跳到主要內容

臺灣博碩士論文加值系統

(2600:1f28:365:80b0:f3de:de2a:940c:ec8b) 您好!臺灣時間:2024/12/04 08:35
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

我願授權國圖
: 
twitterline
研究生:傅莉雯
研究生(外文):Li-Wen FU
論文名稱:熱塑性聚亞醯胺-聚矽氧橡膠摻合SiO2之製備與物性研究
論文名稱(外文):Preparation and Characterization of SiO2 Reinforced Poly(imide siloxane) Thermoplastic Rubber
指導教授:廖文城廖文城引用關係
學位類別:碩士
校院名稱:國立雲林科技大學
系所名稱:化學工程與材料工程研究所
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:96
語文別:中文
論文頁數:101
中文關鍵詞:二氧化矽熱塑性彈性體聚亞醯胺-聚矽氧共聚物
外文關鍵詞:poly(imide siloxane) copolymerthermalplastic e
相關次數:
  • 被引用被引用:1
  • 點閱點閱:291
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
本研究以pyromellitic dianhydride (PMDA), 2,2’-bis[4-(3-aminophenoxy)phenyl] sulfone (m-BAPS)和α, ω-bis (3-aminopropyl) polydimethyl siloxane (PDMS)合成出不同軟硬鏈段含量的聚亞醯胺-聚矽氧的前驅物(PAAS),再將不同比例的SiO2摻混入PAAS中,經由熱環化程序製備出PIS/SiO2複合材料。在PIS共聚物的研究中,微相分離是一個很重要的現象,此現象會影響到PIS/SiO2複合材料的物理性質及其日後的應用。
在研究結果方面,由TEM可觀察出本研究合成之聚亞醯胺-聚矽氧共聚物皆具有微相分離的情形。另外,SiO2在PIS基材中的分散性可由SEM顯像觀察到SiO2皆均勻地分散在PIS共聚物中。拉力試驗結果顯示PIS/SiO2複合材料具有良好拉伸性及延展性,其最高的斷裂伸長量可達989%。而隨著SiO2的含量增加則楊氏模數及拉伸強度均會隨著上升,顯示SiO2可作為一個好的補強材料。在熱性質的方面,熱裂解溫度及玻璃轉移溫度均隨著SiO2添加量之增加而上升。
The poly(imide siloxane) precursor were blended with Hexamethyldisilazane (HMDS) modified silica were synthesized through straightforward simultaneous condensation reaction of pyromellitic dianhydride (PMDA), 2,2’-bis[4-
(3-aminophenoxy) phenyl] sulfone (m-BAPS) andα, ω-bis (3-aminopropyl) polydimethyl siloxane(APPS). The prepared PIS copolymers possess the properties of thermal plastic elastomers. Microphase separation, affected by formulation, was found to be important phenomenon that determined the physical properties of the PIS copolymer.
The achievement of reinforcement by the incorporation of SiO2 in PIS matrix can be well reflected in mechanical properties of hybrid composites. Mechanical measurement with the tensile meter showed that the poly(imide siloxane)/SiO2 composites exhibited a good extension. These poly(imide siloxane)/SiO2 composites exhibited excellent rubber property. The thermal stability and mechanical properties were found to increase with increasing SiO2 content.
