微機電系統（Micro Electro Mechanical Systems, MEMS）是近年來高科技發展最蓬勃的技術之一，藉由成熟的半導體技術與精密加工的整合，開發出微小之感測與致動元件，或是具有系統化整合的微型晶片。其中微電鑄技術已廣泛的應用在MEMS元件的製程及IC構裝上，但在電鑄時，因受限於結構與化學特性，大面積或是晶圓級的電鑄製程往往會造成厚度不均勻的結果，進而影響到後續微結構的一致性以及封裝的良率。因此本研究主要針對微電鍍時，由於不同大小深寬比的結構，電流聚集效應造成電力線分佈不均，而在電鍍後會造成厚度高低差的結果，並對此進行分析，以探討影響電力線分佈不均的主要因素。實驗方面，主要的技術是利用微機電製程技術的方式，搭配黃光微影製程於矽晶圓表面製作出光阻膜仁孔洞，再利用電鍍製程完成電鍍鎳結構，而驗證方面採用表面輪廓儀與光學表面干涉儀進行量測，以觀察孔洞大小在電鍍後所造成的高低差結果，最後並利用逆電流法，改善電流分佈不均所影響平坦度的問題，並做數據量化的探討。

關鍵字 : 微機電系統、微電鍍、負載效應

Micro Electro Mechanical Systems is one of the most development systems in recent years. With a mature semiconductor technology can be developed many micro-actuators and sensors The technology of micro-electroplating has wildly used in MEMS and IC packaging. Because of the structure and the chemical properties, the large area and wafer level often caused by uneven thickness on electroplating. It could influence on the unity of the structure and the yield rate after packaging. In this research, we investigate the effect of the current distribution in different size of cavities by using electroplating. The microstructure cavities made of positive photoresists by microlithography process and use alpha-step to measure the thickness after electroplating.

Keywords: MEMS, electroplating, loading effect

誌謝 ii
中文摘要 iii
Abstract iv
目錄 v
圖目錄 vii
表目錄 ix
第一章 緒論 1
1.1 前言 1
1.2研究背景與動機 4
1.3 文獻回顧 6
第二章 微電鍍原理 12
2.1 電鑄與電鍍之差異 12
2.2 微電鍍理論 13
2.2.1 濕潤效應 17
2.2.2 極化作用 19
2.2.3 質傳模式 19
第三章 微電鍍製程架構 21
3.1 微電鍍孔洞之流程 21
3.2 光罩設計 22
3.3 黃光微影製程 24
3.4電鍍製程 27
第四章 實驗結果與討論 33
4.1 光阻膜仁製作 33
4.2 電鍍鎳結構 35
4.3 數據量測 37
4.3.1 電鍍量測 37
4.3.2 解離量測 41
第五章 結論 46
5.1 結論 46
5.2 後續研究 47

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