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研究生:劉士齊
研究生(外文):Shih-chi Liu
論文名稱:銲錫接點於高速剪切測試下之可靠度及破壞行為與機制分析
論文名稱(外文):Solder Joint Reliability and Fracture Mechanism under High Shear Test
指導教授:林光隆
指導教授(外文):Kwang-lung Lin
學位類別:碩士
校院名稱:國立成功大學
系所名稱:材料科學及工程學系碩博士班
學門:工程學門
學類:材料工程學類
論文種類:學術論文
畢業學年度:96
語文別:中文
論文頁數:72
中文關鍵詞:無鉛銲錫可靠度
外文關鍵詞:shear testreliability
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本實驗是將錫鋅系無鉛銲錫(Sn8.5Zn0.5Ag0.01Al0.1Ga)、錫鉛以及錫銀銅系無鉛銲錫(Sn1.0Ag0.5Cu、Sn3.0Ag0.5Cu)四種不同銲錫球搭配兩種不同的BGA基板(OSP與Cu/Ni/Au)接合,以高速剪力試驗測試四種不同速度下的接合強度的變化、探討其顯微組織與銲錫球破裂模式之關係。
實驗結果顯示四種銲錫的BGA試片,其銲錫接點之剪力強度都隨剪力速度增加而上升,Sn1.0Ag0.5Cu的破裂面型態顯示其會因為速度增加而從延性破斷轉變成為脆性破斷;Sn3.0Ag0.5Cu則呈現出脆性的破斷面;而Sn37Pb和Sn8.5Zn0.5Ag0.01Al0.1Ga則是皆為延性的破斷面,Sn37Pb會直接破斷在銲錫球,而Sn8.5Zn0.5Ag0.01Al0.1Ga則是會呈現蜂窩狀的延性破裂面。Sn8.5Zn0.5Ag0.01Al0.1Ga的BGA試片與Cu/Ni/Au印刷電路板接合會生成不規則層狀的介金屬化合物AuZn3與AgZn3,有些介金屬化合物會浮在銲錫球內部,不會貼在鎳層表面;當層狀的介金屬化合物浮在銲錫球內部時,試片的剪力強度會呈現明顯的上升,其他的試片剪力強度值則會隨著測試速度增加而緩慢的上升。
The shear strength of four solder joints (Sn37Pb, Sn8.5Zn0.5Ag0.01Al0.1Ga, Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu) on two kinds of substrates (Ni/Au and OSP Cu) were investigated using high speed shear test. These investigations were tried to correlate with the microstructure and fracture behaviors of the solder joints.
Experimental results revealed the increase in shear strength with increase in shear speed. All four solders showed different failure mode. Sn3.0Ag0.5Cu demonstrated brittle failure mode while ductile failure mode was observed in Sn37Pb and Sn8.5Zn0.5Ag0.01Al0.1Ga solders. Initially, Sn1.0Ag0.5Cu failure has more ductile and less brittle behavior. However, brittle behavior was increased with the increase in shear speed. Only failure mode of Sn1.0Ag0.5Cu was changed during the increase in shear speed and no change was observed in other three solders.
During shear test, failure of solder joint in Sn37Pb was observed in solder bulk whereas Sn3.0Ag0.5Cu and Sn8.5Zn0.5Ag0.01Al0.1Ga showed at interface. Sn8.5Zn0.5Ag0.01Al0.1Ga after shear test showed alveolus ductile at the surface.
During reflow of Sn8.5Zn0.5Ag0.01Al0.1Ga on Au/Ni/Cu, AuZn3 and AgZn3 intermetallic compounds were formed in IMC and solder bulk. It is estimated that these compounds first created in solder joint and than floated into the solder bulk. Floating of IMC within 5e solder joint to bulk solder resulted in big increase of shear strength.
總目錄
中文摘要 Ⅰ
英文摘要 Ⅱ
總目錄 Ⅲ
表目錄 Ⅴ
圖目錄 Ⅵ
第壹章 簡介1
1-1 電子構裝之可靠度測試1
1-1-1 環境因素對可靠度的影響1
1-1-2 可靠度試驗的描述2
1-1-3銲錫球結合強度與機械性可靠度測試35
1-2 銲錫接的剪力測試8
1-2-1 不同剪力測試高度的影響8
1-2-2 不同剪力測試速度的影響13
1-3 研究目的13
第貳章 實驗方法與步驟17
2-1 實驗構想17
2-2 實驗材料製備17
2-2-1 BGA基板製備17
2-3 銲錫球之剪力強度試驗22
2-4 銲錫球與基板的界面反應分析26
2-4-1 界面介金屬化合物之表面形態分析26
2-4-2 界面介金屬化合物之成份分析26
第參章 結果與討論27
3-1 BGA錫球之顯微結構觀察27
3-1-1 錫球於迴焊後銲錫球之表面型態分析27
3-1-2 BGA錫球於迴焊後銲錫球之界面分析27
3-2 BGA錫球剪力強度測試分析32
3-3 BGA錫球剪力測試曲線之變化41
3-4 破壞機構分析57
3-5 綜合討論64
第肆章 結論65
參考文獻66
致謝71
自述72
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