目前通訊科技日新月異，電子業蓬勃發展，產品往輕薄短小發展，數位化更是趨勢，速度的要求也愈來愈快，因此 EMI的問題也越趨嚴重。也因產品體積日趨縮小而攜帶方便，在移動通信系統，無線射頻系統設計，提供最佳解決方案。
傳導型 EMI的解決方式通常是加一個電源濾波器在電源端的入口，以抑制雜訊從電源線傳出。因此選擇適合的濾波器是解決傳導型 EMI的關鍵，能夠很快速且有效率的將濾波器設計出來是每一個工程師的目標。其中傳導型 EMI的雜訊分兩個模態，共模和差模訊號，濾波器的設計和雜訊的模態有密切的關係，因此能將雜訊分開將對工程師設計濾波器有很大的幫助，可以縮短設計時間及成本。

本文探討了採用低容TVS防止ESD時，最小擊穿電壓和擊穿電流、最大反向漏電流和額定反向切斷電壓等參數對電路的影響及選擇準則，並針對可攜通訊電子設備、以及手機的視訊線路保護、USB保護等介紹了一些典型應用。隨著行動產品、視訊轉換盒(STB)等產品的迅速發展，消費者正要求越來越先進的性能。半導體元件日益趨向小型化、高密度和功能複雜化，特別是像時尚消費電子和通訊可攜式產品等對主板面積要求嚴格的應用很容易受到靜電放電的影響。一些採用了深次微米製程和甚精細線寬佈線的複雜半導體功能電路，對電路瞬變過程的影響感應更強烈，而這都將突顯上述問題。最後，依實際通訊產品應用做說明,也針對影響保護元件因素做可靠度驗證和如何量測EMI做實驗,本論文在下述章節會說明。

Current communications technology with each passing day, booming electronics industry, product development to light short, digitization is a trend of increasing demand for speed faster, so the problem of EMI is also getting more and more serious, Also becoming increasingly smaller due to product size and easy to carry, in the mobile communications systems, radio frequency system design, to provide the best solution.
EMI conduction type of solution is usually an additional filter in the power supply side of the entrance to curb noise came from the power cord. Therefore choose to solve the conduction-type filter is the key to EMI can be very fast and efficient filter design will come out is the goal of every engineer. EMI conduction type in which the two-mode noise, common-mode signals and differential-mode signal, filter design and modal noise are closely related, so engineers will be able to separate the design of noise filters have very great help, you can shorten the design time and cost.
This paper discusses the use of low capacity TVS to prevent ESD, the minimum breakdown voltage and breakdown current, the maximum reverse leakage current and rated voltage, such as cutting back on the circuit parameters and selection criteria, and the portability of communications for electronic equipment, as well as video phone line protection, USB protection, introduced a number of typical application. With mobile products, set-top box (STB), such as the rapid development of products, consumers are demanding more and more advanced features. Semiconductor components of the growing trend of small-scale, high-density and functional complexity, especially as fashion portable consumer electronics and communications products, such as demanding on the main board of the application area is highly susceptible to the effects of electrostatic discharge. Some use of deep sub-micron manufacturing process and a very fine line width semiconductor features the complexity of wiring circuit, circuit transient process of induction is stronger, which will highlight the issue. Finally, according to the actual application of communications products that also protect the components against the effects of factors and how to verify the reliability of EMI measurement experiments, This paper will describe in the following sections.

目錄
摘要 I
ABSTRACT II
致謝 III
目錄 IV
圖目錄 VI
表目錄 VIII
第1章 緒論 1
1.1 研究動機 1
1.2 本文架構 2
第2章 系統與元件電磁干擾的測量 3
2.1 系統與元件電磁干擾量測差異 3
2.2 系統與元件電磁干擾量測差異 3
2.3 傳導型EMI 的量測配置 6
2.4 電源阻抗穩定網路的介紹 7
2.5 傳導型EMI 雜訊的產生 10
第3章 概述靜電放電與規範 14
3.1 靜電成因與靜電放電現象 14
3.2 靜電與雷擊的主要特性參數分析及典型應用 22
第4章 EMI 檢知電路 35
4.1 共模檢知電路 35
4.2 差模信號檢知電路 37
4.3 EMI濾波器的基本架構 39
第5章 傳導型EMI 和ESD 防治應用實例說明 42
5.1 EMI/EMC 問題解決對策 42
5.2 系統設計 LPF 使用元件考量 42
5.3 濾波元件插入損失量測 42
5.4 手機內部面板 EMI 問題 44
5.5 電源信號常用EMI FILTER 元件如下: 46
5.6 元件應用的優點 47
5.7 ESD 防護應用元件及發展 47
5.8 元件高頻率波功能 48
5.9 ESD應用 49
5.10 ESD 問題解決案例 51
5.11 使用示波器做量測 52
5.12 静電放電 10000 次劣化测试 54
5.13 ESD接觸放電劣化测试 55
第6章 結論與產品未來方向 59
6.1 未來方向 62
參考文獻 64