目 錄

中文摘要 ---------------------------------------i
英文摘要 --------------------------------------ii
誌謝 -------------------------------------iii
目錄 --------------------------------------iv
表目錄 -------------------------------------vii
圖目錄 ------------------------------------viii
第一章、 緒論-----------------------------------1
第二章、 原理及文獻回顧-------------------------5
2. 1 熱塑性彈性體---------------------------5
2. 1. 1 熱塑性彈性體的性質---------------------5
2. 1. 2 熱塑性彈性體的分類---------------------7
2. 2 聚亞醯胺------------------------------12
2. 3 有機聚矽氧之結構及其物性--------------17
2. 4 矽橡膠及一般傳統橡膠------------------20
2. 5 有機/無機奈米複合材料-----------------25
2. 5. 1 二氧化矽之特性------------------------25
2. 5. 2 無機補強材料及複合材料兩者之相關性----27
2. 5. 3 二氧化矽補強聚(亞醯胺-矽氧)共聚物-----29
2.6 研究目的及動機------------------------32
第三章、 實驗部份------------------------------33
3. 1 實驗藥品------------------------------33
3. 2 實驗分析儀器--------------------------35
3. 3 實驗步驟------------------------------36
3. 3. 1 單體之純化程序------------------------36
3. 3. 2 聚亞醯胺-聚矽氧摻混SiO2之合成反應-----37
3. 3. 3 PIS/SiO2複合材料之鑑定----------------38
3. 3. 4 實驗配方------------------------------39
3.3.5 實驗樣品分析與製備方法----------------42
第四章、 結果與討論----------------------------44
4. 1 材料結構鑑定--------------------------44
4. 1. 1 聚亞醯胺-聚矽氧烷共聚物之FTIR分析-----45
4. 1. 2 有機聚矽氧之1H-NMR分析----------------50
4. 2 PIS/SiO2複合材料之微結構分析----------52
4. 2. 1 PIS共聚物TEM之分析--------------------52
4. 2. 2 PIS/SiO2複合材料之SEM分析-------------54
4. 3 PIS/SiO2複合材料之熱性質分析----------59
4. 3. 1 熱裂解溫度( thermal degradation temperature, Td)------------------------------59
4. 3. 2 玻璃轉移溫度( glass transition temperature, Tg)------------------------------65
4. 4 機械性質------------------------------71
4. 5 彈性恢復試驗--------------------------76
4. 6 PIS/SiO2複合材料之透光性分析----------78
4. 7 溶解度試驗----------------------------82
第五章、 結論----------------------------------84
第六章、 參考文獻------------------------------86
1.劉念強,動態架橋熱可塑性橡膠TPV 介紹,高分子工
業,第99期,pp.38-44 (2002)
2.王修堂、賴森茂,熱可塑性彈性體,應用高分子手
冊,pp.410
3.李欣怡,聚酯彈性體之合成及性質研究,(1990)
4. 林唯芳,有機無機奈米材料,塑膠資訊,第60 期,
pp.4 (2001)
5. 廖建勳,納米高分子複合材料,工業材料,125
期,pp.110 (1997)
6. J. M. Yeh, S. J. Liou, C. Y. Lai, P. C. Wu
and T. Y. Tsai., Chem of Mater, 13, 1131
(2001)
7. A. Y. Coran and R. P. Patel, in
‘‘Thermoplastic Elastomers,’’ 2nd ed., in
Thermoplastic Elastomers, G. Holden, R. P.
Quirk, N. R. Legge, and H. E. Schroeder,
Ed., Chapter 7 Hanser Publishers, Munich,
(1996)
8. R. J. Spontak and N. P. Patel., Curr Opin
Colloid Interface Sci., 5, 333 (2000)
9. 郭人鳳,熱塑性彈性體簡介,塑膠資訊,第14 期,
pp1-8 (1997)
10.I. Yilgor and J. E. McGrath., Adv Polym Sci,
86,1 (1988)
11.E. Rogers, D. Rofrigues, A. Brennan, G. L.
Wilkes, and J. E. McGrath., Contemp
Polym Sci, 7, 47 (1992)
12.N. Furukawa, Y. Yamada and Y. Kimura, High
Perform Polym, 9, 17 (1997)
13.V. H. Kuckertz and I. A. Battelle., Die
Makromolekulare Chem, 98, 101 (1966)
14.S. NAKATA, M. KAWATA, M-AKI KAKIMOTO and
YlMAl., J Polym Sci: Part
A Polym Chem, 31, 3425 (1993).
15. Y. Yamada and N. Furukawa., Polym J, 29, 923
(1997).
16.H. R. Kricheldorf, T. Wollhein, C. E.
Koning, H. G. Werumeus-Buning and V.
Altsta., Polym, 42, 6699 (2001)
17.H. H. Yeganeh and M. A. Shamekhi., Polym, 45,
359 (2004).
18.T. Takeichi, K. Ujiie, and K. Inoue, Polym,
46, 11225 (2005).
19.C. K. Ku and Y. D, Lee., Polym, 48 , 3565
(2007).
20.W. C. Liaw, J. C. CHIEN, H. KANG, Y. L.
CHENG, and L. W. FU., Polym J, 40,1
(2008)
21.F.W. Harris, S.O. Norris, L.H. Lanier, B.A.
Reinhardt, R.D. Case, S.Varaprath, S.M.
Padaki, M. Torres, and W.A.Feld, in
Polyimides: Synthesis, Characterization and
Applications, 1, K.L. Mittal, Editor,p.1,
Plenum, New York (1984)
22.F.W. Harris, in Polyimides, D. Wilson, H.D.
