臺灣博碩士論文加值系統

由於近年來各種電子產品之微小化，使得電子電路在佈局上更為緊密，而積體電路之發展朝向奈米製程且高操作頻率的發展，以系統的角度而言相對的產生了更為複雜的電磁環境，在PCB的佈局上，各種元件及走線更為靠近的情況下，許多耐受性較低的元件容易因此受到干擾使系統性能下降，嚴重時產生誤動作，為了達到電磁相容(Electromagnetic Compatibility)之目的，設計電子電路之前必須優先考慮積體電路之電磁干擾(Electromagnetic interferences)。
本論文利用電磁模擬軟體建立積體電路之輻射模型，觀測其輻射情況，並針對標準IEC 61967-2橫向電磁波室(TEM cell method)量測法及IEC 61967-3表面掃描法(Surface scan method)，利用三顆相同裸晶以LQFP之封裝技術，做些微之修改製作測試板量測及分析其雜訊之電磁輻射，並且針對最大雜訊之頻率做近場之表面掃瞄，確定其最大雜訊輻射之方向及區域。

In recent years, due to the miniaturization of electronic products, the layout of electronic circuit has to be designed more and more tightly, and the Integrated Circuit manufacturing technology has been developing toward nm Process with higher operation frequency. From the viewpoint of the system, a more complex electromagnetic environment is so generated. As the components and wirings are positioned closer on the PCB layout, many extremely susceptible components may decrease the performance of the system or even cause errors when the interferences are very acute.
Therefore, in order to achieve the Electromagnetic Compatibility, EMI in the Integrated Circuit should be taken account first when designing the electronic circuit. In this paper, by using the simulation electromagnetic software to build the models of the radiations, the characteristics of the radiations in the Integrated Circuit were observed. According to the standard IEC 61967-2 (TEM cell method) and IEC 61967-3(Surface scan method), three same dies packed by LQFP technology with some minor modifications were used to make the testing board for measuring and analyzing the interferences of the electromagnetic radiations and for doing the surface scan on the near filed of the frequency of the acutest interference to find out the direction and the location of the radiation of the acutest interference.

中文摘要 …………………………………………………………………….…i
Abstract ……………………………………………………………….…….....ii
致謝…………………………………………………………………………….iv
目錄 …………………………………………………………………………...v
圖目錄 .…………………………………………………………....…….…...viii
表目錄 …………………………………………………...………………..….xv
第一章 緒論……………………………………………………………………1
1.1 前言………………………………………………………………….…1
1.2研究動機及方法……………………………………………………...…3
1.3論文架構……………………………………………………………...…4
第二章 電磁干擾雜訊成因與傳播基本原理…………………………………5
2.1 同步切換雜訊(SSN-Simultaneous switching noise)…………………5
2.2串音(crosstalk)………………………………………………………….8
2.2.1電場耦合………………………………………………………………8
2.2.2磁場耦合………………………………………………………………9
2.3 電磁場傳播模態……...………………………………………………10
2.2.1 TEM波………………………………………………………………13
2.2.2 TM波…………………………………………………………...……15
2.4平行導電板波導……………………………………………………….18
2.4.1 TEM波………………………………………………………..……..18
2.4.2 TM波…………………………………………………….…………..20
2.4.3 TE波………………………………………………………..………..22
2.5電磁輻射原理……………………………………………………….…24
2.5.1電偶極…………………………………………………………..……24
2.5.2電流迴圈………………………………………………………..……25
第三章 TEM量測法……………………………………………………….…27
3.1橫向電磁波室簡介……………………………………………….……27
3.2橫向電磁波室之設計與量測原理……………………………….……29
3.3 橫向電磁波室特性之校正……………………………...……………32
3.4測試板之設計製作………………………………………………….…36
3.5 IC雜訊量測之數據比較分析…………………………………...……40
第四章 表面掃描法………………………………………………………..…58
4.1表面掃描法及設備簡介………………………………………….……58
4.2探棒設計與量測原理…………………………………………….……61
4.3探棒之校正……………………………………………………….……63
4.4 IC雜訊量測之數據比較分析……………………………………...…68
第五章 IC輻射模型之建立……………………………………………….…80
5.1 IC封裝之簡介……………………………………………………...…80
5.2 LQFP之IC封裝模型…………………………………………………82
5.3 IC雜訊抑制對策………………………………………………...……96
第六章 結論……………………………………………………………..……99
參考文獻……………………………………………………………………100

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[2] Sonia Ben Dhia , Mohamed Ramdani and Etienne Sicard, “Electromagnetic Compatibility of Integrated Circuits Techniques for low emission and susceptibility” , Chapter 3, Chapter 4, Chapter 5, Springer, 2006.
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[5] IEC 61967-2,Integrated circuits-Measurement of electromagnetic emissions, 150 kHz to 1 GHz-Part 2：TEM cell and wideband TEM cell method.
[6] IEC 62132-2 “Integrated circuits-Measurement of electromagnetic immunity, 150 kHz to 1 GHz, Part 2：TEM cell and wideband TEM cell method.
[7] IEC 62132-3 “Integrated circuits-Measurement of electromagnetic emissions, 150 kHz to 1 GHz, Part 3: Measurement of radiated emissions - surface scan method”, June 2005.
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