現今很多無線時下通訊標準被廣泛地使用。現在的無線網路應用的主要為能夠傳輸高速的資料及符合多標準的需求。對無線服務增加的需求已經使對單一個的通信系統需要能支援多標準操作。切換式架構或寬頻技術都能夠在多標準系統上使用。然而，寬頻式技術相較於切換式架構之下或許會較為簡單，因為他不需要有切換式的架構。
在本論文中，我們採用台積電0.18 um互補式金屬氧化物半導體製程技術設計四顆晶片。
在第一顆晶片中，以折疊疊接(folded cascode)電路電路架構為主設計WiMAX 2-6GHz應用，應用負回授來做寬頻匹配，因為偏壓較低可以應用在低電壓電路上，晶片總面積為1.21 mm × 1.04 mm。
在第二顆晶片中，以共閘極架構為主，搭配源極隨耦器輸出極，容易實現輸出與輸入匹配。本電路並具有低功率消耗和實現多頻段應用，晶片總面積為1.02 mm × 1.2 mm。
在第三顆晶片中，以共閘極架構為主實現寬頻輸入匹配。並利用切換式電感來實現多頻段的應用，晶片總面積為1.03 mm × 1.04 mm。
在第四顆晶片中，本電路是採用電流再使用式電路及電阻回授的方式。本電路利用了變壓器偶合的方式來減少晶片面積，晶片總面積為1.35 mm × 0.71 mm。

Recently many communication standards are widely used nowadays. Modern wireless applications require current devices to be able to have higher data rates and cohere with multi-standard use. The increasing demand for wireless services has driven the need for a single communication system to support multi-standard operation. Switch reconfigurable or Broadband technology can use in multi-standard system. However, Broadband technology may be simply to Switch reconfigurable, because it unnecessarily switch structure.
In this thesis, the four chips are proposed based on TSMC 0.18um CMOS processes.
In the first chip, a 2-6GHz WiMAX LNA with folded-cascode topology is designed by using negative feedback to attain broadband matching. This circuit is suitable for the application on the low-voltage system. The whole chip area is 1.21 mm × 1.04 mm.
In the second chip, the common gate topology is used as the core structure. A source follower is used as the output stage. This makes the input and output matching easy. The circuit is also designed to operate at low power consumption and multi-band for WiMAX application. The whole area of the chip is 1.02 mm × 1.2 mm.
In the third chip, a multi-band LNA with switch inductor topology is designed by using common gate topology to attain broadband matching. The whole chip area is 1.03 mm × 1.04 mm.
In the fourth chip, the main topology is employing current reused amplifier and resistance feedback. We use transformer coupled to reduce the area. The area of the chip is 1.35 mm × 0.71 mm.

第一章 緒論
1.1 簡介WiMAX ------------------------------------------------------------------------ 1
1.2何謂WiMAX技術------------------------------------------------------------------- 2
1.3 WiMAX之頻段 --------------------------------------------------------------------- 3

第二章 接收機架構
2.1系統簡介------------------------------------------------------------------------------- 4
2.1.1 類比與數位系統-------------------------------------------------------------- 4
2.1.1.1類比系統--------------------------------------------------------------- 5
2.1.1..2數位系統-------------------------------------------------------------- 5
2.2 超外差式接收器 (Super-Heterodyne Receiver)-------------------------------- 7
2.2.1 鏡像頻率 (Image) ----------------------------------------------------------- 8
2.2.2 半中頻 (Half IF) ------------------------------------------------------------- 9
2.3 直接降頻接收器 (Direct Conversion Receiver DCR)------------------------- 10
2.3.1 直流準位偏移 (DC Offset) --------------------------------------------- 11
2.3.2 偶次諧波失真 (Even-Order Distortion) ------------------------------- 12
2.3.3 顫動雜訊(Flicker Noise) ---------------------------------------------------- 13
2.4 接收機雜訊源 (Receiver Noise)-------------------------------------------------- 13
2.4.1 接收機熱雜訊 (Receiver Thermal Noise)-------------------------------- 13
2.4.2 發射端雜訊-------------------------------------------------------------------- 15
2.4.3 本地振盪器雜訊與干擾 (LO Leakage and Interference)-------------- 16
2.5 傳播效應 (Propagation Effects)-------------------------------------------------- 17
2.5.1 路徑損耗(Path Loss)--------------------------------------------------------- 17
2.5.2 多重路徑與通道衰減 (Multipath and Fading)-------------------------- 18
2.5.3 等化器 (Equalization)、分集 (Diversity)、加密 (Coding)---------- 19
第三章 高頻電路設計考量
3.1 閃射參數 (Scattering Factor；S parameter) ----------------------------------- 20
3.2 增益 (Gain)-------------------------------------------------------------------------- 23
3.3 穩定度 (Stability)------------------------------------------------------------------- 26
3.4 非線性效應 (Effect of Nonlinearity)--------------------------------------------- 27
3.4.1 諧波項 (Harmonics)--------------------------------------------------------- 28
3.4.2 1dB增益壓縮點 (1dB Gain Compression Point)----------------------- 29
3.4.3 交互調變與三階截斷點 (Intermodulation and
Third-Order Intercept Point )------------------------------ 30
3.4.4 IP3的計算-------------------------------------------------------------------- 32
3.5阻抗匹配網路 (Impedance Matching Network )-------------------------------- 35
3.5.1 電阻匹配----------------------------------------------------------------------- 38
3.5.2 電晶體主動匹配-------------------------------------------------------------- 39
3.5.3 源極退化電感匹配----------------------------------------------------------- 40
3.5.4 LC-Ladder匹配-------------------------------------------------------------- 42

第四章 電路實作
4.1 設計流程------------------------------------------------------------------------------ 44
4.2運用於WiMAX單電源低電壓折疊式低雜訊放大器------------------------- 45
4.2.1電路架構簡介------------------------------------------------------------------ 45
4.2.2架構說明------------------------------------------------------------------------ 46
4.2.3模擬與量測--------------------------------------------------------------------- 50
4.2.4佈局與晶片照------------------------------------------------------------------ 54
4.2.5規格列表------------------------------------------------------------------------ 55
4.2.6結果討論------------------------------------------------------------------------ 55
4.3運用於WiMAX之多頻段低雜訊放大器---------------------------------------- 56
4.3.1電路架構------------------------------------------------------------------------ 56
4.3.2架構說明------------------------------------------------------------------------ 57
4.3.3模擬與量測--------------------------------------------------------------------- 60
4.3.4佈局與晶片照------------------------------------------------------------------ 69
4.3.5規格列表------------------------------------------------------------------------ 70
4.4利用切換式電感之多頻段低雜訊放大器---------------------------------------- 71
4.4.1電路架構------------------------------------------------------------------------ 71
4.4.2架構說明------------------------------------------------------------------------ 71
4.4.3模擬與量測--------------------------------------------------------------------- 72
4.4.4佈局與晶片照------------------------------------------------------------------ 81
4.4.5規格列表------------------------------------------------------------------------ 82
4.5 2 - 6GHz 多標準之電流再使用式低雜訊放大器 -------------------------- 83
4.5.1電路架構------------------------------------------------------------------------ 83
4.5.2架構說明------------------------------------------------------------------------ 83
4.5.3模擬與量測--------------------------------------------------------------------- 88
4.5.4佈局與晶片照------------------------------------------------------------------ 93
4.5.5規格列表------------------------------------------------------------------------ 94
第五章 結論與未來研究方向
5.1 結論------------------------------------------------------------------------------------ 95
5.2 未來研究方向------------------------------------------------------------------------ 95

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