Stenzenberger, and P.M. Hergenrother,
Editors, p.1, Chapman and Hall, New York
(1990)
23.Morton M. M., J. Poly. Sci. Polym. Symp., 60,
1 (1977)
24.H. R. Lubowitz, “Polyimide polymers”, U.S.
patent No.3,528,950 (1970)
25.Young R and Chang A.C., J. Polym Sci part A :
Polym Chem , 28 , 3107 (1990)
26.J. de Abajo and J. G. de la Campa, in
Advances In Polymer Science:Progress In
Polyimide Chemistry, H. R. Kricheldorf
Editor,p.26, Springer, Berlin (1999)
27.T.L. St Clair , A.K. St Clair and E.N. Smith,
in Structure-Solubility Relationships
In Polymers, F.W. Harris and R.B. Seymour
Editors, pp.199, Academic Press,
NewYork (1977)
28.J. Malinge, J. Garapon and B. Sillion .,
British Polym. J., 20, 431 (1988)
29.M. G. Voronkov, V. P. Mileshkevich, and Yu.
A. Yuzhev-skil, “TheSiloxane
Bond”,Consultants Burwau New York and
London, pp. 159,1978.
30.Wright ,P.V., K. J. and Saegusa,T.,
RingOpening Polymerization , Elsevier , New
York , 2, 324 (1984)
31.I.Yilgor , and J. E. Mcgrath ., Adv Polym
Sci, 86, 1 (1988)
32.S. J. Clarson and S. J. Semlyen., Siloxane
Polymer P. T. R. Prentice Hall (1993)
33.C. Eaborn, “Organosilicone Compound”,
Butter Worths Scientific Publication.
London, pp.100, (1962)
34.W. Noll, “Chemistry and Technology of
Siloxane”, Acedemic Press,New York,
pp.17 (1968)
35.P. V. Wright, “Ring Opening
Polymerization”, Elsevier Appl Sci
Publishes,Chapter 14, 93 (1985)
36.J. Burkhardt, “Silicone Chemistry and
Technology”, Vulkan-Verlag Essen, Germany,
pp.31 (1991)
37.G. B. Sohoni and J. E. Marj., J Appl Polym
Sci, 45, 1763 (1992)
38.S. S. Choi, B. H. Park and H. Song., Polym
Adv Technol, 15, 122 (2004)
39.K. H. Chung., J Appl Polym Sci, 108, 3952
(2008)
40.N. Suzuki, F. Yatsuyanagi and M. Ito., J.
Appl Polym Sci, 86, 1622 (2001)
41.A. A. Katbab, H. Nazockdast, S. Bazgir., J
Appl Polym Sci., 75, 1127 (2000)
42.Y. W. Leong, Z. A. Mohd. Ishak, A. Ariffin.,
J Appl Polym Sci, 91, 3327 (2004)
43.E. Manias, A. Touny, L. Wu, K. Strawhecker,
B. Lu, and T. C. Chung., Chem. Mater, 13,
3516 (2001)
44.A. K. Gupta, K. R. Srinivasan and P. K.
Kumar, J Appl Polym Sci., 43,451 (1991)
45.馬振基、張文吉,塑膠資訊,第67 期,pp.45-46
(2002)
46.C. J. T. Landry, B. K. Coltrain, D. M.
Teegarden, T. E. Long, V. K. Lomg,
Macromolecular, 29, 4712 (1996)
47.F. Yang, Y. Ou, Z. Yu, J Appl Polym Sci, 69,
355 (1998)
48.Y. M. Lee, H. B. Park, J. K. Kim., Macromol
Rapid Commun., 23, 544 (2002)
49.H. B Park, J. H. Kim, J. Kim, Y. M. Lee.,
Macromol Rapid Commun , 23, 544
(2002)
50.Z. Shang, C. Lu¨ and L Gao., Polym Int, 55,
1277 (2006)
51.W. C. Liaw and K. P. Chen., J Appl Polym Sci,
105, 809 (2007)
52.C. K. Ku, C. H. Ho, T. S. Chen, Y. D. Lee., J
Appl Polym Sci, 104, 2561 (2007)
53.C. Lu, Z. Wang, F. Liu, J. Yan, L Gao., J
Appl Polym Sci, 100, 124 (2006)
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top