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研究生:梁峻碩
研究生(外文):Jiun-Shuo Liang
論文名稱:線鋸切割太陽能基板之研究
論文名稱(外文):Study on Wire Sawing of Solar Wafers
指導教授:陳炤彰陳炤彰引用關係
指導教授(外文):Chao-Chang Chen
學位類別:碩士
校院名稱:國立臺灣科技大學
系所名稱:機械工程系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:142
中文關鍵詞:多線式線鋸切割太陽能矽基板微小維克氏壓印破壞磨料加工
外文關鍵詞:multi-wire sawingsilicon substrate of solar cellVickers microhardnessindentation fractureabrasive machining
相關次數:
  • 被引用被引用:25
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國際原油價格不斷高漲,替代性能源的研發愈顯重要,而太陽能為目前替代能源之研發重點項目之ㄧ,其主要之材料即為矽晶圓基板,目前生產矽晶圓基板之主要技術為多線式線鋸切割技術(multi-wire sawing)。本研究之主要目的在建立線鋸切割模式(wire sawing model, WSM)應用於太陽能基板切割製程之移除率(material removal rate, MRR)評估以及進行線鋸切割製程分析比較。本研究WSM之建構基礎為利用微小維克氏壓痕測試機壓印矽晶圓基板,藉由硬脆材料(brittle material)受壓印後之破壞模式(indentation fracture)來估算材料移除率(MRR),並且利用雷射粒徑分析儀測試切割前與切割後之漿料,比較量測結果估算有效加工磨料數。由移除率模式可以得到磨料有效刃角數為影響移除率之主要因素,模擬時即利用磨料有效刃角數搭配其他參數進行分析,由模擬結果得知材料移除率隨著鋼線速度、工件楊氏模數與瞬間有效加工磨料數之增加而增加,而隨著工件硬度與破裂韌性增加而減少。本研究所建立之線鋸切割移除模式(WSM),未來可以運用在切割不同材質之硬脆材料上,而有效加工磨料數之評估方法則可以運用在漿料有循環使用之磨料加工模式上。
Multi-wire sawing technology has been widely applied on fabricating the substrates of solar cells. This research is to develop a wire sawing model (WSM) to predict the material removal rate (MRR) of slicing substrate of solar cell and also to invesigate the significant process parameters of wire sawing. The micro Vickers hardness test is used to estimate the indentation fracture of brittle material for estimating the material removal volume by each indentation. Calculation of the number of engaged grits in working area can also be obtained by particle size analyzer to measure the particle size distribution (PSD) before and after wire sawing. Results show that the number of engaged tip of abrasive is the main factor of material removal rate. So the simulation of MRR use this factor collocated with other factors for exploring other effects. Results of simulation show that the MRR is in direct proportion with the wire speed, Young’s modulus of workpiece and the number of engaged grits for each instant sawing in working area and in inverse proportion with hardness and fracture toughness of workpiece. Further research is to predict the MRR of related brittle materials. The method of estimation of the number of engaged grits in working area can also be used in other abrasive machining system with recirculated slurry system.
摘要 I
Abstract II
目錄 III
圖目錄 VII
表目錄 XIII
符號表(Nomenclature) XV
第一章 緒論 1
1.1研究背景 1
1.2研究目的與方法 5
1.3章節介紹 6
第二章 文獻回顧 7
2.1矽晶棒材料特性 7
2.2線鋸切割製程 9
2.3文獻回顧總結 18
第三章 實驗規劃與耗材分析 19
3.1實驗設備 19
3.2實驗耗材 20
3.2.1矽晶棒 20
3.2.2切割鋼線 25
3.2.3載液-聚乙烯乙二醇(PEG) 28
3.2.4磨料(SiC) 29
3.3量測設備 30
3.3.1三次元影像量測儀 30
3.3.2掃描式電子顯微鏡(SEM) 30
3.3.3表面粗糙度儀 31
3.3.4白光干涉儀 31
3.3.5雷射粒徑分析儀 31
3.4實驗方法 35
3.4.1線鋸切割流程 36
3.4.2材料移除模式推導流程 38
第四章 線鋸切割製程模型 40
4.1轉換方程式 40
4.2游離磨料線鋸切割模型 40
4.3材料移除率模式推導 44
4.3.1單顆磨料平均受力估算 46
4.3.2單顆磨料移除體積 52
4.3.3磨料運動方式 59
4.3.3有效加工磨料數估算 62
4.4材料移除模式參數估算 74
4.4.1瞬間有效加工磨料數 74
4.4.2修正係數 79
4.4.3材料移除率估算 81
4.5模擬表面粗糙度 88
第五章 結果與討論 92
5.1線鋸切割移除模式討論 92
5.1.1磨料有效刃角數(nR)與鋼線速度(vw)之關係 96
5.1.2磨料有效刃角數(nR)與工件硬度(H)之關係 98
5.1.3磨料有效刃角數(nR)與工件楊氏模數(E)之關係 100
5.1.4磨料有效刃角數(nR)與工件破裂韌性(Kc)之關係 102
5.1.5磨料有效刃角數(nR)與瞬間有效加工磨料數(m)之關係 104
5.2材料移除率(MRR)之比較 106
5.3切割損失 110
5.4磨料使用率 111
第六章 結論與未來研究方向建議 116
6.1結論 116
6.2未來研究方向建議 117
參考文獻 119
附錄A機台規格 122
附錄B鋼線表面粗糙度量測 123
附錄C粒徑分析 131
附錄D壓印至材料破壞測試 135
作者簡介 142
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