(3.236.118.225) 您好!臺灣時間:2021/05/16 13:08
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果

詳目顯示:::

我願授權國圖
: 
twitterline
研究生:廖渝珮
研究生(外文):Yu-Pei Liao
論文名稱:以穩健方法進行筆記型電腦CPU最大使用壽命之參數與公差設計
論文名稱(外文):Robust parameter and tolerance design for maximized NB CPU life via computer experiment and statistical optimization
指導教授:蔣安國蔣安國引用關係
指導教授(外文):Angus Jeang
學位類別:碩士
校院名稱:逢甲大學
系所名稱:工業工程與系統管理學研究所
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2009
畢業學年度:97
語文別:中文
論文頁數:46
中文關鍵詞:加速因子加速壽命試驗參數設計電腦輔助工程中央處理器統計最佳化反應曲面法公差設計
外文關鍵詞:Response Surface MethodologyTolerance DesignAccelerated Life TestingAccelerated FactorCentral Processing UnitComputer Aided EngineeringStatistical Optimization
相關次數:
  • 被引用被引用:3
  • 點閱點閱:160
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
此研究的主要目的,是期望設計人員能擺脫以經驗法則(Experience Rule)進行產品設計,而以統計(Statistics)為基礎的研究方法,作為產品設計決策依據的方法。強調在產品設計階段時應同時考慮製程參數,以參數設計配合BBD實驗矩陣的方式,將不同水準的實驗組合進行系統的模擬實驗。以筆記型電腦最大發熱源中央處理器(CPU, Central Processing Unit)的相關散熱組件尺寸作為反應值(Response),運用反應曲面法(Response Surface Methodology;RSM)建構出迴歸模式(Regression Model),並定義CPU壽命的最佳策略,期許在CPU壽命能達到最大化情況下,幫助決策者制訂出尺寸及公差最佳選用策略。
摘 要 I
ABSTRACT II
目 錄 II
圖目錄 II
表目錄 II
第一章 緒 論 1
1.1研究背景與目的 1
1.2文獻探討 4
1.3章節內容與研究架構 6
第二章 理論基礎及背景 8
2.1公差的定義 8
2.2製程變異與估計 9
2.3反應曲面法與Box-Behnken Design 10
2.4熱流理論 13
2.5產品壽命與加速試驗 2
2.6電腦熱流模擬 2
第三章 範例描述與模擬實驗 18
3.1範例描述 20
3.2實驗描述 22
第四章 實驗結果與討論 26
第五章 結論 34
參考文獻 36
附 錄 40
[1] Ngoi, B.K.A. and Ong, J.M., "A complete tolerance charting system in assembly", International Journal of Production Research, Vol.37, No.11, pp.2477-2498, 1999.
[2] 蔡彰文,"公差調合模式田口方法的應用",機械工業,No. 118, pp.186-198,1993.
[3] Madahav, S. Phadke, "Quality Engineering Using Robust Design", Prentice Hall, Englewood Cliffs, New Jersey, 1989.
[4] 蘇朝墩編著,"產品穩健數計",中華民國品質學會,台灣臺北,1997
[5] Montgomery 原著,黎正中譯,"實驗設計與分析",高立圖書出版有限公司,台灣臺北,1998.
[6] L. A. Brignoni and V. Garimella, “Experimental optimization of confined air jet impingement on a pin fin heat sink”, IEEEE Transactions on Components and Packaging Technology, vol. 22, pp. 399-404, 1999.
[7] H. A. El-Sheikh and V. Garimella, “Experimental air jet impinge mentheat transfer using pin-fin heat sinks”, IEEEE Transactions on Components and Packaging Technology, vol. 23, pp. 300-308, 2000.
[8] S.C. Morris, J.J. Good, J.F. Foss, “Velocity measurements in the wake of an automotive cooling fan”, Experimental Thermal and Fluid Science, n17, pp100-106, 1998.
[9] Mike Turner, and Comair Rotron “All You Need to Know About Fans”, Electronics Cooling, January, 2000.
[10] E. Dallago and G. Venchi, “Thermal Characterization of Compact Electronic Systems: A Portable PC as a Study Case ” , IEEE Transactions on Power Electronics, VOL. 17, NO. 2, pp.187-195, March 2002.
[11] 王美珍,產業報告:2005年連接企產業展望,金鼎投資雜誌月刊,台灣臺北,1994.
[12] INTEL “Intel Pentium 4 Processors 570, 560, 550, 540, and 520, Supporting Hyper-Threading Technology”.
[13] AMD “AMD Athlon XP Processor Model 10 Data Sheet” Publication #26237 Rev. C, May 2003.
[14] H. Xie, M. Aghazadeh, W. Lui, and K. Haley, “Thermal Solutions to Pentium Processors in TCP in Notebooks and Sub-notebooks”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 19, No1, pp.54-65, March, 1996.
