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研究生:邱淑靜
研究生(外文):Chiu, Shu-Ching
論文名稱:台灣半導體相關產業重大災害原因探討與分析
論文名稱(外文):Trends in Major Incidents of Semiconductor-relatedIndustries in Taiwan
指導教授:陳振和陳振和引用關係
學位類別:碩士
校院名稱:長榮大學
系所名稱:職業安全與衛生研究所
學門:醫藥衛生學門
學類:公共衛生學類
論文種類:學術論文
論文出版年:2008
畢業學年度:97
語文別:中文
論文頁數:62
中文關鍵詞:重大災害半導體相關產業損害防阻
外文關鍵詞:Major incidentSemiconductor-related industryLoss prevention
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本研究收集與分析自 1995 年至 2007 年台灣半導體相關產業重大災害事件。共收集了 59 個災害案例。探討半導體產業上、下游較具高風險性的工廠與導致災害發生的重大原因。比較產生災害的製程或化學品,以確認何者易導致較重大災害或較大的經濟損失。災害的種類可分為四大類型,各為火災、爆炸、爆炸引起火災及有毒或有害化學品外洩。統計分析結果以半導體製業、PCB 製造業及電子組裝業較容易產生重大災害。發生災害事故以 2000 年及 2006 年次數較多,而一年中較容易發生事故在電子業旺季的 5 月份至 12 月份。發生災害的次數以火災所佔比率最高約 59%。59件災害事故總死亡人數為 11 人,總受傷人數為 225 人,設備及直接財物損失約 311 億元新台幣。矽甲烷及可燃性物質最容易導致半導體相關工廠的火災。半導體相關工廠廢氣排放管吸附或殘留的矽甲烷引起廢氣排放管火災並延燒至整座工廠,造成重大的損害。造成重大的損害最嚴重的半導體相關工廠火災全部損失約新台幣122億(約3億7仟萬美元)。
Reactive chemicals and combustible materials have led to numerous losses in Semiconductor-related industry in Taiwan. Fifty nine incidents were collected and analyzed on related information to provide an integrated overviews of such events in the past thirteen years. Various types of factories either in the upstream or downstream of semiconductor-related industry were reviewed to deduce which kind of plant is feasible to possesses the higher risk of occurrence. Different kinds of chemicals or processes were compared with each other to verify the causes which led to the higher or largest loss already happened. Accidental fires caused by saline or flammable vapors are the dominant types of incidents in the semiconductor plant in comparison to any other types of materials. Besides, explosions, release of hazardous chemicals, and injuries by hazardous or corrosive chemicals are the three kinds of most common incidents encountered. Fire spread from the common exhaust duct or relief header always resulted in the largest loss among the reported events. The most serious lesson learnt from these losses was about three hundred and seventy million us dollars.
目 錄
口試委員審定書 ------------------------------------------------------------------------ i
誌謝 ------------------------------------------------------------------------ ii
中文摘要 ------------------------------------------------------------------------ iii
英文摘要 ------------------------------------------------------------------------ iv
目錄 ------------------------------------------------------------------------ v
表目錄 ------------------------------------------------------------------------ vi
圖目錄 ------------------------------------------------------------------------ vii
第一章 前言------------------------------------------------------------------ 1
1.1 國內半導體相關產業發展現------------------------------------ 1
1.2 國內已發生重大半導體相關產業重大災害事故----------- 1
1.3 半導體製程潛在的危害與風險--------------------------------- 2
1.4 半導體工廠安全管理問題--------------------------------------- 3
1.5 半導體工廠相關法規與工業實務------------------------------ 4
1.6 研究目的------------------------------------------------------------ 5
第二章 世界各國重大工業災害的調查與研--------------------------- 6
2.1 德國重大化學災害調查與研------------------------------------ 7
2.2 日本化工廠災害事故的趨勢------------------------------------ 7
2.3 美國重大化學災害調查與研究--------------------------------- 9
2.4 各國半導體工廠災害導致設備損失狀況--------------------- 10
2.5 日本半導體工廠事故災例分析--------------------------------- 11
第三章 中華民國半導相關工廠事故災例分析------------------------ 13
3.1 事故資料的收集分析--------------------------------------------- 13
3.2 中華民國半導相關工廠事故災例分析------------------------ 13
第四章 結果與討論--------------------------------------------------------- 27
第五章 結論------------------------------------------------------------------ 29
參考文獻 ------------------------------------------------------------------------ 30
附錄一 SEMI S2-93A半導體製程設備安全指引--------------------- 33
附錄二 中華民國半導體相關產業災害事故分析表------------------ 42
附錄三 APSS 2007研討會論文------------------------------------------- 57
1. 何三平,陳佑任,企業風險管理之良藥-建立完善的消防安全設施,工業安全科技53期,2004年11月,經濟部工業局。
2. 林奧,電子產品組裝業之防火管理實務,工業安全科技(2005 JUL) ,P.16-22。
3. 陳政任,半導體廠火災原因探討與風險管理策略,化工技術第10卷第1期(2002)。
4.Semiconductor Equipment and materials International, USA, 1993; “SEMI S2-93A: Safety Guidelines for Semiconductor Manufacturing Equipment: 1-12.
