臺灣博碩士論文加值系統

在本論文中，我們使用固相結晶技術沉積低溫複晶矽薄膜電晶體通道之後，我們使用真空濺鍍系統並使用高介電常數材料鋱氧化物，來形成低溫複晶矽薄膜電晶體(poly-Si TFTs)的閘極介電層，再利用氮化鉭當作其閘極。使用鋱氧化物當閘極層，可比傳統以矽氧化物當作閘極介電層的薄膜電晶體有較低的閘極漏電流和卓越的熱穩定性。利用氮化鉭金屬閘極取代傳統複晶矽閘極可降低製程溫度及降低閘極片電阻。
另外，我們在成長複晶矽薄膜電晶體通道之後，利用電漿增強化學蒸鍍系統(PECVD)在通道表面上打四氟化碳電漿(CF4 plasma)，再使用鋱氧化物的閘極層和氮化鉭金屬閘極，形成低溫複晶矽薄膜電晶體(poly-Si TFTs)。將其與未打四氟化碳電漿的鋱氧化物閘極層複晶矽薄膜電晶體做比較，打四氟化碳電漿的複晶矽薄膜電晶體擁有較高的導通電流、較低的閘極漏電流與閘極引發汲極漏電(GIDL)，並且改善其電子遷移率(mobility)與可靠度的提升。
最後，我們分別對電漿處理過與未用電漿處理過的複晶矽薄膜電晶體做熱載子應力測試與正偏壓溫度不穩定性(positive bias temperature instability)之研究。實驗結果顯示，有經過四氟化碳電漿處理過的複晶矽薄膜電晶體，其可靠度有顯著的改善，這是因為氟會取代在複晶矽通道中和矽與二氧化矽介面處，其較弱的矽氫鍵結，形成較強的矽氟鍵結，而提高對熱載子應力及正偏壓溫度不穩定性的免疫力。

In this work, we deposit Poly-Si channel by SPC crystal system, we utilize high κ value material terbium oxide to form the gate dielectric of the low temperature poly-Si thin film transistors by sputter system, and use TaN as its gate electrode. Compare to the convention oxide gate dielectric thin film transistor , using terbium oxide as gate dielectric shows higher κ value, lower gate-leakage current, and superior thermal stability. Choosing TaN metal gate to replace conventional poly-Si gate can reduce process temperature and sheet resistance of the gate.
In addition, after channel are deposited, we utilize CF4 plasma treatment on it by plasma enhanced chemical vapor deposition (PECVD) system, then use terbium oxide gate dielectric and TaN metal gate to form low temperature poly-Si thin film transistors. Compare with the poly-Si terbium oxide gate dielectric TFTs using CF4 plasma treatment and control TFTs, the CF4 plasma-treated TFTs shows higher on current, lower gate-leakage current, gate-induced drain leakage (GIDL), and improves mobility and reliability.
Finally, we test the CF4 plasma-treated TFTs and control TFTs with hot-carrier stress and positive bias temperature instability (PBTI). The results show that the CF4 plasma-treated TFTs exhibit superior reliability characteristic. The improvement is a result of the fluorine passivation, which reduces trap-state density and forms stronger Si-F bonds in place of the weak Si-H bonds in the poly-Si channel and at the praseodymium titanium oxide gate dielectric/poly-Si interface. So the CF4 plasma treatment can promote hot-carrier stress and positive bias temperature instability (PBTI) immunity.

Acknowledgment……………………………………………………........i Abstrac(Chinese)………………………………………………………...iii
Abstract(English)…………………………………………………...........v
Contents…………………………………………………………..…….vii
Table & Figure Caption……………….………………………………….x
Chapter 1
Introduction
1-1 Overview of Thin-Film Transistors (TFTs)……..….…………....1
1-1-1 Recent High-k Dielectric
1-2 Crystallization of α-Si Thin Film………………….…….………6
1-2-1 Solid Phase Crystallization (SPC)
1-2-2 Excimer laser annealing (ELA)
1-2-3 Metal induced lateral crystallization (MILC)
1-3 Impacts of Grain Boundaries on TFT’s................................8
1-4 Techniques to Upgrade TFT’s Performance…………………......9
1-4-1 Silicon Self ion Implantation
1-4-2 Polysilicon Film Grown by Si2H6 Instead of SiH4
1-4-3 Passivation of Trap States by Plasma
1-5 Motivation…………………………………………….……….11
1-6 Organization of the Thesis…………………………………….14
Chapter 2
Electrical and physical characteristics of Tb2O3 for metal-oxide- semiconductor gate dielectric applications
2-1 Introduction……………………………………….……………15
2-2 Experiments……………………………….……………………16
2-3 Physical characterization……………………………………….16
XRD of Terbium Oxide Analysis
2-4 Electrical characterization
2-4-1 C-V Characteristic………………………………………..17
2-4-2 J-V Characteristic………………………………………...17
2-5 Summary………………………………………………………...17

Chapter 3 High-Performance Poly-Silicon TFTs with TaN Gate Electrode and Tb2O3 Gate Dielectric
3-1 Introduction…………………………………………………….22
3-2 Experiments…………………………………………………….23
3-3 Method of Device Parameter Extraction……….………………25
3-3-1 Determination of Field Effect Mobility
3-3-2 Determination of Threshold Voltage
3-3-3 Determination of Subthreshold Swing
3-3-4 Determination of ON/OFF Current Ratio
3-3-5 Extraction of Grain Boundary Trap State Density
3-4 Results and Discussion…………………………………………30
3-5 Conclusions…………………………………………………….32

Chapter 4 CF4-Plasma-Induced Fluorine Passivation Effects on Poly-Si TFTs with High-κ Tb2O3 Gate Dielectric
4-1 Introduction……………………………………………………..40
4-2 Experiments…………………………………………………….42
4-3 Results and Discussion……………………………....................43
4-4 Conclusions…………………………………………………….49

Chapter 5 Conclusions…………………………………………………..70

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