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研究生:林志憲
研究生(外文):Chih-Hsien Lin
論文名稱:於不同高分子奈米顆粒表面施行無電鍍鎳
論文名稱(外文):Electroless Nickel Plating on the Surfaces of Different Polymer Nanoparticles
指導教授:廖文彬廖文彬引用關係
指導教授(外文):Wen-Bin Liau
學位類別:碩士
校院名稱:國立臺灣大學
系所名稱:材料科學與工程學研究所
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:110
中文關鍵詞:無電鍍鎳磷合金聚苯乙烯聚苯胺奈米顆粒核殼乳膠
外文關鍵詞:electroless platingnickel-phosphorus alloypolystyrenepolyanilinenanoparticlecore-shell latex
相關次數:
  • 被引用被引用:2
  • 點閱點閱:232
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  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
使用次磷酸鈉作為還原劑,以無電鍍的方式在聚苯乙烯-聚苯胺核殼奈米顆粒以及聚苯乙烯奈米顆粒之表面鍍上鎳磷合金,在實驗中省略了敏化步驟,以鈀離子吸附於基材表面施行活化,無電鍍反應後的產物以SEM、TEM、EDS、XRD等儀器分析。
高分子顆粒表面對於鈀離子的吸附能力將會影響活化的效果,本論文探討鈀離子對此兩種不同的奈米顆粒的吸附能力。
在對奈米顆粒施鍍的過程中,發現施鍍於不同的奈米顆粒表面上,鍍層的性質及無電鍍的反應速率會有不同。在鎳磷合金開始沈積之前會有一段誘導期,誘導期中不會有合金的沈積,本論文也探討在不同的高分子奈米顆粒上施鍍之鍍層成分、誘導期長短及鍍層沈積速率。
Nickel-phosphorus alloys were electrolessly deposited on the surfaces of polystyrene nanoparticles and polyaniline-coated-polystyrene nanopar- ticles using sodium hypophosphite as reducing agent. In this work, the sensitization process was omitted, and the activation process was applied by adsorption of palladium ions on the surfaces of substrates. Products after electroless plating were analyzed by SEM, TEM, EDS and XRD.
The efficacy of activation was influenced by the adsorption ability of palladium ions on the surfaces of polymer particles. The adsorption ability of palladium ions on the surfaces of these two different polymer nanopar- ticles was studied.
During the process of electroless plating on the nanoparticles, we found that the composition of deposits and the deposition rate were different when depositing on different polymer nanoparticles. Before the deposition of nickel-phosphorus alloys started, there was an induction period, in which no alloys were deposited. The composition of nickel- phosphorus deposits, the length of induction time and the deposition rate when plating on these two different polymer nanoparticles were also studied.
口試委員會審定書-------------------------------------------i
誌謝------------------------------------------------------ii
摘要-----------------------------------------------------iii
Abstract--------------------------------------------------iv
目錄-------------------------------------------------------v
圖目錄---------------------------------------------------vii
表目錄----------------------------------------------------ix
第一章 前言------------------------------------------------1
第二章 原理及文獻回顧--------------------------------------2
2.1 自由基聚合反應-----------------------------------------2
2.1.1 聚合反應機制-----------------------------------------2
2.1.2 乳化聚合法-------------------------------------------4
2.1.3 無界面活性劑乳化聚合法-------------------------------8
2.1.4 陽離子型聚苯乙烯乳膠顆粒----------------------------10
2.2 導電高分子聚苯胺--------------------------------------13
2.2.1 概說------------------------------------------------13
2.2.2 聚苯胺的分子結構------------------------------------15
2.2.3 聚苯胺的合成方法------------------------------------17
2.2.4 化學聚合反應機制------------------------------------19
2.3 無電鍍鎳----------------------------------------------25
2.3.1 概說------------------------------------------------25
2.3.2 無電鍍鎳的前處理------------------------------------26
2.3.3 鍍液的成分------------------------------------------28
2.3.4 無電鍍鎳的反應機制----------------------------------32
2.3.5 磷含量對鍍層性質的影響------------------------------35
第三章 實驗步驟-------------------------------------------39
3.1 實驗藥品----------------------------------------------39
3.2 實驗儀器----------------------------------------------43
3.3 製備陽離子型聚苯乙烯乳膠顆粒--------------------------46
3.4 製備核殼型聚苯乙烯-聚苯胺乳膠顆粒---------------------48
3.5 無電鍍鎳於核殼型聚苯乙烯-聚苯胺乳膠顆粒之表面---------50
3.6 聚苯乙烯與聚苯胺吸附氯化鈀離子之探討------------------52
3.7 磷含量與溫度變因及欲鍍基材的關係----------------------57
3.8 聚苯乙烯與聚苯胺基材的無電鍍反應速率之探討------------61
第四章 結果與討論-----------------------------------------64
4.1 陽離子型聚苯乙烯乳膠顆粒------------------------------64
4.2 核殼型聚苯乙烯-聚苯胺乳膠顆粒-------------------------66
4.3 無電鍍鎳於核殼型聚苯乙烯-聚苯胺乳膠顆粒之表面---------70
4.4 聚苯乙烯與聚苯胺吸附氯化鈀離子之探討------------------81
4.5 磷含量與溫度變因及欲鍍基材的關係----------------------90
4.6 聚苯乙烯與聚苯胺基材的無電鍍反應速率之探討------------95
第五章 結論----------------------------------------------106
參考文獻-------------------------------------------------107
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