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研究生:林文進
研究生(外文):Wen-chin Lin
論文名稱:熱介面材料熱傳導係數量測方法之研究
論文名稱(外文):Thermal Conductivity Measurement of Thermal Interface Materials
指導教授:林舜天林舜天引用關係
指導教授(外文):Shun-tian Lin
學位類別:碩士
校院名稱:國立臺灣科技大學
系所名稱:機械工程系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:51
中文關鍵詞:熱介面材料熱阻熱傳導散熱膏散熱片
外文關鍵詞:Thermal Interface MaterialThermal ResistanceThermal ConductivityThermal PadThermal Grease
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在熱源表面與散熱模組之間置入ㄧ種導熱性良好的熱介面材料(Thermal Interface Material),可以大幅降低熱源表面與散熱模組間的介面溫度差,為了選擇最佳的熱介面材料,我們必須發展出一套能夠精確量測出熱介面材料熱傳導係數的方法。
本論文實驗共分為兩大部分,實驗基材為散熱膏與散熱片。第一部份是以穩態熱傳導方式進行熱傳導係數的量測,以一維熱傳導理論為基礎,當兩種不同溫度的材料互相接觸時,熱量會從溫度高的物質經由介面材料往溫度低的方向傳遞,達到穩定狀態後利用公式轉換,可獲得此介面材料的熱傳導係數。第二部份為暫態熱傳導係數的量測,提供一固定功率的熱源,並記錄熱源中心點溫度隨時間的變化情形,由時間與溫度變化的關係可求得介面材料的熱傳導係數。
藉由兩種實驗結果,比較穩態與暫態方式所測得之熱傳導性質差異,結果顯示以穩態熱傳導方式進行量測,雖然時間較久,但可獲得較為準確的熱傳導係數。暫態熱傳導係數量測因為受到熱傳路徑上待測物可能存在空孔的影響,以及線性的簡化公式與實際量測的曲線差異導致精確度不佳。
Applying a Thermal Interface Material (TIM), which has an excellent heat conductivity value, into the interface between the heat source surface and the heat-spreading module could greatly reduce the temperature drop across the interface between the heat source and the heat-spreading module. In order to obtain the optimal choice of TIM, the thermal conductivity of TIM should be determined precisely.
The materials used in this study were thermal pad and thermal grease, and two thermal conductivity measuring methods were compared, including measuring the thermal conductivity value using a steady-state heat transfer equation and a transient state heat transfer equation, respectively. The steady state heat transfer equation is based on a one-dimensional heat conduction principle, wherein the temperature difference across a material becomes constant and the thermal conductivity of this material can be determined using a formula. The measurement of thermal conductivity value using transient-state heat conduction employs a line heat source, whose heat dissipates laterally to the material to be tested. The variation of temperature with time in the heat source was used to derive the thermal conductivity value of the tested material.
The results showed that measuring the thermal conductivity value by the steady-state heat conduction method obviously needed a longer measuring time, but it could obtain more precise results. On the other hand, the precision of the transient-state heat conduction method was less precise because of the possible existence of air bubble next to the thermocouple and the utilization of a simplified equation for fitting the measured data.
摘要 I
Abstract II
誌謝 III
目 錄 IV
表 目 錄 VI
圖 目 錄 VII
第一章 緒論 1
1-1 前言 1
1-2 介面熱阻 2
1-3 介面材料 5
1-4 導熱係數與測試 8
第二章 理論基礎 9
2-1 穩態熱傳原理 9
2-2 暫態熱傳導原理 11
第三章 實驗方法 14
3-1 實驗流程 14
3-1-1 穩態熱傳導實驗 14
3-1-2 暫態熱傳導實驗流程 19
3-2 試片準備 21
3-3 性質量測與分析 23
第四章 結果與討論 24
4-1 穩態熱傳導分析 24
4-1-1 穩態熱傳導Thermal Pad實驗結果 24
4-1-2 穩態熱傳導Thermal Grease實驗結果 27
4-1-3 穩態熱傳導分析 30
4-2 暫態熱傳導分析 35
4-2-1 暫態熱傳導Thermal Pad實驗結果 36
4-2-2 暫態熱傳導Thermal Grease實驗結果 39
4-2-3 暫態熱傳導分析 42
第五章 結論 45
第六章 參考文獻 46
附錄A 49
附錄B 50
附錄C 51
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