微機電元件中，微懸板結構常由雙層材料所組成。由於在鍍膜時，常由數百度的高溫，冷卻至室溫，因材料熱膨脹係數不同，將使
結構受殘餘熱應力影響而發生材料的挫曲，使其結構產生所謂的翹折現象。
本文探討雙層結構之微懸板在不同的尺寸與溫度下，對結構受熱
應力變形的影響。使用有限分析軟體ANSYS 分析不同尺寸以及製程
溫度不同對雙層結構之微懸板變形的影響。製程上，本文是以面型微細加工技術製作出不同尺寸的雙層結構之微懸板。在製程溫度變化下，觀看其釋放犧牲層後的翹曲變型量大小，並計算殘餘應力大小。
製作結果發現經由退火製程後的雙層材料之微懸板無任何翹曲變
化，因此也發現殘留應力趨近於極小值。而由模擬和實驗量測分析結果發現微懸板長度及寬度並不影響到殘留應力大小，但製程溫度參數卻是影響殘留應力的因素。

In MEMS, micro cantilever plates are often made of double layers.
During thermal treatment of micro fabrication process with temperature of hundreds degrees, residual stress would be induced after cooling to room temperature. It is for mismatching of thermal expansion coefficients between the metal layer and the structure layer as depositing metal on the structure. Therefore, the cantilever structure will be deformed. The structure layer would even be bent into undesired buckling conditions. It is called the warpage phenomena.
In this study, the finite element software, ANSYS, was employed to investigate the effects of various design parameters on the performance of cantilever plate with double layer. And the cantilever plate with double
layers was fabricated by surface micromachining process. Under different temperature of depositing process, after release as the sacrificial layer
removing, warpage can be observed. And residual stress can be calculated from deformation of the cantilever plate with double layers. From experimental results, it is also found a very small residual stresses exists after the annealing process.
The results of the simulation analysis and experimental
measurements show that length and width of micro plates have no significant effect on the residual stresses. However, temperature of fabrication process is the most important factor of affecting residual stress.

目錄
誌謝………………………………………………………………………i
中文摘要…………………………………………………………………ii
英文摘要…………………………………………………………...……iii
目錄………………………………………………………………...……iv
圖目錄…………………………………………………………….……viii
表目錄………………………………………………………………..…xii
第一章 緒論……………………………………………………..………1
1.1 前言………………………………………….…………………1
1.2 研究動機與目的……………………………….………………2
1.3 文獻回顧………………………………………….……………2
1.4 研究方法………………………………………….……………6
1.5 章節提要………………………………………….……………6
第二章 理論基礎…………………………………………………..……8
2.1 雙層材料之微懸板結構設計與翹曲原理…………….………8
2.2 基本理論基礎……………………………………….…………9
2.2.1 統御方程式……………………………………....….……9
2.2.2 邊界條件……………………………..……..………...…14
2.2.3 熱應力場分析理論……………………..…..……...……17
2.3 矩形平板…………………………………………….…..……18
2.3.1單邊固定部份………………………..………...…………18
2.4 薄膜殘留應力量測理論………………….………….…….…22
2.4.1 曲率法求殘留應力………………………….......………22
第三章 雙層材料微懸板之分析模型………………..…………..……24
3.1 分析模型基本假設…………………………….……..………25
3.2 ANSYS 有限元素分析軟體之分析流程……………..........…25
3.3 結構模型熱應力分析………………………….………..……26
3.3.1 前處理……………………………………....…...………27
3.3.2 製程模擬分析…………………………..…..…...………32
3.3.3 求解……………………………………..…..…...………32
3.3.4 後處理………………………………………...…………33
第四章 雙層微懸板之製作與結果……………………………………35
4.1 面型微細加工技術……………………………...……………35
4.1.1 懸浮結構之吸附效應………………..…..…..…….……35
4.1.2 薄膜材料殘留應力…………………..…..…..…….……37
4.1.3 薄膜殘留應力之產生原因…………..…..…..…….……38
4.2 製程步驟………………………………………...……………40
4.3 製程結果……………………………………...………………46
4.3.1 薄膜製程…………………………………....…...………46
4.3.1.1 第一道爐管濕氧化沉積…………….………46
4.3.1.2 第二道爐管多晶矽沉積…………….………47
4.3.1.3 第三道濺鍍系統鋁沉積………..…...………48
4.3.2 微影製程………………………………..……...…..……49
4.3.3 乾式蝕刻製程………………………..……….....………52
4.3.4 濕式蝕刻製程……………………..…………….………55
4.3.4.1 犧牲層蝕刻………………………..…...……55
4.3.4.2 金屬層蝕刻………………………….………56
4.3.5 微懸板高溫退火製程………………..……….....………56
第五章 結果與討論……………………………………………………58
5.1 製程問題與解決辦法……………………………..….………58
5.1.1 微影製程問題………………………...……..…..………58
5.1.2 濕式蝕刻製程問題………………...……………………59
5.1.3 乾式蝕刻製程問題………………..………..…...………60
5.2 二氧化矽先後吃問題…………………………………...……61
5.2.1 AZ5214來阻擋………………………..……..…...………61
5.2.2 AZ4620來阻擋………………………..……….....………62
5.2.3 二氧化矽先釋放……………………..……...…..………62
5.3 薄膜殘留應力分析………………………………...…………64
5.3.1 薄膜殘留應力量測……………………….....…..………64
5.4 微懸板量測與分析比較…………………………...…………64
5.4.1 改變長度不同對雙層微懸板之影響………….......……65
5.4.2 改變濺鍍鋁溫度不同對雙層微懸板之影響………...…68
5.4.3 有無退火對雙層微懸板之影響……………….......……72
第六章結論與未來研究方向………………………………………..…74
6.1 結論………………………………………………….…..……74
6.2 未來研究方向……………………………………….…..……74
參考文獻……………………………………………………..…………76

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