品開發電鍍實驗 29
第四章 實驗結果與討論 31
第一節、 不同添加劑對自組裝分子電極CV影響: 31
第二節 光澤劑濃度分析開發: 44
第三節 新藥品開發: 57
第五章、結論 69
參考文獻 70
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