圖目錄
圖 2 1 FCC 傳導型輻射射限制標準圖 5
圖 2 2 VDE 傳導型輻射射限制標準圖 5
圖 2 3 CISPR 22 傳導型輻射射限制標準圖 5
圖 2 4 傳導型輻射量測配置圖 6
圖 2 5 電源阻抗穩定網路的電路結構圖 7
圖 2 6 （a）電源阻抗穩定網路低頻等效電路 8
圖 2 7 電源阻抗穩定網路等效電路 10
圖 2 8 典型濾波器 11
圖 2 9 (a)濾波器共模等效電路 (b)濾波器差模等效電路 12
圖 2 10 馳反式轉換器 12
圖 2 11 差模訊號等效電路 13
圖 2 12 共模訊號等效電路 13
圖 3 1 靜電產生示意圖 15
圖 3 2 摩擦帶電示意圖 15
圖 3 3 感應帶電示意圖 16
圖 3 4 傳導帶電示意圖 16
圖 3 5 ESD 模擬產生器線路圖 19
圖 3 6 ESD 模擬產生器線路圖 20
圖 3 7 8/20us waveform current (A) 20
圖 3 8 10/1000us waveform current (A) 21
圖 3 9 ESD protection waveform current 21
圖 3 10 保護元件產品特性曲線 22
圖 3 11 ESD測試實驗室配置範例圖 24
圖 3 12 (a)曲線圖 26
圖 3 13 (b)曲線圖 27
圖 3 14 實驗示意圖 27
圖 3 15 Capacitance VS Frequency 29
圖 3 16 Insertion Loss VS Frequency 29
圖 3 17 Impedance VS Frequency 30
圖 3 18 插入損失特性比較曲線圖 30
圖 4 1 CMNDC 電路圖 35
圖 4 2 (a) 量測CMNDC 的方塊圖 (b) CMNDC 的效能圖 36
圖 4 3 差模檢知電路電路圖 37
圖 4 4 (a) 測差模檢知電路方塊圖 (b) 差模檢知電路效能圖 38
圖 4 5 EMI濾波器的架構圖 39
圖 4 6 繞線方式示意圖 39
圖 4 7 漏感量測示意圖 40
圖 4 8 量測示意圖1 40
圖 4 9量測示意圖2 41
圖 5 1 RF Matching circuit 44
圖 5 2 EMI Rejection circuit 45
圖 5 3 Conventional Analog 45
圖 5 4 Communication SMPS 46
圖 5 5 電源信號常用EMI Filter 元件 47
圖 5 6 Insertion Loss 48
圖 5 7 量測時配置圖 53
圖 5 8 V1劣化曲線圖 55
圖 5 9 V2劣化曲線圖 56
圖 5 10 α劣化曲線圖 56
圖 5 11 Ir劣化曲線圖 56
圖 5 12 V1曲線圖 57
圖 5 13 Ir曲線圖 57
圖 5 14 V2曲線圖 58
圖 5 15 α曲線圖 58
圖 5 16 Ir曲線圖 58




表目錄
表 2 1 FCC 傳導型輻射射限制標準 4
表 2 2 VDE 傳導型輻射限制標準 4
表 2 3 CISPR22 傳導型輻射限制標準 4
表 2 4電源阻抗穩定網路各元件的阻抗 8
表 3 1 IEC610000-4 Standard 23
表 3 2 IEC 與 MIL 的差異比較表 28