[15] R. L. Liton, “CFD Model of Electronic Enclosures”, ASME Heat Transfer in Electronic Equipment, HTD - Vol. 171, pp. 95-100, 1991.
[16] R. L. Liton, and D. Agonafer, “Thermal Model of a PC”, ASME Journal of Electronic Packaging, Vol. 116, pp. 134-137, 1994.
[17] T. Y. Lee, and M. Mahalingam, “Application of a CFD Tool for System-Level Thermal Simulation”, IEEE Transations on Components, Packaging, and Manufacturing Technology-Part A, Vol. 17, No. 4, pp. 564-571, 1994.
[18] D. Lober, “Optimizing the Integration of a Electronics System into an Exiting Enclosure Using CFD Modeling Techniques”, Proceedings of ISPS, January, 1999.
[19] Jeang, A., "Optimal Process Parameter Determination for Computer-Aided Manufacturing", Quality and Reliability Engineering International, Vol.15, pp.3-16, 1999.
[20] Jeang, A., "Computer-Aided Tolerance Synthesis with Statistical Method and Optimization Techniques", Quality and Reliability Engineering International, No.17, pp.131-139, 2001.
[21] R. Bris,” Bayes approach in RDT using accelerated and long-term life data”, Reliability Engineering and System Safety, Vol. 67, pp. 9–16, 2000.
[22] Wei Li, and Rong-Chang Feng,”Highly Accelerated Life Test for the Reliability Assessment of the Lead-Free SMT Mainboard”, Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International, pp.1-4, 2006.
[23] 曾政鴻、金安兒,"利用反應曲面法對紅藻膠高壓凝膠作用的探討",中國農業化學會誌,Vol. 32,No. 5,pp.543-552,1994.
[24] 金安兒、陳建富,"利用反應曲面法探討Curdlan及糯玉米澱粉的添加對嫩豆腐冷凍乾燥適性之影響",中國農業化學會誌,Vol. 37,No. 3,pp.390-402,1999.
[25] Jeang, A., "Optimal Tolerance Design by Response Surface Methodology", International Journal of Production Research, Vol.37, No.14, pp.3275-3288, 1999.
[26] Jeang, A., "Robust Tolerance Design by Response Surface Methodology", International Journal of Advanced Manufacturing Technology, Vol.15, No.6, pp.399-403, 1999.
[27] Jiunn-Yann Tsai, Kevin X. Zhang, and Carton M. Osburn, "Optimization of Lightly-Doped-Drain(LDD) Structure for Sub-Quarter-μm Devices Using Statistic Design and Response Surface Methodology", International Symposium on VLSI Technology, Systems, and Applications, pp.285-290, 1995.
[28] Jeang, A., "Robust Tolerance Design by Response Surface Methodology", International Journal of Advanced Manufacturing Technology, Vol.15, No.6, pp.399-403 , 1999.
[29] 李永晃、梁有燈、蔡志弘,"考慮重工與不良率遞�隊宏s程公差設計",機械工業,No. 188,pp.221-233,1998.
[30] Wu, Chin-Chung, Chen, Zhuoning and Tang, Geo-Ry, "Component Tolerance Design for Minimum Quality Loss and Manufacturing Cost ", Computers in Industry, Vol.35, No.3, pp.223-232, 1998.
[31] 鄭春生著,"品質管理",育友圖書股份有限公司,台灣台北,1997.
[32] Juran, J. M., Quality Control Handbook, 3rd edition, McGraw-Hill, New York, 1974.
[33] Vasseur, H., Kurfess, T.R. and Cagan, J., "Use of a Quality Loss Function to Select Statistical Tolerances", Journal of Manufacturing Science and Engineering, Transactions of the ASME, Vol.119, No.3, pp.410-416, 1997.
[34] Box, G.E. and Draper, N. R., "Empirical Model Building and Response Surface", John Wiley and Sons, New York, 1997.
[35] Khuri, A.J. and Cornell, J.A., "Response Surface : Design and Analysis", Marcel Dekker, New York, 1996.
[36] Montgomery 原著,黎正中譯,“實驗設計與分析�苤A高立圖書出版有限公司,台灣台北,1998.
[37] Myers, R.H. and Montyomery, D. C., "Response Surface Methodology, Process and Product Optimization Using Designed Experiments", John Wiley and Sons, New York, 1995.
[38] Douglas C. Montgomery, "Design and Analysis of Experiment", 5th. Edition, John Wiley and Sons, New York, 2001.
[39] 柯煇耀編著,"可靠度保證-工程與管理技術之應用",中華民國品質學會,台灣臺北,1997.
[40] S. S. Rao, Reliability-Based Design, McGraw-Hill, New York, 2002
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top