近幾年來3C產業迅速發展，手機、MP3與筆記型電腦等3C產品對聲音品質也越來越重視，這些產品均廣泛使用電容式麥克風，它有著成本低、尺寸小、重量低等等優點。將麥克風組裝至裝置內，常因為不良的設計造成麥克風靈敏度在某些頻率被過度放大造成聲音失真，過去常常利用詴誤法解決問題，本論文分別利用等效電路法與微拉力實驗機，將電容式麥克風和麥克風振膜機械性質參數化，可迅速找出問題所在並迅速解決問題。
本論文另一部份在研究建築音學，研究吸音材料特性，進而用來調整室內聲場；研究隔音材料和隔音結構，進而用來模擬如何有效地隔絕噪音穿透，打造優良的聆聽環境。

摘要 .................................................................................................... i
Abstract ................................................................................................... ii
目錄 .................................................................................................. iii
圖目錄 .................................................................................................. vi
表目錄 .................................................................................................. ix
第一章 緒論............................................................................................... 1
1-1 前言 ............................................................................................. 1
1-2 研究動機 ..................................................................................... 2
1-3 文獻回顧 ..................................................................................... 3
1-4 內容簡介 ..................................................................................... 5
第二章 電容式麥克風之應用理論 .......................................................... 7
2-1 電路類比 ..................................................................................... 8
2-2 力學元件電路類比 ..................................................................... 9
2-3 聲學元件電路類比 ................................................................... 10
2-4毛細管聲阻抗 ............................................................................ 12
2-5 聲輻射阻抗 ............................................................................... 12
第三章 電容式麥克風之分析與應用 .................................................... 14
3-1 麥克風機械與聲學參數量測 ................................................... 15
3-1.1 振膜機械參數測量 ...................................................... 15
3-1.2 麥克風聲學參數測量 .................................................. 18
3.2 電容式麥克風等效電路 ........................................................... 20
3-3 電容式麥克風分析 ................................................................... 26
3-3-1 改變Ring的厚度 ........................................................ 26
3-3-2 改變振膜厚度 .............................................................. 27
3-3-3 改變air gap的高度 .................................................. 28
3-3-4 改變極板厚度 .............................................................. 29
3-3-5 改變holder的厚度 .................................................... 30
3-3-5改變cover開口的直徑 ............................................... 31
3-4 增加前空腔或後空腔 ............................................................... 37
3-5 改變導音管口徑大小 ............................................................... 37
3-6 增加導音管長度 ....................................................................... 38
第四章 聲學材料 .................................................................................... 40
4-1 聲阻抗 ....................................................................................... 40
4-2 吸音隔音原理 ........................................................................... 42
4-3 吸音材料入射角與吸音係數關係 ........................................... 43
4-4 薄層材料吸音 ........................................................................... 46
4-5 微穿孔吸聲體 ........................................................................... 48
4-6 雙層微穿孔吸聲體 ................................................................... 49
4-7 多孔性吸聲材料 ....................................................................... 50
第五章 音場分析與模擬 ........................................................................ 52
5-1 房間模態 ................................................................................... 52
5-2 改變邊界條件對室內音場之影響 ........................................... 55
5-2-1 改變地面邊界條件 ...................................................... 56
5-2-2改變兩側牆壁邊界條件 ............................................... 58
5-2-3 改變天花板 .................................................................. 60
5-3 隔音分析 ................................................................................... 62
5-3-1 實心牆壁之穿透損失 .................................................. 63
5-3-2 牆壁為木板並貼上吸音材 .......................................... 64
第六章 總結與展望 ................................................................................ 68
6-1 總結 ........................................................................................... 68
6-2 未來展望 ................................................................................... 69
參考文獻 .................................................................................................. 70

[1] L. L. Beranek, "Acoustics", 1993 ed. (American Institute of Physics for the Acoustical Society of America, 1993, pp. 47-90).
[2] H. C. Her, T. L. Wu, and J. H. Huang, “Acoustic Analysis and Fabrication of Microelectromechanical System Capacitive Microphones”, J. of Appl. Phy., vol. 104, 084509, (2008 Oct.).