參考文獻
[1] .Mark. J. Nave, Power Line Filter Design for Switched-Mode Power Supplies, Van Nostrand Reinhold, New York, 1991.
[2] .Mark J. Nave, “A Novel Differential Mode Rejection Network for Conducted Emissions Diagnostics,” Proceedings of IEEE EMC., Denver, Co., 1989.
[3]. Ting Gou, Dan Y. Chen, and Fred C. Lee, “Separation of the Common-Mode- and Differential-Mode-Conducted EMI Noise, ”IEEE Trans. Power Electronics, Vol. 11, NO. 3, May 1996.
[4] .C.R. Paul and K.B. Hardin, Diagnosis and reduction of conducted noise emissions, IEEE trans. On Electromagnetic Compatibility, EMC-30, 553-560(1988)
[5].IEC 61000-4-5 , CNS14299, CNS14676-2
[6]. EN 61000-4-5
[7] .Fu-Yan Shih, Dan Y. Chen, Yan-Pei Wu, and Yie-Tone Chen, ”A Procedure for Designing EMI Filters for AC Line Applications ”, IEEE Trans. on Power Electrons, Vol. 11, NO.1, Jan. 1996.
[8]. Raul G. Munoz, Tai-Wu Hao, ”Simulation of Response of Modeled EMI Filter to Measured or Simulated Time Domain Waveforms ”, IEEE International Symposium on , 1995.
[9] .D. Pommerenke and M. Aidam, “To what extent do contact-mode and indirect ESD test methods reproduce reality?” EOS/ESD Symp. Proceedings, 1995.
[10]. D.D. Ward, “Electrostatic discharge,” IEE Seminar on EMC Design.
[11]. http://www.nani.com.tw/big5/content/2002--04/02/content-6362.htm
[12]. http://midwested.org/fundesd1.htm1
[13]. http://www.sfi.com.tw
[14]. R. Paul Clayton, “Introduction to electromagnetic compatibility,” John Wiley & Sons Inc., 1992, chapter 12.
[15]. V. Prasad Kodali, “Engineering electromagnetic compatibility,” 2nd edition, The Institute of Electrical and Electronics Engineers Inc., 2001, section 2.4 and 8.3.
[16]. ANSI/ESD S20.20-1999 standard.
[17]. IEC 61000-4-2, Electromagnetic Compatibility (EMC)– part 4-2 “Testing and measurement techniques- Electrostatic discharge immunity test,” edition 1.1, May 1999.

[18].IEEE Power Engineering Society, “IEEE standard electrostatic discharge tests for protective relays,” IEEE Std C37.90.3-2001, Oct. 2001.
[19]. K.Hilty, H. Ryser and U. Herrmann, “Calibration of electrostatic discharge generators and results of an international comparison,” IEEE Trans. Iinstru. and Mea.,
[20]. Tae-Weon Kang, Yeon-Choon Chung, Sung-Ho Won and Hyo-Tae Kim, “On the uncertainty in the current waveform measurement of an ESD generator,” IEEE Trans. Electronic Compact., vol. 42, no.4, Nov. 2000.
[21]. P. Leuchtmann and J. Sroka, “Transient field simulation of electrostatic discharge (ESD) in the calibration setup (ace.IEC 61000-4-2), ” IEEE Int. Symp. Electronic. Compcat., vol. 1, Aug. 2000.
[22]. J. Bendjamin, R. Thottappillil and V.Scuka,“Time varying electromagnetic fields generated by electrostatic discharges,” IEEE first Int. Symp. Poly. Electronic. Package. .
[23]. P. F. Wilson and M. T. Ma, “Fields radiated by electrostatic discharges,” IEEE Trans. Electronic. Compact. ,vol. 33, no.1, Feb. 1991.
[24]. M. Honda, “EMI power analysis of transient fields from fixed gap ESD,” IEEE Int. Conf. Indus. Appli. 37th IAS Annual Meeting, vol. 1, Oct.2002.
[25] M. Angeli and E. Cardelli, “Numericalmodeling of electromagnetic fields generated by electrostatic discharges,” IEEE Trans. Mag., vol. 33, no.2, Mar. 1997.
[26].傳導性ＥＭＩ量測系統的架構及原理，新電子科技雜.
[27]. i-Shang Huang and Tzong-Lin Wu, “Numerical and experimental investigation of noise coupling perturbed by ESD currents on printed circuit boards,” IEEE Int. Symp. Electromagn. Compat.