臺灣博碩士論文加值系統

本論文主要針對銅釘架在經過封裝製程其本身與膠餅間所產生的脫層現象做研究。將實驗分成三組，一組為銀膠烘烤製程，針對氮氣流量的多寡來比較含氧量濃度及脫層之相關性，另一組則針對釘架溫度影響最劇的銲線站，分別以熱壓板不同的加熱溫度及時間來比較釘架與膠餅間的脫層機率，而最後一組實驗則針對不同的預鍍銅厚度之釘架先以銅剝離測試實驗比較其在不同加熱溫度下本身材料的強度，接著完成整個封裝製程，再以可靠度實驗來驗證增加預鍍銅之釘架是否能通過測試。而由實驗的結果得知，在銀膠烘烤時需加入氮氣來降低其含氧濃度，銲線時須以愈低的溫度、愈短的作業時間來降低脫層發生的可能性，而增加預鍍銅厚度之銅釘架是可有效改善脫層的。

This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copper leadframe die paddle during assembly process. The experiments are performed into three parts, first is epoxy curing process, comparison of oxygen concentration and delamination with different nitrogen flow, the second one is wire bond process which is the most affected process by temperature treated for leadframe, comparison the defect rate of delamination with different heating temperature and time, the last part is aimed at the copper strike thickness, first to compare it by the copper peeling test experiment under the different heating temperature, completes the entire assembly process and then confirms the margin of reliability experiment whether the increase in copper strike thickness can through the test. Based on the experimental result, the addition of nitrogen reduces the contained oxygen content concentration in epoxy curing process, a lower temperature and shorter work time at wire bonding process reduce the possibility of delamination occurrence, and increases copper strike thickness may improve the delamination effectively.

中文摘要 ..................................................……………………………………...I
英文摘要...................................................………………………………...........II
致謝........................................................…………………………………...….III
目錄.......................................................………………………...……………..IV
表目錄.....................................................……………………………………...VI
圖目錄.....................................................…………………………………......VII
第一章 緒論.........................................................................................................1
1 – 1 前言............................................................................................................1
1 – 2 研究動機與目的........................................................................................1
1 – 3 文獻參考與回顧........................................................................................2
第二章 材料及測試儀器設備介紹.....................................................................4
2 – 1 銅釘架基本性質........................................................................................4
2 – 2 膠餅(高分子聚合物)基本性質..................................................................7
2 – 3 掃描式超音波顯微鏡檢測原理................................................................7
2 – 4 可靠度實驗流程........................................................................................8
第三章 實驗設計與方法...................................................................................20
3 – 1 釘架產品封裝流程..................................................................................20
3 – 2 脫層形成原理探討..................................................................................24
3 – 3 實驗設計..................................................................................................25
3 – 3 – 1 銀膠烘烤之實驗設計........................................................................25
3 – 3 – 2 銲線製程之實驗設計........................................................................26
3 – 3 – 3 釘架材料表面處理之實驗設計........................................................27
第四章 實驗結果與討論...................................................................................41
4 – 1 銀膠烘烤實驗結果與討論......................................................................41
4 – 2 銲線製程實驗結果與討論......................................................................41
4 – 3 釘架材料表面處理實驗結果與討論......................................................42
第五章 結論與未來研究方向...........................................................................58
5 – 1 結論..........................................................................................................58
5 – 2 未來研究方向與討論..............................................................................59
參考文獻………………………………………………………………………60

1.G. S. Ganesan, G. L. Lewis, T. Anderson, H. M. Berg, “Organic Contamination in IC Package Assembly and Its Impact on Interfacial Integrity” Electronic Components and Technology Conference, pp.68-70, 1996.
2.A. Paproth, K. J. Wolter, T. Herzog, T. Zerna, “Influence of Plasma Treatment on the Improvement of Surface Energy,” Electronics Technology Concurrent Engineering in Electronics Packaging, pp.37-41, 2001.
3.A.O. Tay, G. L. Tan, “A criterion for predicting delamination in plastic packages, ” Reliability Physics Symposium, pp.236-243, 1993.
4.B. H. Moon, H. Y. YOO, K. Sawada, “Optimal oxidation control for enhancement of copper lead frame EMC adhesion in packaging process,” Electronic Components and Technology Conference, pp.1148-1153, 1998.
5.E. Takano, T. Mino, K. Takahashi, K. Sawada, S.Y. Shimizu, H. Y. Yoo, “The Oxidation Control of Copper Lead Frame Package for Prevention of Popcorn Cracking,” Electronic Components and Technology Conference, pp.78-83, 1997.
6.C. T. Chong, Alan Leslie, L. T. Beng, “Investigation on the Effect of Copper Lead Frame Oxidation on Package Delamination,” Electronic Components and Technology Conference, pp.463-469, 1995.
7.Y. Tomioka, J. Miyake,”Oxide adhesion characteristic of lead frame copper alloys,” Electronic Components and Technology Conference, pp.714-720, 1999.
8.L. T. Nguyen, M.M. Michael, “Effects of Die pad Anchoring on Package Interfacial Integrity,” Electronic Components and Technology Conference, pp.930-938, 1992.
9.S. J. Hwang, H.H. Lee, C.H. Chuang, and D.Y. Huang, “Effects of Process Parameters on the Mold Adhesion Force in IC Encapsulation Process,” Advanced Packaging Materials, pp.166-171, 2002
10.M. J. Ko, M. W. Kim, D.S. Shin, Y. G. Park, M. S. Moon, I. H. Lim, ”Investigation on the Effect of Molding Compound on Package Delamination,” Electronic Components and Technology Conference, pp.1242-1247, 1997.
11.NTB Store, ”Electronic Materials Handbook,” Vol.1, pp.1-1140 (ASM international, 1989).
12.ASEK QA Laboratory Training Material.
13.ASEK Reliability Training Material.
14.Leadframe supplier, “Delamination Improvement Proposal”.
15.G. L. Ang, L.C. Goh, K.W. Heng, and S. K. Lahiri, “Oxidation of Copper Lead Frame,” Physical & Failure Analysis of Integrated Circuits. Pp.218-220, 1995.
16.S. Altimari, S. Golwalkar, P. Boysan, and R. Foehringer, “Role of Design Factor for Improving Moisture Performance of Plastic Packages,” Electronic Components and Technology Conference, pp.945-950, 1992.