臺灣博碩士論文加值系統

新世代的鋁電解電容開始採用具有高導電度及優異熱定性之導電高分子材料做為固態電解質，代替傳統式鋁電解電容內的電解液，大幅改善傳統鋁電解電容之缺點並展現出極為優異的電氣特性與可靠度，例如導電性高分子固態電容器不受溫度之影響；具備極為優異的使用壽命。因此導電高分子固態電容已成為下一代固態電容的開發主流；而隨著電子產品的輕薄趨勢，電容的晶片化也日趨重
要。
目前大部分導電高分子均是以化學合成法合成,合成時間長且純度不高。本研究是以電聚合的方式,來製備苯胺及N-苯基甘胺酸共聚物作為固態電容之有機半導體電解質。以同樣的量來比較,時間可相差3倍以上。實驗中藉由改變苯胺及 N-苯基甘胺酸的比例及不同的酸性環境如鹽酸,硫酸,硝酸,磷酸等.觀察電容值的變化再以SEM ,IR, UV ,TGA ,電容儀,交流阻抗儀等,觀察及檢測其性質。
實驗結果表示，聚合物在每種酸的掺雜下，裂解溫度均不一樣，但是都有超過錫爐的溫度，每種酸的形貌，在同樣濃度下也有不一樣的表現。而在電容特性表現部分，電容值會隨著共聚物的量增加而增加，而交流阻抗部份則是在2.5V
附近最為穩定。

Recently， the most conductive polymer are made by chemosynthesis. It takes time and impurity. Polyaniline (Ani) and N-phenylglycine (PG) were syntheized by electropolymerization. The kind of dopant that were used will also affect the synthesis process, as much as, the intrinsic polymer properties. We were using various acid medium (Doping acid) such as Hydrochloric acid, Sulfuric acid, Nitric acid and Phosphorous acid. And control the ratio of Ani and PG to prepare the copolymer film. Finally, we use SEM, IR, UV, TGA, capacitance meter, and Frequency Response
Analyzer to observe the properties.
The data shows the fact that the polymer’s decomposing temperature of diverse acids are different. The decomposing temperature is 280℃.Which means this material can pass the stannum oven. And the morphologies are not the same in diverse acids.
The part of capacitor’s characterization, capacitance will increase by the polymer
amount. And the Frequency Response Analyzer(Fra) section shows that the stable
voltage is 2.5V.

目錄
摘要...............................................................Ⅰ
Abstract...........................................................Ⅱ
誌謝...............................................................Ⅲ
目錄...............................................................Ⅳ
表目錄.............................................................Ⅵ
圖目錄.............................................................Ⅶ
第一章 序論.........................................................1
1.1前言........................................................1
1.2電容器介紹..................................................1
1.2.1電容器種類介紹.........................................1
1.3固態電容趨勢................................................3
1.4電容器的應用................................................5
1.5主機板上電容為什麼會鼓泡? ...................................8第二章 相關理論與文獻回顧...........................................8
2.1本實驗電容器構造簡介........................................8
2.2電化學反應系統..............................................9
2.3導電性高分子之特性與應用...................................10
2.3.1 電化學聚合. ..........................................11
2.3.2導電性高分子的成核現象................................12
2.3.3 導電性高分子的應用...................................14
2.4 聚苯胺的結構與電化學特性..................................15
2.4.1 聚苯胺的緣起.........................................15
2.4.2 聚苯胺的應用.........................................15
2.5 電化學電容器..............................................16
2.5.1 電化學電容器分類.....................................16
2.5.2 電化學電容器的量測...................................17
2.5.3 電極材料特性.........................................22
2.5.4 電解液的種類.........................................23
2.6整流二極體與濾波電容器的原理與應用.........................24
2.6.1 整流器簡介...........................................24
2.7 RoHS指令(2002/95/EC) .....................................29
2.8 焊錫熔點與電子零件關係....................................31
第三章 實驗設備、原理和方法........................................33
3.1實驗藥品...................................................33
3.2實驗裝置及儀器設備.........................................33
3.2.1實驗設備..............................................33
3.2.2實驗裝置圖............................................34
3.2.3儀器設備..............................................35
3.3實驗步驟及方法.............................................39
3.3.1實驗流程圖............................................39
3.4實驗方法...................................................41
3.4.1單體配製..............................................41
3.4.2各濃度酸配製..........................................42
第四章 結果討論....................................................44
4.1循環伏安探討...............................................44
4.2 SEM鍍膜表面觀察...........................................50
4.3熱重分析...................................................54
4.4單位克數之電容值...........................................60
4.5交流阻抗圖.................................................63
第五章 結論........................................................66
5.1循環伏安探討...............................................66
5.2 SEM鍍膜表面觀察...........................................67
5.3熱重分析...................................................68
5.3單位克數之電容值...........................................69
5.4交流阻抗圖.................................................69
參考文獻...........................................................70
附錄
附錄一 各比例之交流阻抗數據......................................74
附錄二 IR 圖譜...................................................90
附錄三 PG UV 圖譜...............................................96

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