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研究生:黃彥儒
研究生(外文):Yen-Ru Huang
論文名稱:設計及製作用於氣體偵測之760nm新型外腔式雷射
論文名稱(外文):Design and Fabrication of 760-nm Novel External Cavity Laser for Gas Sensing Applications
指導教授:李三良李三良引用關係
指導教授(外文):San-Liang Lee
學位類別:碩士
校院名稱:國立臺灣科技大學
系所名稱:電子工程系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:86
中文關鍵詞:760nm波段外腔式雷射光纖布拉格光柵
外文關鍵詞:760-nm External Cavity LaserFiber Bragg Grating
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本論文重點為應用於氣體偵測之760奈米新型外腔式雷射的設計與製作。因為材料的選擇以及二次磊晶上的困難,760奈米的分佈反饋式雷射、光柵分佈式布拉格反射雷射及垂直共振腔面射型雷射是非常難以製作的,所以我們選擇利用結構較簡單、成本也較低的外腔式雷射來達到單模的效果,以用於即時氧氣氣體濃度偵測系統中。本論文之外腔式雷射製作方式為,利用一般的760奈米法布里•比洛雷射,連接上二階的光纖光柵,使之輸出光譜圖為單波長之雷射。其輸出波長可藉由溫度調動或電流調動,而有大於0.2奈米的可調波長範圍,旁模抑制比也都可達到28分貝以上,可使輸出波長對準氧氣的吸收頻譜。此型新型外腔式雷射可藉由量測直接吸收頻譜,用於氧氣氣體濃度偵測系統中。
本論文也就覆晶封裝的技術進行改良,我們使用無害之錫銅合金作為焊料,為了克服以電鍍機製作錫球會有均勻度不佳的問題,我們使用電子束蒸鍍機來蒸鍍錫銅合金,並大幅降低錫銅合金的高度,以提高製程上的良率。並且我們也在V型溝槽的均勻度做改善,以期能有更好的耦光效率。而綜合以上我們所做的改善,我們相信可以藉著將760奈米法布里•比洛雷射與二階之光纖光柵積體化在同一矽晶片上,以達到單波長輸出,並且低成本的外腔式雷射。
It is very difficult to realize short-wavelength single-mode laser such as distributed-Bragg-reflector laser, distributed feedback laser, and vertical cavity surface-emitting laser. The main problems arises from the material issues. In this thesis, we focus on the design and fabrication of 760-nm novel external cavity lasers for gas sensing applications. Firstly, we try to use a second-ordered fiber Bragg grating (FBG) as an external reflector to provide wavelength filtering function. We use a commercial 760 nm FP laser connected with a FBG, which is designed for 1520 nm, to achieve single wavelength output. In its optimal working condition, this laser can be tuned over 0.2 nm wavelength range by current tuning and/or temperature tuning; and it can have >28dB side-mode suppression ratio over its tuning range. We believe that this laser can be used to address O2 absorption lines and thus monitor its concentration by direct absorption method. The relative simpler and cheaper laser source can further reduce the installation cost.
We also try to integrate FP laser with gratings to improve its performance and reliability. In the rest parts of this thesis, we study on the flip-chip bonding technique and make some improvement such as the use of lead-free solder and the deposition of Sn-Cu bump by means of E-beam evaporation, insteading of conventional electro-plating method. We also realize uniform v-groove patterns on silicon substrate for further packaging and integration procedures. By combining these efforts, I believe that single-mode 760 nm laser integrated with an external Bragg grating on a chip can be achieved with low-cost in the future.
摘要 ------------------------------------------------------------- I
Abstract ------------------------------------------------------- II
誌謝 ----------------------------------------------------------- III
目次 ------------------------------------------------------------ IV
圖表索引 ------------------------------------------------------- VII
第一章 簡介 ---------------------------------------------------- 1
1-1 前言 ---------------------------------------------------- 1
1-2 761 nm分佈反饋式雷射與其用於氧氣偵測之實例 -------------- 2
1-3 論文架構 ------------------------------------------------ 7
第二章 理論分析 ------------------------------------------------ 8
2-1 前言 ---------------------------------------------------- 8
2-2 760 nm法布里•比洛雷射之設計 ---------------------------- 8
2-2-1雷射二極體基本原理 ----------------------------------- 9
2-2-2模擬軟體與簡介 --------------------------------------- 13
2-2-3結構與材料之模擬 ------------------------------------- 13
2-3光柵之設計 ----------------------------------------------- 17
2-3-1光柵之原理與設計 ------------------------------------- 17
2-3-1光纖布拉格光柵之介紹 --------------------------------- 18
第三章 實驗架構 ------------------------------------------------ 22
3-1 前言 ---------------------------------------------------- 22
3-2 覆晶黏著技術 -------------------------------------------- 22
3-2-1非等向性濕式蝕刻V槽 ---------------------------------- 24
1. 矽晶片非等向性蝕刻之介紹 -------------------------- 24
2. 化學反應機制 -------------------------------------- 25
3. 蝕刻速率 ------------------------------------------ 26
4. V槽寬度之計算 ------------------------------------- 28
3-2-2無鉛焊料 --------------------------------------------- 30
3-2-3定義回焊時間與加熱時間 ------------------------------- 32
3-3 短波段外腔式雷射 ---------------------------------------- 33
3-3-1 架構一 - 雙列封裝雷射加上光纖光柵 ------------------ 33
3-3-2 架構二 - 法布里•比洛雷射覆晶黏著上光纖光柵 -------- 35
3-3-3 架構三 - 法布里•比洛雷射與波導光柵整合在SOI晶片上 - 35
3-4長波段外腔式雷射 ----------------------------------------- 36
3-4-1 架構一 - 法布里•比洛雷射覆晶黏著上波導光柵 -------- 37
3-4-2 架構二 - 將光柵整合在SOI晶片上以進行封裝 ----------- 38
3-4-3 長波段外腔式雷射製程 -------------------------------- 39
第四章 實驗與結果討論 ------------------------------------------ 37
4-1架構一 - 760 nm雙列封裝雷射加上二階光纖光柵 ------------- 42
4-1-1 量測架構與元件之介紹 -------------------------------- 42
4-1-2 量測結果 -------------------------------------------- 45
4-2架構二 - 760 nm法布里•比洛雷射覆晶黏著光纖光柵 ---------- 51
4-2-1 760 nm法布里•比洛雷射製程 -------------------------- 52
4-2-2 製程結果 -------------------------------------------- 58
4-2-3 雷射陣列封裝製程 ------------------------------------ 61
4-2-4 製程結果 -------------------------------------------- 66
第五章 結論 ---------------------------------------------------- 70
5-1成果與討論 ----------------------------------------------- 70
5-2未來之研究方向 ------------------------------------------- 71
參考文獻 --------------------------------------------------------- 72
作者簡介 --------------------------------------------------------- 75
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