臺灣博碩士論文加值系統

噴墨列印技術在PLED顯示器以及PCB製程上擁有相當大之發展潛力，而其製造過程的關鍵技術在於噴墨液滴的速度與大小、基材對於液滴的表面特性、基材的幾何結構以及材料特性等等，而其差別在於一為液滴噴覆凹槽，另一則為液滴噴覆平板。
故本文研究主題之ㄧ即為利用壓電噴墨頭噴覆PEDOT高分子微液滴於長方形微凹槽內，藉由改變液滴韋伯數(We)(16.9-26.5)、微凹槽側壁接觸角(θs)(25°-50°)與微凹槽長寬比(AR)(1-3.3)等參數來檢驗液滴於微凹槽上之噴覆特性，再進一步分析這些條件下液滴填滿微凹槽所需之臨界We(Wec)。結果顯示液滴披覆於微凹槽之中空面積隨著We與θs之增加而減少，然而隨著AR的增加而增加；本文更進一步歸納出Wec與無因次側壁接觸角以及AR之關連性經驗式，提供微液滴噴覆之噴墨頭操作參數與相關微製程之有效參考。
另一重要主題則為利用噴墨技術將金屬液滴定量定位地噴於可撓曲基板上(PET膜)以製造線寬小於400μm(傳統印刷電路板之線寬)之線路微結構，並測試不同濃度(10％-30％)、線寬（100μm-400μm）、熱處理溫度（100℃-200℃）、找出在本研究實驗範圍內各項參數之最佳設計，且利用重複噴覆與添加多壁奈米碳管(MWNT)的方法降低電阻值，並結合成本分析進行討論，提出完整之結論。

第一章 前言 1
1-1 研究動機 1
1-2 文獻回顧 5
1-3 研究目的 12
1-3統御方程式 13
第二章 實驗系統 16
第三章 高分子液滴噴覆長方形微凹槽之特性研究 18
3-1 實驗方法與參數變化 18
3-1-1 PEDOT墨水製備 18
3-1-2利用反應式離子蝕刻改變凹槽側壁接觸角 20
3-1-3 SU-8凹槽製程與幾何變化 22
3-1-4實驗誤差 27
3-2 結果與討論 28
3-2-1韋伯數對液滴噴覆於方形微凹槽之影響 28
3-2-2側壁接觸角變化對液滴噴覆於方形微凹槽之影響 31
3-2-3微凹槽長寬比對液滴噴覆於方形微凹槽之影響 32
第四章 金屬液滴噴覆薄膜平板之研究 34
4-1 實驗方法與參數變化 34
4-1-1微導線噴覆 34
4-1-2導線重複噴印 35
4-1-3奈米銀/奈米碳管複合墨水製備 35
4-1-4實驗誤差 37
4-2 結果與討論 38
3-4-1奈米銀濃度之影響 38
3-4-2線寬之影響 39
3-4-3熱處理溫度之影響 40
3-4-4導線厚度之影響 40
3-4-5分散劑濃度之影響 41
3-4-6奈米碳管濃度之影響 42
3-4-7成本分析 43
3-4-8附著性測試 44
第五章 結論與未來建議 45
5-1結論 45
5-2未來建議 46
參考文獻 49

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