臺灣博碩士論文加值系統

由於可攜式電子產品種類及市場增加，電子產品承受意外摔落、撞擊的頻率大增，且現今電子封裝產業中常使用的無鉛銲錫通常較為硬、脆，使得無鉛銲錫接點在遭受撞擊時會顯得較為脆弱。本研究係探討本實驗室所開發之錫鋅系五元無鉛銲錫在製作成電子元件後的摔落可靠度與破壞模式及破壞機構之分析，並與傳統Sn-37Pb銲錫及現今工業界常使用的錫銀銅系之無鉛銲錫比較。
由摔落測試結果顯示，錫鋅系五元無鉛銲錫及傳統Sn-37Pb銲錫與NiAu金屬層所構成的銲錫接點有較佳的摔落可靠度，而Sn-1.0Ag-0.5Cu/Cu及Sn-3.0Ag-0.5Cu/NiAu接點的摔落壽命則較低。Sn-37Pb/NiAu接點在經摔落測試後的破壞皆產生在銲錫基地內；而Sn-3.0Ag-0.5Cu/NiAu接點則破斷在界面介金屬化合物(Cu,Ni)6Sn5與Ni層的界面上；Sn-1.0Ag-0.5Cu/Cu的摔落破斷則是在銲錫基地中及界面介金屬化合物上皆有發現；錫鋅系五元/NiAu接點中的摔落破壞則與界面介金屬化合物AuZn3、AgZn3脫離界面與否有關: 若界面IMC脫離界面浮起，則摔落測試造成的破壞皆會產生在銲錫基地中，若界面IMC仍緊貼界面沒有浮起，則摔落破壞會產生在AgZn3與Solder的界面上。
根據實驗分析結果顯示，當銲錫接點中若缺乏脆弱的界面與擁有易於變形的銲錫基地相，則此種銲錫接點會有較佳的摔落可靠度。

Portable electronic products are growth areas for electronics manufacturing industry. These portable products are prone to accidental drops which can cause internal circuit board damage e.g., solder joint failures. Lead-free solder are stiffer and more brittle than lead-based solders. This makes the solder joints using lead free solders more fragile to dynamics loads.
A new lead-free solder Sn-Zn-Ag-Al-Ga (5e) has been developed in this laboratory. The objective of this research was to understand the reliability of 5e solder joints and analyze the solder joint failure modes and mechanisms. Further, reliability performance of 5e was compared with Sn-37Pb, Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solders.
According to experimental results, drop reliability of 5e/NiAu and Sn-37Pb/NiAu solder joints was much better than Sn-1.0Ag-0.5Cu/Cu and Sn- 3.0Ag- 0.5Cu/NiAu solder joints. It was observed that failure of Sn-37Pb /NiAu solder joint occurred at the eutectic phase inside solder matrix whereas it took place at the brittle interface between (Cu,Ni)6Sn5 IMC and Ni layer in Sn-3.0Ag-0.5Cu/NiAu solder joint. Drop fracture in case of Sn-1.0Ag-0.5Cu/Cu solder joint was found to be located within solder matrix as well as at the interfacial IMC. However, failure mode of 5e solder joint varied with respect to the morphology of the interfacial IMC. Most of the failures occurred inside solder matrix due to the floating of the AuZn3 and AgZn3 layers far away from interface in liquid solder. Other types of failure were observed at the interface between AgZn3 and solder. This was due to absence of floating and formation of IMC at interface. The results of analysis showed that absence of a weak interface and the existence of easy-deformed solder matrix within a solder joint exhibits better drop reliability.

總目錄
中文摘要……………………………….Ι
英文摘要…………………………… Ⅱ
總目錄…………………………………Ⅲ
表目錄……………………………………Ⅴ
圖目錄……………………………………Ⅵ
第壹章 緒論………………………………1
1-1前言……………………………………1
1-2文獻回顧………………………………1
1-2-1文獻摔落試驗結果…………………1
1-2-1-1共晶錫鉛…………………………1
1-2-1-2錫銀系合金………………………2
1-2-1-3錫銀銅系合金……………………3
1-2-2破壞模式歸納………………………9
1-3 JEDEC摔落試驗規範簡述……………10
1-3-1元件…………………………………10
1-3-2測試板………………………………10
1-3-3實驗條件……………………………10
1-3-4失效判定……………………………15
1-4可靠度判定……………………………15
1-4-1偉伯分佈簡介………………………15
1-4-2偉伯參數求法………………………18
1-4-3故障種類及偉伯物理意義…………19
1-5研究目的………………………………19
第貳章 實驗方法與步驟…………………21
2-1實驗構想………………………………21
2-2實驗試片介紹…………………………21
2-3表面黏著技術作業……………………27
2-4摔落試驗………………………………27
2-4-1實驗裝置說明………………………27
2-4-2摔落實驗規劃………………………33
2-5試片分析………………………………33
第參章 結果與討論………………………35
3-1摔落測試前試片初始狀態……………35
3-2不同銲錫材料之Drop Reliability比較……36
3-3摔落失效模式分析……………………………36
3-3-1共晶錫鉛銲錫接點之摔落失效模式………36
3-3-2錫銀銅銲錫接點之摔落失效模式…………36
3-3-3五元銲錫接點之摔落失效模式……………44
3-4不同銲錫接點產生破壞之機構探討…………45
3-4-1共晶錫鉛銲錫接點之破壞機構探討………45
3-4-2錫銀銅銲錫接點之破壞機構探討…………47
3-4-3錫鋅五元銲錫接點之破壞機構探討………61
3-4-3-1機構探討…………………………………61
3-4-3-2錫鋅五元銲錫接點摔落試驗之即時觀察……63
3-5影響摔落失效次數的因素……………………71
3-5-1不同失效模式與其摔落壽命的關聯…………71
3-5-2 實驗裝置與摔落壽命的關聯…………………80
3-6綜合比較與討論…………………………………81
3-6-1文獻综合比較…………………………………81
3-6-1-1 Bulk性質對摔落測試的影響………………81
3-6-1-2界面性質對摔落測試的影響…………………82
3-6-2综合討論…………………………………………87
第肆章 結論……………………………………………89
參考文獻…………………………………………………90
誌謝………………………………………………………97
自述………………………………………………………98

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