5.Semiconductor Equipment and materials International, USA, 1993; “SEMI S3-91: Safety Guidelines for Heated Chemical Baths: 1-3.
6.NFPA 318, Standards for the Protection of Cleanrooms, National Fire Protection Assocation, 1995.
7.Factory Mutual Research Co. Data Sheet 7-7/17-12, Semiconductor Fabrication Facilities, January, 2001.
8.Vincent Degiorgio, “Overview of Worldwide Semiconductor Loss Experience and Facility Design Issue”, Semiconductor Facility Accident Prevention Workshop, 4-5 December, Hsihchu, Taiwan, ROC, 1997.
9.The Society of Japanese Semiconductor Facilities, Collections of the incidents on Semiconductor-related Facilities in Japan (in Japanese), 1997.
10.Hans-goachim Uth, Trends in major industrial accidents in Germany, J. Loss Prevention in the Process Industries, 12, P.69-73 (1999).

11.Christian Kirchesteiger, Trends in Accidents, Disasters and Risk Sources in Europe, J. Loss Prevention in the Process Industries, 12, P.7-17 (1999).
12.Z. Nivolianitou, M. Konstandindiou, C. Kiranoudis, and N. Markatos, Development of a Database for Accidents and Incidents in the Greek Petrochemical Industry, J. Loss Prevention in the Process Industries, 19, P.630-638 (2006).
13.P.L. Bradley and A. Baxter, Fires, Explosions and Related Incidents at Work in Great Britain in 1998/1999 and 1999/2000, J. Loss Prevention in the Process Industries, 15, P.365-372 (2002).
14.I.M. Shaluf, F.-R. Ahmadun, and A. M. Said, Fire Incident at a Refinery in West Malaysia: the Causes and Lessons Learned, Trends in Accidents, J. Loss Prevention in the Process Industries, 16, P.297-303 (2003).
15.A.L. Sepeda, Lessons Learned from Process Incident Databases and the Process Safety Incident Database (PSID) Approach Sponsored by the Center for Chemical Process Safety, J. of Hazardous Materials, 130, p.9-14(2006).
16.Masahide Wakakura, Yoshiaki Iiduka , Trends in Chemical Hazards in Japan, J. Loss Prevention in the Process Industries, 12, P.79-84 (1999).
17.U.S. Chemical Safety and Hazard investigation Board, http:// www.chemsafety.gov/
18.ITRI (Taiwan, R.O.C.), http://www.itri.org.tw/accident/index.htm/
19.Fen Hsieh, Development of Micro-Array Release Sensors, Master Thesis, National Yunlin University of Science and Technology, Yunlin, Taiwan, R. O. C., 2003.
20.OSHA, http://www.osha.gov/ , 2007.06.07.

21.S.G. Lee, H. Ohtani, Y. Uehara and M. Aramaki, Experimental Study on Flammability Limit of a Chlorine Trifluoride/ Dichlorosilane/Nitrogen Mixture, J. Loss Prevention in the Process Industries, 5, P.192-195 (1992).
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