在高速訊號傳輸的設計中，阻抗的匹配與否關係到信號的質量優劣。阻抗匹配（Impedance matching），主要用於傳輸線上，以達到所有高頻的微波信號皆能傳至負載點的目的，不會有信號反射回來源點，進而提升能源效益。
由於差動訊號傳輸比起單端訊號傳輸，會產生比較低的雜訊以及擁有比較高的共模雜訊抑制能力，非常適合用於高速訊號的傳輸架構。然而要設計一個好的差動傳輸線架構，除了做好傳輸線的設計外還必須考量到板廠的製程能力。本論文研究著重在藉由模擬、設計及量測封裝載板上的差動傳輸導線特性阻抗，來了解設計及實際載板間的差異，並探討線路成形尺寸、介質層及接地層三者對特性阻抗設計的影響，進而得到最佳的線路設計以達到特性阻抗控制的需求。

In the design with high-speed signal transmission, the matching of impedance would impact the quality of the signal. Impedance matching is primarily being implemented in the transmission line for the purpose of sending all the microwave signal of high-frequency to the destination without having signal reflection back to the source, thus enhancing the efficiency of power.
Differential signaling is suitable for high speed signal transmission due to lower noise induction and higher common-mode noise rejection compared to its single-ended signaling counterpart. However, the process capability of substrate supplier must also be included in order to create a fine differential pair layout structure. The research of this thesis concentrates on the characteristic impedance of differential pair through simulation, design and real measurement, to understand the difference between design and actual substrate. Furthermore, it explores the effect of the formation of trace dimension, dielectric and ground to the design of characteristic impedance, resulting in optimal trace routing method to achieve the control of characteristic impedance.

中文摘要 i
英文摘要 ii
誌謝 iii
目錄 iv
圖目錄 vi
表目錄 ix

第一章 緒論 1
1.1 研究背景與動機 1
1.2 論文架構 2
第二章 傳輸線理論與TDR原理 3
2.1 單端傳輸線 11
2.2 差動傳輸線 13
2.2.1 奇模態與偶模態 16
2.2.2 差動傳輸線特性阻抗 17
2.3 TDR(時域反射儀)原理 19
第三章 封裝載板差動傳輸線設計 35
3.1 封裝載板製程技術簡介 37
3.2 封裝載板結構選定 41
3.3 差動傳輸線設計 43
3.4 特性阻抗量測結果 45
第四章 切片量測與特性阻抗模擬結果與分析 54
4.1 載板切片量測結果 54
4.2 Q2D 模擬結果 58
4.3 結果討論與分析 63
第五章 結論與未來展望 65
5.1 結論 65
5.2 未來展望 66
參考文獻 68

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