[3] H. Tobushi, H. Hara, E. Yamaday and S. Hayashi, “Thermomechanical Properties in a Thin Film of Shape Memory Polymer of Polyurethane Series”, Smart Mat. and Struct., vol. 5, no. 4, pp. 483-491, (1996 May).
[4] W. N. Sharpe, Jr., B. Yuan, and R. L. Edwards, “A New Technique for Measuring the Mechanical Properties of Thin Films”, J. of Micro. Sys., vol. 6, no. 3, pp. 193-199, (1997 Sep.).
[5] X. Li, B. Bhushan, “Continuous Stiffness Measurement and Creep Behavior of Composite Magnetic Tapes”, Thin Solid Films, vol. 377-378, pp. 401-406, (2000 Dec.).
[6] M. A. Haque, and M. T. A. Saif, “Mechanical Behavior of 30-50 nm Thick Aluminum Films under Uniaxial Tension”, Scripta Materialia, vol. 47, issue 12, pp. 863-867, (2002 Oct.).
[7] H. S. Khoo, K. K. Liu and F. G. Tseng, “Characterization of the Mechanical Properties of Microscale Elastomeric Membranes”, Meas. Sc. and Tech., vol. 16, no. 3, pp. 653-658, (2005 Jan.).
[8] M. V. Soestbergen, L. J. Ernst, K. M. B. Jansen, W. D. V. Driel, M. Bartek and A. Polyakov, “Measuring In-Thickness Mechanical Properties of Sub Micron Polymer Dielectric Films”, 7th Int. Conf. on Ther., Mech. and Multiphy. Simu. and Expts. in Micro-Electronics and Micro-Systems, EuroSimE 2006, pp. 1-5, Como, Italy, (2006 April).
[9] C. Seguineau, M. Ignat, C. Malhaire, S. Brinda, X. Lafontan, J. M. Desmarres, C. Josserond, and L. Debove, “Micro-Tensile Tests on Micromachined Metal on Polymer Specimen: Elasticity, Plasticity and Rupture”, Dans Sympo. on Des., Test, Inte. and Pack. of MEMS/MOEMS, DTIP 2008, Grenoble, France, (2008 April).
[10] 馬大猷著,“現代聲學理論基礎“,科學出版社,2004年3月
[11] 盛美萍、王敏慶、孫進才著, “噪聲與振動控制技術基礎“,科學出版社,2001年8月
[12] 陳啟中著, “建築物理概論“,詹氏書局,2000年4月
[13] 江哲銘著, “建築物理“,三民出版社,1997年9月
[7] H. S. Khoo, K. K. Liu and F. G. Tseng, “Characterization of the Mechanical Properties of Microscale Elastomeric Membranes”, Meas. Sc. and Tech., vol. 16, no. 3, pp. 653-658, (2005 Jan.).
[8] M. V. Soestbergen, L. J. Ernst, K. M. B. Jansen, W. D. V. Driel, M. Bartek and A. Polyakov, “Measuring In-Thickness Mechanical Properties of Sub Micron Polymer Dielectric Films”, 7th Int. Conf. on Ther., Mech. and Multiphy. Simu. and Expts. in Micro-Electronics and Micro-Systems, EuroSimE 2006, pp. 1-5, Como, Italy, (2006 April).
[9] C. Seguineau, M. Ignat, C. Malhaire, S. Brinda, X. Lafontan, J. M. Desmarres, C. Josserond, and L. Debove, “Micro-Tensile Tests on Micromachined Metal on Polymer Specimen: Elasticity, Plasticity and Rupture”, Dans Sympo. on Des., Test, Inte. and Pack. of MEMS/MOEMS, DTIP 2008, Grenoble, France, (2008 April).
[10] 馬大猷著,“現代聲學理論基礎“,科學出版社,2004年3月
[11] 盛美萍、王敏慶、孫進才著, “噪聲與振動控制技術基礎“,科學出版社,2001年8月
[12] 陳啟中著, “建築物理概論“,詹氏書局,2000年4月
[13] 江哲銘著, “建築物理“,三民出版社,1997年9月