本研究主要係探討添加微量Co元素對Sn-0.7Cu銲錫合金熔點、機械性質、顯微組織及接合性能方面之影響。
由示差掃描熱量分析中得知添加Co元素後，合金熔點約為227.3℃，且由單一放熱峰得知為共晶組成；顯微組織分析顯示Sn-0.7Cu合金以β-Sn+網狀β-Sn+Cu6Sn5共晶組成為主，添加0.05wt%Co後會析出顆粒狀Sn-Cu-Co化合物，添加0.1wt%Co後則會形成長條狀的Sn2Co。在拉伸性能方面可得知Co元素的添加可改善Sn-0.7Cu合金之強度及延展性。
此外由接合性能實驗結果可發現，Co元素添加可抑制Cu3Sn界面反應物生成，且可增加Sn-0.7Cu銲錫合金銲點接合強度，而隨高溫儲存時間的增加，因為界面反應層的成長，造成銲點衰弱而使破斷位置由銲錫處，移至銲錫與界面反應層處。

In order to study the effect of the addition of Co to the Sn-0.7Cu solder, the formation of an IMC at the interface between Sn-0.7Cu-xCo(x=0, 0.05, 0.1wt%) solders and Cu Substrate were investigated, and the joint strength was also evaluated by tensile test.
From the DSC analysis of Sn-0.7Cu alloys containing various amounts of Co, it was found that the eutectic reaction occurred around 227.3°C. The microstructure of Sn-0.7Cu solder was identified asβ-Sn plus eutectic (β-Sn+Cu6Sn5) by SEM and EDS. Sn-Cu-Co compounds can be found in Sn-0.7Cu solder with 0.05wt%Co. Sn2Co IMCs can be observed in Sn-0.7Cu solder with 0.1wt%Co. Additionally, the results of the tensile test show that the addition of Co elements can improve the mechanical properties of the solder.
After high temperature storage test at 150℃, the growth of interfacial Cu3Sn IMCs was inhibited by the adding of Co into the Sn-0.7Cu solder. The addition of Co elements can improve the joint strength of the solder joints.

中文摘要 i
英文摘要 ii
誌謝 iii
目錄 iv
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1 研究背景與動機 1
1.2 研究目的與方法 2
第二章 文獻探討 4
2.1 電子構裝技術 4
2.2 銲接 8
2.2.1 波銲 9
2.2.2 迴銲 9
2.3 銲料 10
2.4 銲錫材料無鉛化趨勢 12
2.5 無鉛銲錫合金的性質需求 13
2.5.1 銲錫合金的材料成本 13
2.5.2 銲錫合金的熔點 14
2.5.3 潤濕能力 16
2.5.4 熱膨脹係數 16
2.5.7 附著強度 18
2.5.8 接點界面反應 19
2.5.9 氧化行為 19
2.5.10 抗腐蝕性 20
2.6 無鉛銲錫合金系統 20
2.6.1Sn-Ag合金 20
2.6.2 Sn-Au合金 21
2.6.3 Sn-Bi合金 22
2.6.4 Sn-In合金 23
2.6.5 Sn-Sb合金 24
2.6.6 Sn-Zn合金 25
2.6.7 Sn-Cu合金與Sn-Cu-Co合金 25
2.7 無鉛銲錫合金發展與選用 30
第三章 實驗流程與方法 32
3.1 實驗流程 32
3.2合金融煉 34
3.3示差掃描熱量分析 34
3.4 SEM顯微組織觀察與成份分析 35
3.5拉伸試驗 37
3.6接合性能測試 40
3.6.1試棒備製 40
3.6.2高溫儲存試驗 41
3.6.3 界面組成分析 41
3.6.4 接合強度測試 42
3.6.5 破斷面分析 42
第四章 實驗結果及討論 43
4.1 熱性質分析 43
4.2 顯微組織與成份分析 44
4.3 拉伸性質 48
4.4拉伸破斷面分析 50
4.5接合性能之界面組織分析 53
4.5.1 Sn-0.7Cu合金銲點界面組織分析 53
4.5.2 Sn-0.7Cu-0.05Co合金銲點界面組織分析 55
4.5.3 Sn-0.7Cu-0.1Co合金銲點界面組織分析 56
4.5接合性能之拉伸性質分析 69
第五章 結論 77
參考文獻 79

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參考文獻

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